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United States Patent |
6,238,100
|
Sasaki
,   et al.
|
May 29, 2001
|
Optical module and a method for fabricating a same
Abstract
A semiconductor optical amplifier is mounted on a substrate which is
provided for a package. Fiber blocks in which plural parallel internal
optical fibers are supported are fitted to the package. The optical fibers
are optically coupled with the semiconductor optical amplifier via optical
waveguides formed on the substrate. V grooves for supporting the optical
fibers which protrude out from the fiber block are formed on the
substrate. Positionings of the optical fibers are performed by fitting the
fiber blocks to the package so that end faces of the optical fibers butt
against end walls of the V grooves.
Inventors:
|
Sasaki; Junichi (Tokyo, JP);
Kato; Tomoaki (Tokyo, JP);
Itoh; Masataka (Tokyo, JP)
|
Assignee:
|
NEC Corporation (Tokyo, JP)
|
Appl. No.:
|
421041 |
Filed:
|
October 20, 1999 |
Foreign Application Priority Data
| Oct 21, 1998[JP] | 10-300086 |
Current U.S. Class: |
385/59; 385/89 |
Intern'l Class: |
G02B 006/38; G02B 006/36 |
Field of Search: |
385/59,89,88-94,76
|
References Cited
U.S. Patent Documents
5499311 | Mar., 1996 | DeCusatis | 385/89.
|
5500914 | Mar., 1996 | Foley et al. | 385/77.
|
5640477 | Jun., 1997 | Anderson | 385/89.
|
5796896 | Aug., 1998 | Lee | 385/59.
|
5818990 | Oct., 1998 | Steijer et al. | 385/49.
|
5978531 | Nov., 1999 | Funabashi | 385/45.
|
Other References
Takaya, et al., "An easily-assembled optical device for coupling
single-mode planar waveguides to a fiber array", Technical Digest
Integrated Photonics Research, IWH2, 1996.
|
Primary Examiner: Kim; Robert H.
Assistant Examiner: Stafira; Michael P.
Attorney, Agent or Firm: McGinn & Gibb, PLLC
Claims
What is claimed is:
1. An optical module detachably connectable to an external optical fiber
connector supporting a plurality of external optical fibers, comprising:
a substrate on which an optical device is mounted;
a basic member on which said substrate is mounted;
a block detachably fitted to said basic member at a side end thereof, said
block containing a first predetermined length of a plurality of internal
optical fibers such that a second predetermined length of a first end of
said internal optical fiber protrudes from a first end face of said block
to interface optically with said optical device and a second end of said
internal optical fibers is exposed at a second end face of said block to
interface optically with said external optical fibers; and
a plurality of V grooves, each said V groove having an end wall designed to
allow said first end of said internal optical fiber to abut said end wall,
on said substrate supporting said first ends of said internal optical
fibers protruding from said block.
2. The optical module defined in claim 1, further comprising:
a plurality of guide holes formed on said second end face of said block,
said guide holes interfacing to a corresponding plurality of guide pins of
said external optical fiber connector, such that an optical axis of each
said internal optical fiber on said second end face of said block aligns
with an optical axis of a corresponding external optical fiber on said
external optical fiber connector.
3. The optical module defined in claim 1, wherein said optical module is
mounted on said substrate via a plurality of bumps, each said bump having
a predetermined volume.
4. An optical module to be connected with and removed from an optical fiber
connector supporting plural parallel optical fibers, comprising:
a substrate on which an optical device is mounted;
a basic member on which said substrate is mounted;
a block which fits to said basic member at a side end thereof, said block
projecting at a first end face a plurality of parallel optical fibers to
be connected with said optical device and supports remainders of said
optical fibers so that end faces of said remainders are exposed at a
second end face of said block; and
a plurality of parallel V grooves having end walls formed on said
substrate, each said V groove supporting one of said optical fibers
projected from said block, wherein a lateral pitch of said V grooves are a
same as that of said optical fibers, and wherein:
said optical device comprises a semiconductor optical amplifier,
said blocks are respectively fitted to said basic member at both side ends
thereof,
said V grooves are formed on both sides of said semiconductor optical
amplifier, and
a plurality of parallel optical waveguides are formed on intermediate
regions on said substrate lying between leading ends of said optical
fibers and said semiconductor optical amplifier.
5. The optical module defined in claim 1, further comprising an optical
mode field converter integrated on each of said plurality of internal
optical fibers.
6. The optical module defined in claim 1, further comprising a grating on
each of said plurality of internal optical fibers.
7. The optical module defined in claim 1, wherein one or more of said
internal optical fibers are divided inside of said block, and an optical
isolator is inserted into said divided optical fibers.
8. The optical module defined in claim 1, wherein one or more of said
internal optical fibers are divided inside of said block, and an optical
wavelength filter is inserted into said divided optical fibers.
9. A method for fabricating an optical module to be connected with and
removed from an external optical fiber connector supporting plural
parallel external optical fibers, comprising:
forming a block for supporting a plurality of internal parallel optical
fibers so that a first terminal end of said internal optical fibers
protrudes a first predetermined distance from a first end face of said
block and an opposite terminal end of said internal optical fibers are
exposed at a second end face of said block,
forming plural parallel V grooves having end walls and a same lateral pitch
as that of said optical fibers on a substrate so that said projected
optical fibers are supported by said V grooves,
mounting said substrate having said optical device mounted thereon on a
basic member, and,
fitting said block to said basic member at a side end thereof such that
said optical fibers are inserted into said V grooves and abut said end
walls of said V grooves.
