Back to EveryPatent.com
United States Patent |
6,254,215
|
Hiroki
,   et al.
|
July 3, 2001
|
Ink jet printing head and method for producing the same
Abstract
An ink jet printing head in which nozzles and a liquid chamber are formed
by adhering a first substrate on which plural walls are formed and a
second substrate in mutually opposed manner. The plural walls formed on
the first substrate and to be adhered to the second substrate are arranged
by the combination of walls of a substantially same width, and the walls
are provided with an adhesive layer on the adhering faces thereof and
integrally adhered to the second substrate.
Inventors:
|
Hiroki; Tomoyuki (Zama, JP);
Ito; Miki (Yokohama, JP);
Kashino; Toshio (Chigasaki, JP)
|
Assignee:
|
Canon Kabushiki Kaisha (Tokyo, JP)
|
Appl. No.:
|
344113 |
Filed:
|
June 24, 1999 |
Foreign Application Priority Data
| Jun 26, 1998[JP] | 10-180969 |
| Jun 21, 1999[JP] | 11-174423 |
Current U.S. Class: |
347/20; 347/63 |
Intern'l Class: |
B41J 002/015; B41J 002/05 |
Field of Search: |
347/20,63,65,67,40
|
References Cited
U.S. Patent Documents
4698645 | Oct., 1987 | Inamoto | 347/65.
|
4994825 | Feb., 1991 | Saito et al. | 347/65.
|
5017947 | May., 1991 | Masuda | 347/65.
|
5096535 | Mar., 1992 | Hawkins et al. | 156/633.
|
5132707 | Jul., 1992 | O'Neill | 347/65.
|
5208604 | May., 1993 | Watanabe et al. | 347/47.
|
5389957 | Feb., 1995 | Kimura et al. | 347/20.
|
5748213 | May., 1998 | Karita et al. | 347/63.
|
5826333 | Oct., 1998 | Iketani et al. | 29/890.
|
5933163 | May., 1999 | Koizumi et al. | 347/52.
|
Foreign Patent Documents |
60-206657 | Oct., 1985 | JP.
| |
02187351 | Jul., 1990 | JP.
| |
95/04658 | Feb., 1995 | WO.
| |
Primary Examiner: Barlow; John
Assistant Examiner: Stephens; Juanita
Attorney, Agent or Firm: Fitzpatrick, Cella, Harper & Scinto
Claims
What is claimed is:
1. An ink jet printing head comprising:
a plurality of nozzles; and
a liquid chamber,
wherein said nozzles and said liquid chamber are formed by adhering a first
substrate on which a plurality of walls are formed to a second substrate
in mutually opposed manner; and
wherein the plural walls of said first substrate are successively arranged,
and each of the walls has a substantially same width, over an area outside
of an area in which are located said nozzles and said liquid chamber.
2. An ink jet printing head according to claim 1, wherein said second
substrate is provided on the adhering face thereof with plural walls in
positions corresponding to the plural walls provided on said first
substrate.
3. An ink jet printing head according to claim 2, wherein the walls
provided on each of said first and second substrates have a lattice
pattern.
4. An ink jet printing head according to claim 3, wherein said lattice
pattern is a staggered grid pattern.
5. An ink jet printing head according to claim 3, wherein said lattice
pattern is a honeycomb pattern.
6. An ink jet printing head according to claim 1, wherein said first
substrate is a top plate having a plurality of grooves therein and said
second substrate is a heater board having a plurality of heaters.
7. An ink jet printing head according to claim 6, wherein said top plate is
made from a silicon wafer having a <110> plane on its surface.
8. An ink jet printing head according to claim 7, wherein an adhesion
surface of said top plate and said heater board is simultaneously
processed by anisotropic etching.
9. An ink jet printing head according to claim 7, wherein an adhesion
surface of said top plate and said heater board is simultaneously
processed by plasma etching.
10. An ink jet printing head according to claim 1, wherein said first
substrate is a heater board having a plurality of heaters for heating ink
according to image data and said second substrate is a top plate.
11. An ink jet printing head according to claim 1, wherein the walls are
arranged in a lattice pattern.
12. An ink jet printing head according to claim 11, wherein said lattice
pattern is a staggered grid pattern.
