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United States Patent | 6,238,938 |
Smith | May 29, 2001 |
A method of making a microelectronic assembly includes providing a first element and a second element with confronting, spaced-apart interior surfaces defining a space therebetween and contacts on the interior surfaces and masses of an electrically conductive material having a melting temperature below about 125.degree. C. in the space so that each mass is disposed between a contact on the first element and a contact on the second element and so that the masses electrically connect the contacts to one another. A flowable liquid material is then introduced around the masses and between the confronting surfaces, and the liquid material is then cured to form a compliant dielectric layer disposed between the confronting surfaces and intimately surrounding each mass.
Inventors: | Smith; John W. (Palo Alto, CA) |
Assignee: | Tessera, Inc. (San Jose, CA) |
Appl. No.: | 305028 |
Filed: | May 4, 1999 |
Current U.S. Class: | 438/10; 257/E21.503; 257/E23.01; 257/E23.021; 257/E23.069; 257/E23.19; 438/15; 438/106 |
Intern'l Class: | H01L 021/00; H01L 021/66; H01L 021/44; H01L 021/48; H01L 021/50; G01R 031/26 |
Field of Search: | 438/10,15,106 |
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COMPOSITION 1 COMPOSITION 2 ELEMENT WEIGHT % WEIGHT % Sn 18.5 10.5 Bi 45 40 Pb 24 21.5 In 10 20 Cd 9.5 8 Melting 55.degree. C. 50.degree. C. Temperature