10. The method for fabricating an optical module defined in claim 9,
further comprising:
forming guide holes fitting to guide holes of said external optical fiber
connector on said second face of said block so that an optical axis of
each of said internal optical fibers respectively coincides with an
optical axis of said external optical fibers.
11. The method for fabricating an optical module defined in claim 9,
wherein forming said block further comprises: forming said block by an
integral molding using said internal optical fibers as inserts.
12. The method for fabricating an optical module defined in claim 9,
wherein said mounting said optical devices on said substrate further
comprises:
forming solder bumps on solder-wettable pads previously formed on said
substrate;
setting on said solder bumps the said optical device, and said optical
device further having a bottom surface on which joining pads are
previously formed; and
melting said solder bumps.
13. A method for fabricating an optical module defined in claim 12, wherein
said forming of said solder bumps further comprises:
setting a solder sheet having a predetermined thickness on said
solder-wettable pads;
forming solder bumps by punching said solder sheet; and
thermally pressing said punched solder bumps against said solder-wettable
pads.
14. The method for fabricating an optical module defined in claim 9,
wherein said V grooves are formed by photolithography.
15. The method for fabricating an optical module defined in claim 9,
wherein said forming of said block further comprises:
previously integrating an optical mode field converter on a long optical
fiber, and
providing plural short optical fibers to be supported by said block by
dividing said long optical fiber on which said optical mode field
converter has been integrated.
16. The method for fabricating an optical module defined in claim 9,
wherein said forming of said block further comprises:
previously forming gratings on a long optical fiber at a predetermined
interval; and
providing plural short optical fibers to be supported by said block by
dividing said long optical fiber on which said gratings have been formed.
17. The method for fabricating an optical module defined in claim 9,
further comprising:
dividing said optical fibers within said block; and
inserting an optical isolator into said divided optical fibers.
18. The method for fabricating an optical module defined in claim 9,
further comprising:
dividing said optical fibers within said block; and
inserting an optical wavelength filter into said divided optical fibers.
19. A method for fabricating an optical module to be connected with and
removed from an external optical fiber connector supporting plural
parallel external optical fibers, comprising:
forming a block for supporting plural parallel internal optical fibers so
that said block projects a first section of said internal optical fibers
at a first end face of said block and exposes end faces of a remaining
section of said internal optical fibers at a second end face of said
block;
forming plural parallel V grooves having end walls and a same lateral pitch
as that of said optical fibers on a substrate so that said projected
optical fibers are supported in said V grooves,
mounting said substrate having said optical device mounted thereon on a
basic member; and
fitting said block to said basic member at a side end thereof such that
said optical fibers are inserted into said V grooves and abut said end
walls of said V grooves, wherein:
two blocks are formed in said step of forming said block,
two groups of said V grooves are formed in said forming of said V grooves,
said two groups of said V grooves being respectively formed near both side
ends of said substrate,
two groups of plural parallel optical waveguides are formed on said
substrate, said two groups of said optical waveguides respectively
starting from leading ends of said two groups of said V grooves, and
said two blocks are respectively fitted to said basic member at both said
side ends thereof in said fitting.
20. An optical module detachably connectable to at least one external
optical fiber, comprising:
a substrate on which an optical device is mounted;
a basic member on which said substrate is mounted; and
at least one block detachably fitted to said basic member at a side end
thereof, said block containing a first predetermined length of at least
one internal optical fiber such that a second predetermined length of said
at least one internal optical fiber protrudes from a first end face of
said block to connect optically with said optical device and an opposite
end of said at least one internal optical fiber is exposed at a second end
face of said block to connect optically with said at least one external
optical fiber, and such that said substrate contains a groove having an
end wall for each of said at least one internal optical fiber to support
said protruded section of said at least one internal optical fiber, said
end wall for permitting abutment of the end face of said at least one
internal optical fiber.
21. The optical module defined in claim 20, further comprising:
an optical waveguide formed on said substrate for each of said at least one
internal optical fiber, such that said optical waveguide provides optical
coupling between said internal optical fiber and said optical device.
22. An optical module detachably connectable to at least one external
optical fiber, comprising:
a substrate on which an optical device is mounted;
a basic member on which said substrate is mounted;
at least one block detachably fitted to said basic member at a side end
thereof, said block containing a first predetermined length of at least
one internal optical fiber such that a second predetermined length of said
at least one internal optical fiber protrudes from a first end face of
said block to connect optically with said optical device and an opposite
end of said at least one internal optical fiber is exposed at a second end
face of said block to connect optically with said at least one external
optical fiber, and such that said substrate contains at least one groove
to support said protruded section of said at least one internal optical
fiber; and,
an optical waveguide formed on said substrate for each of said at least one
internal optical fiber, such that said optical waveguide provides optical
coupling between said internal optical fiber and said optical device.
23. The optical module defined in claim 22, wherein each said groove on
said substrate further comprises an end wall for permitting abutment of
the end face of said at least one internal optical fiber.