13.An ink jet printing head according to claim 11, wherein said lattice
pattern is a honeycomb pattern.
14. A method for producing an ink jet printing head according to claim 1,
comprising a step of processing the adhesion surface of said first
substrate and said second substrate by anisotropic etching.
15. A method according to claim 14, wherein said first substrate is a top
plate having a plurality of grooves and said second substrate is a heater
board having a plurality of heaters.
16. A method according to claim 15, further comprising the step of applying
a solution of an adhesive material so that said top plate and said heater
board are mutually adhered.
17. A method for producing an ink jet printing head according to claim 1,
comprising a step of processing an adhesion surface of said first
substrate and said second substrate by plasma etching.
18. A method according to claim 17, wherein said first substrate is a top
plate having a plurality of grooves and said second substrate is a heater
board having a plurality of heaters.
19. A method according to claim 18, further comprising the step of applying
a solution of an adhesive material so that said top plate and said heater
board are mutually adhered.
20. An ink jet printing head comprising:
a heater board having a plurality of heaters for heating an ink according
to image data;
a wall portion constituting a plurality of lateral walls defining a
plurality of nozzles for discharging said ink, the lateral walls also
defining a liquid chamber communicating with the nozzles, and some of the
lateral walls constituting a peripheral area of the liquid chamber; and
a top plate covering an upper surface of said nozzles and said liquid
chamber;
wherein said head is constituted by mutually connecting said heater board,
said wall portion and said top plate, and
wherein those said lateral walls constituting said peripheral area of the
liquid chamber are constituted by successively arranging the walls over a
whole area out of an area to define said nozzles and said liquid chamber,
and have an area arranged in a substantially lattice pattern relative to a
connecting plane, an adhesive laver being formed on an adhering face of
said walls.
21. An ink jet printing head according to claim 20, wherein a width of the
lateral walls of said liquid chamber and a width of the lateral walls in
the peripheral area of said liquid chamber is between 0.2-1.8 times the
width of the lateral walls of said nozzles.
22. An ink jet printing head according to claim 21, wherein said width of
the lateral walls of the liquid chamber and the lateral walls in the
peripheral area is between 0.6 to 1.4 times the width of the lateral walls
of said nozzles.
23. An ink jet printing head according to claim 20, wherein said wall
portion is formed on said top plate, and an adhesive layer is formed on
said wall portion on an adhesion surface thereof with said heater board
and is adhered to said heater board.
24. An ink jet printing head according to claim 23, wherein said top plate
is a silicon wafer having a <110> plane on its surface, and the lateral
walls of said nozzles, those of said liquid chamber and those in the
peripheral area of said liquid chamber are simultaneously processed by
anisotropic etching.
25. An ink jet printing head according to claim 23, wherein said top plate
is a silicon wafer having a <110> plane on its surface, and the lateral
walls of said nozzles, those of said liquid chamber and those in the
peripheral area of said liquid chamber are simultaneously processed by
plasma etching.
26. An ink jet printing head according to claim 20, wherein said wall
portion is formed on said heater board, and an adhesive layer is formed on
said wall portion on an adhesion surface thereof with said top plate and
is adhered to said top plate.
27. A method for producing an ink jet printing head having a heater board
having a plurality of heaters for heating an ink according to image data,
a wall portion constituting a plurality of lateral walls defining a
plurality of nozzles for discharging said ink, the lateral walls also
defining a liquid chamber communicating with the nozzles, and some of the
lateral walls constituting a peripheral area of the liquid chamber, and a
top plate covering an upper surface of said nozzles and said liquid
chamber, wherein said head is constituted by mutually connecting said
heater board, said wall portion and said top plate, comprising the steps
of:
forming an adhesive layer on said wall portion on an adhesion surface
thereof with said heater board;
connecting said adhesive layer with said heater board; and
simultaneously forming the lateral walls of said nozzles, those of said
liquid chamber and those in the peripheral area of said liquid chamber by
anisotropic etching relative to said top plate,
wherein said top plate is a silicon wafer having a <110> plane on its
surface, and
wherein a lateral wall of said peripheral area of the liquid chamber is
arranged by a succession of plural walls to a whole area out of an area to
be said nozzles and the liquid chamber.
