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United States Patent | 6,266,470 |
Kang ,   et al. | July 24, 2001 |
An optical switch module for aligning and fixing an optical fiber array relative to an optical switch device includes an optical fiber support member for fixing the optical fiber array; a first support device forming a homo-junction with the optical fiber support member and including a first thermal deformation buffer device; and a second support device forming a hetero-junction with the first support device to support the first support device and including a second thermal deformation buffer device.
Inventors: | Kang; Seung Goo (Daejeon, KR); Song; Min Kyu (Daejeon, KR); Lee; Hee Tae (Daejeon, KR); Lee; Sang Hwan (Daejeon, KR); Hwang; Nam (Daejeon, KR); Park; Seong Su (Daejeon, KR) |
Assignee: | Electronics and Telecommunications Research Institute (Daejeon, KR); Korea Telecom (Sungnam-si, KR) |
Appl. No.: | 167537 |
Filed: | October 7, 1998 |
Nov 21, 1997[KR] | 97-61818 |
Current U.S. Class: | 385/137; 385/88; 385/94; 385/136 |
Intern'l Class: | G02B 006/00 |
Field of Search: | 385/4-14,88,89,90,91,92,93,94,136,137,147 219/121.64,121.85 372/21-23,43,45,38 357/38 |
4838639 | Jun., 1989 | Morankar et al. | 385/88. |
5136353 | Aug., 1992 | Pankove et al. | 357/38. |
5247530 | Sep., 1993 | Shigeno et al. | |
5619609 | Apr., 1997 | Pan et al. | 385/136. |
5930430 | Jul., 1999 | Pan et al. | 385/94. |
Min Kyu Song et al., "Laser Weldability Analysis of High-Speed Optical Transmission Device Packaging", IEEE Transactions on Components, Packaging, and Manufacturing Technology-Part B. vol. 19, No. 4, Nov. 1996. |