Description
FIELD OF THE INVENTION
The invention relates to an optical module to be connected with an optical
fiber connector used in an optical communication and a method for
fabricating the same.
BACKGROUND OF THE INVENTION
In an optical transmission apparatus which is provided with a great number
of laser diode, photo-detector or semiconductor optical amplifier array
modules and transmits or receives optical signals via optical fiber
arrays, disposal of excess pigtails of optical modules mounted on a board
is important. Especially, in the transmission apparatus for processing the
high bit rate optical signals of several Gb/s, it is necessary to control
the lengths of the optical fibers in the order of cm. Two ways can be
devised for controlling the lengths of the optical fibers. In the first
way, the lengths of the respective pigtails are separately controlled
internally in the optical module. In the second way, an optical fiber
connector supporting the external optical fibers, the lengths of which are
respectively controlled, is fabricated, and the optical module is
connected with and removed from the aforementioned optical fiber
connector. In the second way, the lengths of the optical fibers can be
more easily controlled than in the first way, and the space on the board
can be saved.
On the optical module to be connected with the optical fiber connector
designed for a multi-mode optical fiber array in which tolerance limits of
misalignments of optical axes of the optical fibers are comparatively
loose, many developments of optical parallel interconnection modules have
been reported. However, with the further expansion of the transmission
capacity and the extension of the transmission distance expected in
future, the realization of the optical module to be connected with the
single mode optical fibers is expected.
Moreover, in order to realize miniaturization of the optical module having
the function of an optical switching and a wavelength selecting in the
multi-channel optical transmission system, a hybrid integrated structure
in which an optical device is integrated with an optical waveguide device,
such as a planar optical circuit, is desired. In the aforementioned
structure, it becomes necessary to connect the optical waveguides with the
single mode optical fiber array with high effeciency.
Hitherto, as means for connecting the optical waveguides with the optical
fiber array which lies between the optical waveguides and the optical
fiber connector, the structure shown in FIGS. 1A and 1B is known (M.
Takaya, et. al., Technical Digest Integrated Photonics Research, IWH2,
1996)
As shown in FIG. 1A, an optical module 110 is fabricated by sticking a plug
component 111 and an optical waveguide chip 112 together. In the optical
waveguide chip 112, plural optical waveguides 113 are formed in parallel
each other. On the inner surfaces of the plug component 111 and the
optical waveguide chip 112, V grooves 111a and 112a are respectively
formed, and a positioning of the plug component 111 relative to the
optical waveguide chip 112 is performed by inserting pins 114 into the V
grooves 111a and 112a.
Near both the side ends of the plug component 111, guide holes 115 for
positioning the plug component 111 relative to the optical fiber connector
120 shown in FIG. 1B are formed. As shown in FIG. 1B, plural optical
fibers 121 running in parallel with each other are buried in the optical
fiber connector 120, and guide holes 122 for positioning the optical fiber
connector 120 relative to the optical module 110 are formed near both the
side ends of the optical fiber connector 120.
Positioning of the optical fiber connector 120 relative to the optical
module 110 are performed by inserting guide pins (not shown) into the
guide holes 122 and 115, and thereby the optical waveguides 113 of the
optical module 110 are connected with the optical fibers 121 of the
optical fiber connector 120.
In the structure for connecting the optical fibers 121 with the optical
module 110 by means of the optical fiber connector 120, it is very
important that end faces of the optical fibers 121 and the optical guide
113 are flattened. Accordingly, both the end faces are specularly
polished.
However, in the aforementioned conventional optical module, it is necessary
to stick the waveguide chip and the plug component together with high
accuracy in order to specularly polish the end face of the optical
waveguide, but the aforementioned sticking process is very difficult. The
reason is that, although positionings of the optical waveguides in the
horizontal and vertical directions are successfully performed because of
the existence of the pins, the aforementioned structure has no means for
positionings the optical waveguides in the direction of the optical axes
thereof.
Moreover, a heavy load is applied to the optical module in case that the
optical fiber connector is connected with or removed from the optical
module. However, since the optical module is formed by sticking the
optical waveguide chip and the plug component together with adhesion, the
optical module cannot withstand the aforementioned load applied thereto.
As a method for increasing the strength of the optical module, a following
one can be devised. That is to say, the optical waveguides are sandwiched
by two parallel reinforcing plates near the end face of the optical
waveguides, which are opposed to the fiber block (the optical fiber array)
face to face. Then, the position of the fiber block relative to the
optical waveguides is optimized by monitoring intensities of lights
emitted from the fiber block, and the are stuck together. However,
according to this method, since complicated works for aligning to the
optical axes are added, it is undesirable from viewpoints of an increasing
in cost and low productivity.
SUMMARY OF THE INVENTION
Accordingly, it is an object of the present invention to provide an optical
module which withstands a force applied thereto in case that an external
optical fiber connector is connected with an removed from an optical
module and makes optical adjustments for aligning optical axes
unnecessary.
It is a further object of the invention to provide a method for fabricating
an optical module which withstands a force applied thereto in case that an
external optical fiber connector is connected with and removed from an
optical module and makes optical adjustments for aligning optical axes
unnecessary.