28. A method for producing an ink jet printing head having a heater board
having a plurality of heaters for heating an ink according to image data,
a wall portion constituting a plurality of lateral walls defining a
plurality of nozzles for discharging said ink, the lateral walls also
defining a liquid chamber communicating with the nozzles, and some of the
lateral walls constituting a peripheral area of the liquid chamber; and a
top plate covering an upper surface of said nozzles and said liquid
chamber, wherein said head is constituted by mutually connecting said
heater board, said wall portion and said top plate, comprising the steps
of:
forming an adhesive layer on said wall portion on an adhesion surface
thereof with said heater board;
connecting said adhesive layer with said heater board; and
simultaneously forming the lateral walls of said nozzles, those of said
liquid chamber and those in the peripheral area of said liquid chamber by
plasma etching relative to said top plate,
wherein said top plate is a silicon wafer having a <110> plane on its
surface, and
wherein a lateral wall of said peripheral area of the liquid chamber is
arranged by a succession of plural walls to a whole area out of an area to
be said nozzles and the liquid chamber.
Description
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to an ink jet printing head adapted for use
in an ink jet printer and a method for producing the same, and more
particularly to an ink jet printing head in which, in forming nozzles and
liquid chamber, the frame of the liquid chamber is constituted by the
combination of walls having a width substantially equal to that of the
nozzle wall, thereby improving adhesion of a heater board and a top plate
and also improving the stability of manufacture, and a method for
producing such ink jet printing head.
2. Related Background Art
For use in the ink jet printing head there have been proposed nozzles of
various shapes, one of which will be explained with reference to FIG. 6.
Referring to FIG. 6, a top plate 101 is formed from a silicon wafer which
is cut and polished in such a manner that the upper face is constituted by
the (110) crystalline plane. There are also shown a penetrating hole 102
constituting a liquid chamber or an ink reservoir, and a groove 103 for an
ink discharging nozzle.
A silicon chip 108 is provided with a plurality of heat generating members
(heaters) 109 and will be hereinafter called a heater board. The top plate
101 and the heater board 108 are adhered in a direction shown in FIG. 6 to
form oblong nozzles between nozzles 103 and the surface of the heater
board 108. In such adhering operation, the positions of both components
are precisely adjusted in such a manner that a heater 109 is contained in
each nozzle. Ink is supplied from an unrepresented ink tank, then guided
to an ink liquid chamber 102 and reaches the interior of the nozzles 103.
The heater board 108 is controlled by an unrepresented control circuit and
each heater 109 is energized according to the print data. The
above-mentioned control circuit may be provided on the heater board or
formed on another substrate, and will not be explained further as it is
not related to the principle of the present invention.
The heater 109 energized according to the print data generates heat,
thereby heating the ink in the corresponding nozzle. The heated ink boils
above a certain critical temperature, thus generating a bubble. The
generated bubble grows within a short time of several microseconds and
gives an impact force to the ink, whereby a part of the ink is strongly
pushed out and lands on a printing medium such as paper. A printed image
is obtained by repeating this process.
In the following there will be explained the method of producing the top
plate, with reference to FIGS. 7A to 7H. In these drawings, the views at
the right-hand side are those of the top plate 101 seen from the lower
side (nozzle side) while those at the left-hand side are cross-sectional
views of the top plate cut along a plane in the discharging direction.
FIG. 7A illustrates a silicon wafer. FIG. 7B shows the formation of an
oxide film. FIG. 7C shows patterning of SiO.sub.2. FIG. 7D shows formation
of a SiN film. FIG. 7E shows the patterning of SiN. FIG. 7F shows
anisotropic etching of Si, wherein a numeral 102 indicates a liquid
chamber. FIG. 7G shows elimination of SiN. FIG. 7H shows anisotropic
etching of Si, wherein a numeral 103 indicates a nozzle.