According to the first feature of the invention, an optical module to be
connected with an removed from an external optical fiber connector
supporting plural parallel optical fibers for an optical signal
transmission (optical fibers for transmission, hereinafter), comprises:
a substrate on which an optical device is mounted,
a basic member on which the substrate is mounted,
a block which fits to the basic member at a side end thereof, partially
projects plural parallel internal optical fibers (optical fibers,
hereinafter) to be connected with the optical device at a first end face
of the block, and support remainders of the internal optical fibers so
that end faces of the remainders are exposed at a second end face of the
block, and
plural parallel V grooves (V grooves, hereinafter) which have end walls,
are formed on the substrate and supports the respective internal optical
fibers projected from the block,
wherein a lateral pitch of the V grooves are a same as that of the optical
fibers.
In the optical module according to the invention, the plural optical fibers
are supported by a block, which is fitted to the basic member. The optical
fibers projected from the first end face of the block are supported by the
V grooves, which are respectively formed on the substrate. The position of
the optical fiber supported by the V groove on a horizontal axis which
corresponds to the width direction of the optical fibers arranged in
parallel with each other is determined by a position of the V groove. The
height of the aforementioned optical fiber above the substrate is
determined by a width of the V groove. The position of the optical fiber
on the optical axis thereof is determined by butting a leading end of the
optical fiber against an end wall of the V groove. Positionings of the
optical fibers on the various axes are mechanically performed by fitting
the block to the basic member. Accordingly, there is no necessity for
conducting optical adjustments in order to align the optical axes of the
optical fibers with those of optical waveguides lying between the optical
fibers and the optical device. Since the optical fiber connector is
connected with the second end face of the block on which end faces of the
optical fibers are exposed, a load is applied to the block in case that
the optical fiber connector is connected with the optical module. However,
since the optical fibers are buried in and supported by the block, the
positions of the optical fibers are not shifted, when the optical fiber
connector is repeatedly connected with and removed from the optical
module.
It is desirable that the optical device is mounted on the substrate via
solder bumps having a predetermined volume. Thereby the optical device can
be mounted on the substrate with high accuracies in a position and a
height thereof.
Moreover, an optical mode filed converter may be integrated on each optical
fiber, and a grating may be provided for each optical fiber. The optical
fibers may be divided in the middle of the fiber block, and an optical
isolator or an optical wavelength filter may be inserted between the
divided optical fibers.
According to the second feature of the invention, a method for fabricating
an optical module to be connected with and removed from an optical fiber
connector supporting plural parallel optical fibers for an optical signal
transmission (optical fiber for transmission, hereinafter), comprises the
steps of:
forming a block for supporting plural parallel optical fibers (optical
fibers, hereinafter) so that the block partially projects the optical
fibers at first end face of the block and exposes end faces of remainders
of the optical fibers at a second end face of the block,
forming plural parallel V grooves (V grooves, hereinafter) having end walls
and a same lateral pitch as that of the optical fibers on a substrate so
that the projected optical fibers can be supported the V grooves, mounting
the substrate having the optical device mounted thereon on a basic member,
and
fitting the block to the basic member at a side end thereof in condition
that the optical fibers are inserted into the V grooves and butt against
the end walls of the V grooves.
In the method for fabricating the optical module, when the block is fitted
to the basic member, the positions of the optical fiber on the horizontal
and vertical axes are respectively determined by the position and the
width of the V groove, and the position of the optical fiber on the
optical axis thereof is determined by butting the leading end of the
optical fiber against the end wall of the V groove. Accordingly, the
optical module can be fabricated without conducting optical adjustments
for aligning the optical axes of the internal optical fibers with those of
the optical device. Moreover, since the optical fibers are buried in and
supported by the block, the positions of the optical fibers are not
shifted, even when the external optical fiber connector is repeatedly
connected with and removed from the optical module.
Since the step of mounting the optical device on the substrate comprises
the steps of forming solder bumps on solder-wettable pads previously
formed on the substrate, setting the optical device having a bottom
surface on which joining pads are previously formed on the solder bumps,
melting the solder bumps, and pressing the optical device against the
substrate, the optical device can be mounted on the substrate with high
accuracy in positioning by the self alignment function of the solder
bumps. Especially in this case, since the steps of forming solder bumps
comprises the steps of setting punched solder sheets which are formed by
punching a solder sheet having a predetermined thickness on the
solder-wettable pads, and thermally pressing the punched solder sheets
against the solder-wettable pads, volumes of the solder bumps can be
equalized. As a result, the height of the optical device above the
substrate becomes constant.
The step of forming the block may comprises the steps of previously
integrating an optical mode field converter on a long optical fiber or
previously forming gratings on a long optical fiber at a predetermined
interval, and
providing plural short optical fibers to be supported by the block by
dividing the long optical fiber. Moreover, the method for fabricating the
optical module may further comprises the steps of dividing the optical
fibers in the middle of the block, and inserting an optical isolator or an
optical wavelength filer into the divided optical fibers.
BRIEF DESCRIPTION OF THE DRAWINGS
The invention will be explained in more detail in conjunction with appended
drawings, wherein:
FIGS. 1A and 1B respectively show front views of a conventional optical
module and an conventional optical fiber connector;
FIG. 2 show a perspective view of an optical module according to the first
preferred embodiment of the invention;
FIG. 3 shows a cross-sectional view A--A of an optical module shown in FIG.
2 in a vertical cross-section;
FIG. 4 shows a perspective view of an external optical fiber connector to
be connected with an optical module shown in FIG. 2;
FIG. 5 shows a perspective view of an optical module shown in FIG. 2 in a
state that the optical fiber connector shown in FIG. 4 is connected
therewith;
FIGS. 6A to 6C show cross-sectional views explaining a method for mounting
an optical device on a substrate,
FIGS. 7A to 7C show cross-sectional views explaining a method for forming
solder bumps on a substrate,
FIG. 8 shows a cross-sectional view of an optical module according to the
second preferred embodiment of the invention in a vertical cross-section,
FIG. 9 shows a cross-sectional view of an optical module according to the
third preferred embodiment of the invention in a vertical cross-section,
and
FIG. 10 shows a cross-sectional view of an optical module according to the
forth preferred embodiment of the invention in a vertical cross-section.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
Embodiments of the invention will be explained referring to appended
drawings.
FIG. 2 shows a perspective view of an optical module according the first
preferred embodiment of the invention. FIG. 3 shows a cross-sectional view
of the optical module shown in FIG. 2 taken along a direction of
transmission of an optical signal (in a vertical cross-section,
hereinafter).
In an example of the embodiments shown in FIG. 2, the invention is applied
to a semiconductor optical amplifier module of eight channels. As shown in
FIGS. 2 and 3, a semiconductor substrate 12 formed of Si is provided for a
package 11, and a semiconductor optical amplifier 13 serving as an optical
device is mounted an the substrate 12 at a center area thereof. Excised
portions 11a are formed at both side ends of the package 11, and fiber
blocks 16a and 16b which respectively support eight optical fibers 17a and
17b are fitted into both the excised portions 11a. The interior of the
package 11 is hidden by a cover, which is omitted in FIGS. 2 and 3.
On a part of the substrate 12 lying between the optical fibers 17a and the
semiconductor optical amplifier 13, plural planar optical waveguides 14a
for guiding optical signals supplied from the optical fibers 17a to the
semiconductor optical amplifier 13 are formed corresponding to the
internal optical fibers 17a. Moreover, on another part of the substrate 12
lying between the optical fibers 17b and the semiconductor optical
amplifier 13, plural planar optical waveguides 14b for guiding the output
optical signals of the semiconductor optical amplifier 13 to input ends of
the optical fibers 17b are formed corresponding to the optical fibers 17b.
The optical waveguides 14a and 14b are formed by depositing SiO.sub.2 on
the substrate 12 by the CVD method.
The fiber block 16a and 16b are respectively provided with the eight
internal optical fibers 17a and 17b having the lengths of about 10 mm.
Parts of the optical fibers 17a and 17b respectively protrude out from the
left and right end faces of the fiber blocks 16a and 16b by 5 mm.
Remaining parts of the parallel optical fibers 17a and 17b are
respectively buried in the fiber blocks 16a and 16b with a predetermined
lateral pitch. The end faces of the buried optical fibers 17a and 17b are
respectively exposed at the right and left end faces of the fiber blocks
16a and 16b in order to connect optically with external optical fiber
connectors (not shown).
Guide holes 18 are formed near both side ends of the fiber blocks 16a and
16b. Positions of the centers of the guide holes 18 and optical axes of
the optical fibers 17a and 17b respectively almost coincide with the
positions of centers of guide pins 52 and optical axes of optical fibers
53 of a later mentioned optical fiber connector 50 (see FIG. 4).
In the fabrication process of the fiber blocks 16a and 16b in which the
optical fibers 17a and 17b are buried, the optical fibers 17a and 17b are
inserted into resin material, and the fiber blocks 16a and 16b are
respectively formed by integral molding. It is desirable that material
which shows contraction of a small amount at the time of hardening is
selected as one for forming the fiber blocks 16a and 16b.
The optical signals are supplied to the semiconductor optical amplifier 13
via the optical fibers 17a and the planar optical waveguides 14a, both
being situated on the input side. If the semiconductor optical amplifier
13 is supplied with a current, the optical signal incident on the
semiconductor optical amplifier 13 transmits therethrough and is outputted
to the optical fibers 17b via the planar optical waveguides 14a, both
being situated on the output side. If the aforementioned current is
stopped, the semiconductor optical amplifier 13 absorbs the optical signal
incident thereon, and interrupts the optical signal. Thereby, a gate
action against the optical signal is performed.
The optical signals are inputted to and outputted from the optical module
10 via an optical fiber connectors 50 shown in FIG. 4.
The optical fiber external connector 50 is constructed so that the eight
external optical fibers 53 are supported by an connector body 51 in
parallel with each other. The lengths of the optical fibers 53 are
controlled in the order of cm, and the end face 53a thereof to be
connected with the optical module 10 are specularly polished. The lateral
pitch of the optical fiber 53 is the same as that of the optical fibers
17a and 17b in the optical module 10. On the end face of the optical fiber
connector 50 to be connected with the optical module 10, two guide pins 52
corresponding to the optical guide holes 18 of the optical module 10 are
formed.
As shown in FIG. 5, the optical fiber connector 50 is connected with the
optical module 10 by inserting the guide pins 52 into the guide holes 18
of the optical module 10, hence the optical signal can be inputted to and
outputted from the optical module 10.