FIG. 7A shows a silicon (Si) wafer 105 used as the material for forming the
nozzle members, having a crystalline orientation <110> on the surface and
<111> in the longitudinal direction of the nozzle. Both sides of the
silicon wafer 105 are subjected to the formation of a thin silicon dioxide
film 106 of a thickness of about 1 .mu.m as shown in FIG. 7B, by thermal
oxidation or CVD (chemical vapor deposition). The silicon dioxide layer
106 serves as a mask layer in anisotropic etching of silicon. Then, with
the ordinary photolithographic process, the silicon dioxide layer 106 is
patterned into the shape of nozzles and liquid chamber on one side (lower
face in the illustration) and into the shape of the liquid chamber on the
other side (FIG. 7C). Then, on the nozzle forming side, a silicon nitride
layer 107 is formed for example by CVD (FIG. 7D) and is patterned into the
shape of the liquid chamber (FIG. 7E).
The wafer is then subjected to anisotropic wet etching by immersion in
etching liquid such as 22% solution of TMAH (tetramethylammonium hydride)
whereby the etching proceeds in exposed areas of silicon on both sides of
the wafer, namely according to the shape of the liquid chamber and the
etched portions from both sides are eventually connected to form
penetrating holes. Then the silicon nitride layer on the nozzle face is
eliminated by etching (FIG. 7G) to expose the nozzle pattern formed in the
silicon dioxide layer 106 in the step shown in FIG. 7C, and anisotropic
etching is executed again with TMAH whereby a portion corresponding to the
nozzle is etched. In this operation, the liquid chamber etched in the step
shown in FIG. 7F is also further etched, but the shape of the liquid
chamber is little affected because the etching time for the nozzle is
shorter than that for the liquid chamber. Otherwise it is also possible to
shorten the etching time for the liquid chamber in consideration of the
etching time required for nozzle etching, thereby eventually obtaining the
liquid chamber of the desired shape.
However, with the anisotropic etching of the present invention, there can
be obtained a nozzle with a rectangular cross section because the <111>
plane perpendicular to the wafer surface is present in the ink discharging
direction, but, in the longitudinal direction of the nozzle, there is no
crystalline plane capable of stopping the etching, so that the wall
between the nozzles is overetched in the longitudinal direction to form an
acute angle shape. Consequently, in such overetched portion, there
inevitably remains the thin silicon dioxide film constituting the mask
layer. Such silicon dioxide film alone is removed, without damaging
silicon, by blowing pressurized air, eventually containing water, to the
wafer. For removing the film of about 1 .mu.m by blowing water with
pressurized air, there is only required a pressure of 1 to 20
kgf/cm.sup.2. Otherwise the entire silicon dioxide film may be removed by
wet etching employing the mixture of ammonium fluoride and hydrofluoric
acid.
The top plate 108 prepared by the above-described process is shown in FIG.
8. In the patterning process for forming the liquid chamber, the both
surfaces of the top plate chip are formed in similar shapes, but the
pattern at the ink supply side, at the upper surface in FIG. 6, may be
made smaller at such a level that the penetrating hole is formed by
anisotropic etching. In fact a pattern smaller than at the nozzle side is
preferred in order to ensure the connection with the unrepresented ink
supply member or the strength of the wafer in forming the top plate.
As explained in the foregoing, anisotropic etching of silicon can be
utilized in forming the structure of the top plate, providing high mass
producibility since the top plate can be prepared in the state of a wafer.
Also the nozzle preparation by photolithographic technology allows to
obtain nozzles of a high density with a high precision.
However, the conventional method of preparing the top plate has been
associated with the following drawbacks because the nozzle walls and the
liquid chamber frames are significantly different in width.
In forming the nozzles by adhering the top plate, principally comprising of
silicon, with the heater board, the adhesion is most simply achieved by
spraying an adhesive material. This is achieved by spraying, on the
surface of the top plate, mist of a resinous adhesive material adjusted in
viscosity with diluting liquid and mixed with compressed air. The adhesive
comprises a material of high chemical resistance such as polyether amide
resin (for example HIMAL supplied by Hitachi Chemical Co.), and is to form
a protective film on the inner wall of the nozzle simultaneously with the
coating of the adhesive material on the bottom faces of the nozzle walls
of the top plate.