In the optical module 16 according to the first preferred embodiment of the
invention, a signal amplification function can be obtained by supplying an
electric current to the semiconductor optical amplifier 13 as needed.
However, in the semiconductor optical amplifier module, if the end face of
the optical fibers 17a and 17b exist at the input and output ports of the
semiconductor optical amplifier 13, a Fabry-Perot resonator is formed by
the reflections of the light at both the end faces of the optical fibers,
and an "oscillation" arises, which is the most undesirable situation for
the semiconductor optical amplifier. In order to prevent such a situation,
the optical waveguides 14a and 14b are inserted between the optical fibers
17a and 17b and the semiconductor optical amplifier 13, and an active
layers of the semiconductor optical amplifier 13 and the optical
waveguides 14a and 14b are designed so that the directions of the lights
incident on optically coupling regions lying between the semiconductor
optical amplifier 13 and the optical waveguides 14a and 14b are oblique.
In case that mode field diameters of the optical waveguides 14a and 14b are
different from those of the optical fibers 53 (see FIG. 4) to be connected
with the optical module 10, coupling efficiencies therebetween can be
improved by integrating mode convertors (optical mode field convertors,
see FIG. 3) 20 on the optical fibers 17a and 17b. The mode convertors 20
are previously integrated on the long optical fibers 17a and 17b at a
predetermined interval. The long optical fibers 17a and 17b on which the
mode convertors 20 are integrated are divided into the short optical
fibers, which are buried in the fiber blocks 16a and 16b, hence there is
no necessity for separately integrating the mode convertors 20 on the
respective optical fibers 17a and 17b, and thereby the optical module 10
comprising the optical fibers 17a and 17b on which the mode convertors 20
are integrated can be easily fabricated.
Thereafter, means for aligning the optical axes of the semiconductor
optical amplifier 13 with those of the optical fibers 17a and 17b will be
explained.
As shown in FIG. 3, The semiconductor optical amplifier 13 in a state of a
bare chip is mounted on the substrate 12 via solder bumps 19. A method of
mounting the semiconductor optical amplifier 13 on the substrate 12 will
be explained referring to FIGS. 6A to 6C. As shown in FIG. 6A, joining
pads 13a are previously formed on the top surface of the substrate 12, and
hemispherical solder bumps 19 are formed on the respective solder-wettable
pads 12a. Then, the semiconductor optical amplifier 13 are set on the
solder bumps 19, the substrate 12 is heated, the semiconductor optical
amplifier 13 is pressed against the substrate 12 in condition that the
solder bumps 19 are melted, and the semiconductor optical amplifier 13 is
mounted on the substrate 12.
In case that the semiconductor optical amplifier 13 is set on the solder
bumps 19, even if the position of the semiconductor optical amplifier 13
is shifted relative to the solder bumps 19 as shown in FIG. 6A, restoring
forces caused by surface tensions of the melted solder bumps 19 are
applied to the solder bumps 19 as shown in FIG. 6B. As shown in FIG. 6C,
the positions of the joining pads 13a relative to the solder-wettable pads
12a, in other words the position of the semiconductor optical amplifier 13
mounted on the substrate 12, is automatically regulated with high accuracy
by the aforementioned self alignment effect of soldering.
It is desirable that material of the solder bumps 19 is eutectic alloy
containing Au of 80 weight percent and Sn of 20 weight percent. According
to this alloy, joining by means of fluxless soldering with high accuracy
is possible, and a shift off of a soldered object caused by creep of
solder hardly occurs. In this embodiment, the solder-wittable pad 12a has
a shape of stripe with dimensions of 140 .mu.m.times.25 .mu.m, and a
height of the bump 19 after joining is 17 .mu.m. According to the
aforementioned data, the high accuracy within .+-.1 .mu.m can be obtained
in the horizontal axis.
It is suitable that melting of the solder bump 19 is performed in a
nitrogen atmosphere with oxygen concentration not exceeding 100 ppm and an
ambient temperature is 330.degree. C. If oxygen concentration of nitrogen
atmosphere is high, an oxidized film is produced on a surface of melted
solder, and a satisfactory self alignment effect cannot be achieved. It is
desirable that material of the joining pad 13a and the solder-wettable pad
12a is Au which is rich in wettablity to AuSn solder. Regions surrounding
the solder-wettable pads 12a and the joining pads 13a should be formed of
SiO.sub.2 or etc. which has no wettability to solder.
On the other hand, V grooves 15 which extend from the side ends of the
optical waveguides 14a and 14b to both the end faces of the substrate 12
are situated on the top surface of the substrate 12 as shown in FIG. 3.
The V grooves 15 are divided into the left and right groups, each of which
contains the eight V grooves corresponding to the optical fibers 17a or
17b. The lateral pitch of the V grooves 15 is the same as that of the
optical fibers 17a or 17b. The V groove 15 is formed by anisotropic
etching using KOH for instance. The aforementioned solder-wettable pads
12a (see FIG. 6A), the center lines of the optical waveguides 14a and 14b
and the center lines of the V grooves 15 are respectively situated on
their predetermined positions with high accuracy by means of patterning
based on a series of photolithography processes.