However, with the progress of the ink jet printer toward the higher image
quality with a nozzle density of 360 dpi or higher, the width of the
nozzle wall becomes as small as 40 .mu.m or even smaller, and, for a
nozzle density of 600 dpi, the width of the nozzle wall becomes as small
as 10 .mu.m, which is much smaller than the wall width of the liquid
chamber frame. If the adhesive material is spray coated as explained above
in such structure, the coated thickness of the adhesive material may
fluctuate as shown in FIG. 9, depending on the width of the lateral walls
constituting the nozzle and that of the lateral walls constituting the
liquid chamber. More specifically the thickness d1 of the adhesive
material on the nozzle walls becomes smaller than the thickness d2 of the
adhesive on the liquid chamber walls because the latter is larger. For
example, in case of coating the adhesive material with a thickness of 10
.mu.m on the liquid chamber frame of the larger width, the adhesive can
only be coated with a thickness of 2 to 5 .mu.m on the nozzle wall of a
width of 10 .mu.m though this value depends to a certain extent on the
viscosity of the adhesive. Also if the thickness of the adhesive is
reduced, matching the width of the nozzle wall, the thickness becomes
relatively difficult to control and may show fluctuation.
Such fluctuation in the coating thickness of the adhesive results in a
fluctuation in the overflowing amount at the adhesion of the substrate.
FIG. 12A schematically shows the state of adhesion in case the wall width
fluctuates. Since the frame wall of the liquid chamber 2 is wider than the
nozzle wall 104, a larger amount of the adhesive 110 overflows into the
nozzle 103 at the adhering operation. Such overflowing adhesive 110
deforms the shape inside the nozzle 103, thereby deteriorating the ink
flow therein or the ink discharging direction therefrom and, if the
adhesive sticks on the heat generating member, the heat generating state
for ink discharge may be varied to disable the desired ink discharge.
On the other hand, such fluctuation in the thickness of the adhesive may
result in insufficient adhesion on the lateral walls of the nozzle in
adhering the top plate and the heater board. Such insufficient adhesion
may lead to a crosstalk between the nozzles at the ink discharge or color
mixing between the liquid chamber of different colors in case of a color
printing head.
For adhering the substrate, the Japanese Patent Application Laid-open No.
60-206657 discloses a technology of forming the nozzle walls and the
liquid chamber walls with photosensitive resin on the heater board and
adhering the top plate thereon. In order to prevent formation of a closed
space at the adhering face between the top plate and the wall, the wall is
so formed as to form a space open to the exterior.
In such configuration, however, since the top plate is coated on its entire
surface with the adhesive material and is then adhered onto the walls, the
surface of the adhesive is exposed in a part of the nozzle. The surface of
the adhesive material is difficult to control and may deform the
cross-sectional shape of each nozzle, thus eventually affecting the ink
flow therein.
SUMMARY OF THE INVENTION
In consideration of the foregoing, the object of the present invention is
to solve the above-described drawbacks.
The above-mentioned object can be attained, according to the present
invention, by an ink jet printing head in which nozzles and liquid chamber
are formed by adhering a first substrate bearing plural walls and a second
substrate in mutually opposed manner:
wherein the plural walls of the first substrate, adhered to the second
substrate, are arranged by a combination of walls of a substantially same
width, and an adhesive layer is provided on the adhesion face of the walls
and is integrally adhered to the second substrate.
According to the present invention there is also provided an ink jet
printing head comprising a heater board provided with plural heaters for
heating ink according to image data, a wall portion constituting lateral
walls for defining nozzles for discharging the ink and also constituting
lateral walls for defining liquid chamber communicating with the nozzles
and lateral walls in a peripheral area of the liquid chamber, and a top
plate for covering the upper face of the nozzles and the liquid chamber
and constituted by connecting the heater board, the wall portion and the
top plate:
wherein the lateral walls constituting the peripheral area of the liquid
chamber has an area arranged in a substantially grid pattern with respect
to the connecting face.
Furthermore, according to the present invention there is also provided an
ink jet printing head comprising a heater board provided with plural
heaters for heating ink according to image data, a wall portion
constituting lateral walls for defining nozzles for discharging the ink
and also constituting lateral walls for defining liquid chamber
communicating with the nozzles and lateral walls in a peripheral area of
the liquid chamber, and a top plate for covering the upper face of the
nozzles and the liquid chamber and constituted by connecting the heater
board, the wall portion and the top plate:
wherein the top plate comprises a silicon wafer having a <110> plane on the
surface, and the lateral walls defining the nozzles, those defining the
liquid chamber and those of the peripheral area are simultaneously
processed by anisotropic etching with respect to the top plate.
Furthermore, according to the present invention there is also provided a
method for producing an ink jet printing head including a heater board
provided with plural heaters for heating ink according to image data, a
wall portion constituting lateral walls for defining nozzles for
discharging the ink and also constituting lateral walls for defining
liquid chamber communicating with the nozzles and lateral walls in a
peripheral area of the liquid chamber, and a top plate for covering the
upper face of the nozzles and the liquid chamber and constituted by
connecting the heater board, the wall portion and the top plate:
wherein the top plate is composed of a silicon wafer having a <110> plane
on the surface, and the method comprises a step of simultaneously
processing the lateral walls defining the nozzles, those defining the
liquid chamber and those of the peripheral area by anisotropic etching
with respect to the top plate.
In the head of the present invention, as shown in FIG. 12B, in the adhering
portion between the top plate 22 and the heater board 21, the walls are
formed with a substantially same width and a space is formed between the
walls, so that the coated amount of the adhesive 110 on the adhering face
becomes uniform over the entire area. Moreover, the overflowing adhesive
110 has an escaping space and uneven overflowing of the adhesive can be
avoided.
Also the walls around the liquid chamber are formed in a grid pattern to
increase the positions of adhesion to the substrate, thereby improving the
reliability of adhesion.
Furthermore, at the crossing point of the grid pattern, the adhesive can
escape in plural directions so that the overflowing amount of the adhesive
can be reduced.
Consequently there can be achieved satisfactory adhesion between the top
plate and the heater board, little crosstalk between the nozzles at the
ink discharge, and no color mixing between the liquid chambers of
different colors in case of a color printing head.
The above-described configuration allows to realize a thermal ink jet
printing head with a low cost and high stability of manufacture.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a plan view of a top plate constituting a first embodiment of the
present invention;
FIG. 2 is a magnified view of liquid chamber frames of the top plate of the
first embodiment of the present invention;
FIG. 3 is a view showing a mask pattern realizing the first embodiment of
the present invention;
FIG. 4 is a plan view showing liquid chamber frames in a second embodiment
of the present invention;
FIG. 5 is a plan view showing liquid chamber frames in a third embodiment
of the present invention;
FIG. 6 is a perspective view showing the adhesion state of the top plate
and the heater board;
FIGS. 7A, 7B, 7C, 7D, 7E, 7F, 7G and 7H are views showing steps of
preparing the top plate;
FIG. 8 is a cross-sectional view of a top plate;
FIG. 9 is a view showing a conventional top plate in a state coated with
adhesive material;
FIG. 10 is a plan view showing liquid chamber frames in a fourth embodiment
of the present invention;
FIG. 11 is a perspective view showing a 5th embodiment of the present
invention;
FIG. 12A is a schematic view showing the overflowing state of adhesive
material; and FIG. 12B is a schematic view showing the state of the
adhesive material in a configuration of the present invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[First Embodiment]
In the following there will be explained an embodiment of the present
invention with reference to the attached drawings.
FIG. 1 is a schematic view showing a top plate constituting a first
embodiment of the present invention, seen from the side of the adhesion
face, and FIG. 2 is a partial magnified view of the liquid chamber frames
represented by II in FIG. 1.
As shown in these drawings, a first correction pattern 1 is provided with
nozzle walls 104 and liquid chamber frame walls 2 formed therearound in
order to constitute a liquid chamber 102, and the liquid chamber frame
walls have a honeycomb structure having liquid chamber frame apertures 3
and constituted by the combination of the liquid chamber frame walls 2 of
a width substantially equal to that of the nozzle walls 104.
The present embodiment provides a head of 360 dpi formed by the nozzle
walls 104 of a width of 25 .mu.m. In case the adhesive has a viscosity of
30 cps, an increase in the wall width by 5 .mu.m causes an increase in the
coated film thickness by 1 .mu.m. Consequently the width of the liquid
chamber frame wall is selected as 35 .mu.m or less, in order that the
difference in the coated thickness does not exceed 2 .mu.m.