The optical fibers 17a and 17b are inserted into the respective V grooves
15 by fitting the fiber blocks 16a and 16b to the excised portions 11a of
the package 11, and thereby optical transmission lines extending from the
optical fibers 17a and 17b to the semiconductor optical amplifier 13 are
formed. In the aforementioned transmission lines, the positions of the
optical fibers 17a and 17b on the horizontal axis which is vertical to the
optical axes of the optical fibers 17a and 17b (the horizontal axis,
hereinafter) are determined by the positions of the V grooves 15, and the
heights of the optical fibers 17a and 17b above the substrate 12 are
determined by widths of the V grooves 15. Moreover, the heights of the
optical axes of the semiconductor optical amplifier 13 are determined by
the sizes (the volumes) of the solder bumps 19.
The solder bumps is having an equal size can be obtained by means of a
micro-press as shown in FIGS. 7A to 7C. That is to say, as shown in FIG.
7A, a solder sheet 21 having an uniform thickness, and a set of a punch 22
and a die 23 for punching the solder sheet 21 are prepared. As shown in
FIG. 7B, the solder sheet 21 is punched by the punch 22 on the
solder-wettable pad 12a, and a punched solder sheet 21a is set on the
solder-wettable pad 12a. The hemispherical solder bump 19 having a
predetermined volume is formed on the solder-wettable pad 12a by thermally
pressing the punched solder sheet 21a against the solder-wettable pad 12a
as shown in FIG. 7C.
Now, let us again return to FIGS. 2 and 3. Concerning the positionings of
the fibers 17a and 17b in the direction of the optical axes of the same in
the aforementioned optical transmission lines, the optical axes of the
optical fibers 17a and 17b are aligned with those of the optical
waveguides 14a and 14b by mechanically fitting the fiber blocks 16a and
16b to the package 11 so that end faces of the optical fibers 17a and 17b
shooting out from the optical fiber blocks 16a and 16b butt against the
end faces of the optical waveguides 14a and 14b.
As mentioned in the above, the alignments of the optical axes of the
optical transmission lines extending from the optical fibers 17a and 17b
to the semiconductor optical amplifier 13 can be performed without
adjustments by mounting the semiconductor optical amplifier 13 on the
substrate 12 and fitting the fiber blocks 16a and 16b to the package 11 by
means of the V grooves 15. As a result, troublesome works for the
alignment of the optical axes becomes entirely unnecessary, and the
low-priced optical module 10 can be provided in its turn.
On the other hand, as shown in FIGS. 3 and 4, the optical axes of the
optical fibers 53 of the fiber connector 50 which is connected with the
input or output end face of the optical module 10 can be aligned with
those of the optical fibers 17a or 17b of the optical module 10 by fitting
the guide pins 52 of the optical fiber connector 50 into the guide holes
18 of the optical fiber block 16a or 16b.
Since the fiber blocks 16a and 16b are fitted to the package 11 in
condition that the optical fibers 17a and 17b are buried therein, even if
an external force is applied to the fiber blocks 16a and 16b at the time
of fitting or removing the optical fiber connector 56, the positions of
the optical fibers 17a and 17b are not shifted, and the condition that
these optical fibers are supported by the fiber blocks 16a and 16b can be
maintained. That is to say, the insufficiency of the mechanical strength
of means for supporting the optical fibers in the conventional optical
module which has been a course of anxiety can be swept away, and the
optical module 10 can withstand a load applied thereto in case that the
optical connector 50 is repeatedly fitted into and removed from the
optical module 10. Moreover, since the processes for specularly polishing
the end surfaces of the optical fibers 17a and 17b to be connectoed with
the optical fibers 53 of the optical fiber connector 50 can be easily
performed at the stage of the fabricating the fiber blocks 16a and 16b,
the optical module 10 having the low connection losses can be obtained.
Moreover, since alignments of the optical axes of the optical transmission
lines extending from the optical fibers 17a and 17b to the semiconductor
optical amplifier 13 can be performed without adjustments, the optical
module 10 according to this embodiment is suited for an optical module to
be connected with the optical fiber connector comprising single mode
optical fibers in which tolerance limits of misalignments of the optical
fibers are servere.
Although explanations are given to the case that the number of the optical
fibers 17a or 17b supported by the fiber block 16a or 16b is eight in this
embodiment, the similar effect can be obtained in case that the number of
the optical fibers 17a or 17b is four, twelve, sixteen or more.
FIG. 8 shows a cross-sectional view of an optical module according to the
second preferred embodiment of the invention. A semiconductor laser array
63 serving as an optical device is mounted on the optical module 60
according to this embodiment, and a laser lights emitted from the
semiconductor array 63 are outputted via plural optical fibers 67.
Similarly to the case of the first preferred embodiment, the optical
fibers 67 are buried in a fiber block 66, which is fitted to a package 61
to form optical transmission lines extending from the semiconductor laser
array 63 to the optical fibers 67.
The semiconductor laser array 63 is mounted on a substrate 62 via solder
bumps 69 similarly to the case of the first preferred embodiment.
Moreover, V grooves 65 are formed on a part of the substrate 62 which lies
between the semiconductor laser array 63 and the fiber block 66 similarly
to the case of the first preferred embodiment of the invention. According
to the aforementioned configuration, the positionings of the optical axes
of the semiconductor laser array 63 and the optical fibers 67 in the
horizontal and vertical directions are accomplished by a self alignment
effect of the bumps and the V grooves 65.