There is employed polyether amide adhesive HIMAL of high chemical
resistance (manufactured by Hitachi Chemical Co.). As the fluctuation in
the coated thickness of the adhesive is maintained at 2 .mu.m or less, the
top plate could be adhered on the entire area to the heater board by
applying a pressure of 300 g/mm.sup.2 for 1 hour at 250.degree. C. after
mutual alignment.
The pattern of the liquid chamber frames of the present invention can be
simultaneously formed with the patterning of the nozzle walls, so that the
top plate stable for adhesion can be obtained without an increase in the
manufacturing cost, in comparison with the conventional process for
producing the top plate shown in FIGS. 7A to 7H.
In the liquid chamber frame pattern of the present embodiment, the nozzle
walls and the liquid chamber walls are simultaneously formed by
anisotropic etching as explained in the foregoing, so that, among the
liquid chamber frames, the walls along the direction of the nozzles are
formed parallel to the nozzles. Also the walls transversal to the nozzles
are not at an angle of 90.degree. but at 71.degree. and 55.degree.
thereto.
As the anisotropic etching utilizes the lower etching rate of the <111>
plane, the obtained shape depends strongly on the direction of the <111>
plane, and the above-mentioned angles 71.degree. and 55.degree. are
determined from the crystalline planes of silicon. Consequently the mask 4
for patterning the liquid chamber frames may have apertures along the
crystalline direction of the <111> plane, but the liquid chamber frames
may also be formed by utilizing mask apertures consisting of an array of
rectangles as shown in FIG. 3 and executing overetching until the etching
is stopped by the <111> plane as indicated by a numeral 5 in FIG. 3.
In the top plate of the present embodiment, as explained in the foregoing,
the liquid chamber frames are patterned by anisotropic etching
simultaneously with the formation of the nozzle walls and the wall width
of the liquid chamber frames is selected not exceeding the nozzle wall
width +10 .mu.m, so that it is rendered possible to coat the adhesive
material with a uniform thickness and to suppress the overflowing of the
adhesive material at the adhesion under pressure, without complicating the
process for producing the top plate. Consequently there can be obtained a
top plate showing satisfactory adhesion to the heater board and excellent
in the stability of manufacture.
Also the honeycomb-shaped pattern are expected to improve the strength of
the walls and to stabilize the adhesion state with the heater board, since
the crossing points of the walls are not positioned in line but are
distributed in well-balanced manner. Furthermore, as the adhesion material
spreads in three directions at the crossing point, it is possible to
satisfactorily spread the adhesive material and to suppress the
overflowing thereof into the liquid chamber or into the nozzles.
The effect of the present invention can still be attained in case the
difference in the width between the liquid chamber frames and the nozzle
walls is selected as not exceeding 20 .mu.m, depending on the coating
condition of the adhesive material and the adhering condition with the
heater board, but a difference not exceeding 10 .mu.m is preferred in
consideration of the ease of manufacture. More specifically, with respect
to the width of the nozzle walls, the width of the walls of the liquid
chamber frames is preferably within a range of 0.2 to 1.8 times, more
preferably within a range of 0.6 to 1.4 times.
The top plate of the present invention is not limited to the configuration
shown in FIG. 6, and the present invention is also effective, for example,
in case valves are provided on the heater board in order to improve the
efficiency of ink discharge. In the present invention, since the nozzle
walls are vertical, they do not hinder the function of the valves and a
faster operation can be realized.
[Second Embodiment]
In the following there will be explained a second embodiment of the nozzle
member of the present invention, with reference to FIG. 4. This embodiment
is different from the first embodiment in that an area not having
penetrating holes to the liquid chamber along the nozzle direction is
given, instead of the honeycomb-shaped pattern, a second correction
pattern 6, consisting of an oblong stripe pattern connected to the front
and rear sides of the top plate.
Such configuration is effective in case the coated state of the adhesive
material may become uneven because, when the nozzles are formed by
anisotropic etching, the walls transveral to the nozzles become zigzag
shaped and are therefore not equivalent to the walls along the nozzles and
because such zigzag-shaped walls are not perpendicular to the surface as
the <111> plane is not perpendicular thereto. More specifically, at both
ends of the top plate or in a frame portion separating the liquid chambers
of different colors, there may be assumed the second correction pattern 6
having the oblong walls along the nozzles, thereby realizing walls
identical with the nozzle walls and obtaining uniform coating condition
for the adhesive material. It is also possible to form the walls along the
nozzle direction behind the liquid chamber and, if the coating of the
adhesive material becomes uneven, to add liquid adhesive after the
adhesion of the top plate and the heater board thereby forming a
completely closed structure.
[Third Embodiment]
A third embodiment of the nozzle member of the present invention will be
explained with reference to FIG. 5. In this embodiment, the nozzles are
formed by dry etching instead of anisotropic wet etching of silicon. In
this case, a film of a metal such as aluminum is formed and patterned
prior to the formation of the silicon nitride film in a step shown in FIG.
7D, and, in a step shown in FIG. 7H, silicon is deep etched for example by
ion-coupled plasma etching, utilizing thus obtained metal mask, instead of
the anisotropic etching. In this process, the etching can be achieved
according to the mask pattern, without overetching along the crystalline
plane as in the case of anisotropic etching, so that there can be obtained
a third correction pattern 7 consisting of liquid chamber frames of a
simple grid pattern as shown in FIG. 5. Therefore the top plate intended
in the present invention can be obtained by simultaneous formation of the
nozzles and the walls of the grid pattern of a width substantially same as
that of the nozzle walls.
[Fourth Embodiment]
A fourth embodiment of the nozzle member of the present invention will be
explained with reference to FIG. 10.
A fourth correction pattern 8 of the present embodiment is different from
the third embodiment in that the grid rectangles are arranged in staggered
manner.
For increasing the adhesion strength, it is important to increase the
adhesion area and, therefore, to arrange a larger number of walls in a
grid pattern. By arranging such grid patterns in a staggered manner, it is
possible to increase the structural strength of the walls. Also, as every
lattice point consists of three walls, the flow of the adhesive material
after adhesion becomes uniform. The staggered grid wall arrangement of the
present embodiment is advantageous for improving the adhesion strength and
structural strength, obtaining uniform flow of the adhesive material and
suppressing the overflow of the adhesive material into the nozzles and the
liquid chamber.
[Fifth Embodiment]
A fifth embodiment of the nozzle member of the present invention will be
explained with reference to FIG. 11.
The present embodiment is different from the first, second, third or forth
embodiment in that the nozzle walls 104 and the liquid chamber frame walls
2 are formed on the heater board 21.
The nozzles are formed by adhering the heater board 21 and the top plate
22, but it is difficult to coat the adhesive material with a uniform
thickness on the top plate because of the large surface area thereof.
For this reason it is necessary to apply the adhesive material on the
heater board, but the deposition of the adhesive onto the heat generating
members has to be avoided, so that the transfer method is considered
effective. However, also in case of the transfer method, the transferred
amount onto the walls fluctuates depending on the wall width, as in the
case of spray coating.
However, based on the configuration defined in the present invention, the
transferred amount becomes uniform since the adhesion parts between the
top plate and the heater board are constituted by the combination of walls
of a substantially same width.
Also because a space is present between the walls, it is rendered possible
to prevent uneven overflowing of the adhesive material at the adhering
operation, thereby suppressing the detrimental influence in the nozzles
103 and the liquid chamber 102.
In this manner, the present invention is also effective in case the walls
are formed on the heater board.
The walls formed on the heater board may have any of the configurations
shown in the first to fourth embodiments, but the staggered grid wall
pattern disclosed in the fourth embodiment is preferred in consideration
of the ease and stability of manufacture and suppression of adhesive
overflowing.
In the foregoing embodiments, the walls are formed in one substrate only
and are adhered to the other planar substrate, but it is naturally
possible also to form walls of mutually matching forms on the adhesion
faces of both substrates and to mutually adhere such substrates. Also in
such case, the adhesion can be achieved by applying the adhesive material
on the walls of either substrate.
According to the present invention, as explained in the foregoing, in
preparing the top plate of the ink jet printing head with silicon, the
liquid chamber frames are constituted by walls of a width similar to that
of the nozzle walls and are simultaneously formed with such nozzle walls,
thereby providing the printing head showing satisfactory adhesion between
the top plate and the heater board and excellent in stability of
manufacture, without complicating the process for producing the top plate.
Top