Moreover, the positionings of the optical fibers 67 in the direction of the
optical axes thereof are carried out so that the end faces of the optical
fibers 67 butt against the end walls of the V grooves 65. Accordingly, the
optical axes of the semiconductor laser array 63 can be aligned with those
of the optical fibers 67 without adjustment.
In the optical module according to the second preferred embodiment, an
optical isolator 64 is inserted into the fiber block 66 in order to reduce
an effect of a light reflected from a far end. When the optical isolator
64 is inserted into the fiber block 66, the optical fibers 67 are divided
in the middle of the fiber block 66, and thereafter the optical isolator
64 is inserted between the divided optical fibers 67. Since the optical
isolator 64 is inserted into the fiber block 66, the optical fibers 67 are
divided in condition that they are supported by the fiber block 66.
In this way, misalignments of the optical axes of the divided optical
fibers 67 do not occur. As a result, since there is no necessity for again
aligning the optical axes of the divided optical fibers 67 with each other
after the optical isolator 64 is inserted, the optical isolator 64 can be
easily inserted into the optical module 60.
FIG. 9 shows a cross-sectional view of an optical module according to the
third embodiment of the invention. Similarly to the case of the second
preferred embodiment of the invention, a semiconductor laser array 73
serving as an optical module is mounted on the optical module 70, and
lights emitted from the semiconductor laser array 73 are outputted via
plural optical fibers 77. The optical fibers 77 are buried in the fiber
block 76, and optical transmission lines extending from the semiconductor
laser array 73 to the optical fiber array 77 are formed by fitting the
fiber block 76 to the package 71.
In this embodiment, gratings 74 are provided for the optical module 70 in
order to improve the wavelength selective characteristic of laser lights
emitted from the semiconductor laser array 73. The gratings 74 are
previously formed on the long optical fiber 77 at a predetermined
interval. The long optical fiber 77 on which the gratings 74 are formed is
cut into the short optical fibers, which are respectively buried in the
fiber block 76. Then, there is no necessity separately forming the grating
74 on each of the optical fibers 77. Accordingly, the optical module 70
provided with the optical fibers 77 on which the gratings are formed can
be easily fabricated.
Means for mounting the semiconductor laser array 73 on the substrate 72 and
the method for the same, and means for positioning the optical fibers 77
relative to the semiconductor laser array 73 by means of the V grooves 75
formed on the substrate 72 are the same as those in the second preferred
embodiment. Thereby, the optical axes of the semiconductor laser array 73
can be aligned with those of the optical fibers 77 without adjustments.
FIG. 10 shows a cross-sectional view of an optical module according to the
fourth preferred embodiment of the invention. A photo-detector array 83
serving as an optical device is mounted on the optical module 80 according
to the invention, and optical signals supplied from plural optical fibers
87 are respectively detected by the photo-detector array 83. Similarly to
the case of the first preferred embodiment, the optical fibers 87 are
buried in the fiber block 86, and optical transmission lines extending
from the optical fibers 87 to the photo-detector array 83 are formed by
fitting the fiber block 86 to the package 81.
In this embodiment, an optical wavelength filter 84 is inserted into the
fiber block 86 in order to improve the wavelength selective
characteristics of the optical signals supplied to the photo-detector
array 83. As mentioned in the above, since the optical wavelength filter
84 is inserted into the fiber block 86 in condition that the optical
fibers 87 are supported by the fiber block 86, the misalignments of the
optical axes of the optical fibers 87 and the optical photosensor array 83
do not occur. As a result, since there is no necessity for again aligning
the optical axes of the optical fibers 87 with those of the photo-detector
83 after the optical wavelength filter 84 is inserted, the optical
wavelength filter 84 can be easily inserted into the fiber block 86.
Means for mounting the photo-detector array 83 on the substrate 82 and the
method for the same, and means for positioning the optical fibers 87
relative to the photo-detector array 83 by means of V grooves 85 formed on
the substrate 82 are the same as those of the second preferred embodiment.
As a result, optical adjustments for aligning the optical axes of the
photo-detector array 83 with those of the optical fibers 87 become
unnecessary.
Although the optical modules using the semiconductor optical amplifier of
multi-channels, the semiconductor laser array and the photo-detector array
as the optical devices have in explained as the examples of the
embodiments, the optical devices to which the invention is applicable are
never limited to the aforementioned ones.
Moreover, the invention can be applied to an optical module in which the
semiconductor optical amplifier is replaced with the waveguides or the
waveguide device such as an optical directional coupler, a WDM coupler,
etc. In case that the optical device is a semiconductor laser array or a
photo-detector array, the waveguide device may be inserted between the
optical device and the output or input optical fiber. In this way, the
performance and the utility of the optical module become higher by
introducing the waveguides or the waveguide device thereinto, and the
field of application of the invention is expanded.
The fiber block combined with the optical module may be the one
corresponding to the MPO type fiber connector or the minature MPO fiber
connector. According to the aforementioned fiber block, the connector can
be easily fitted to and removed from the fiber block.
In case that the V grooves are formed by anisotropic etching, etchant
suited for the process is not restricted to aforementioned KOH, and
tetramethylammoniumhydrooxide may be used for this purpose. Moreover, the
method for forming the V grooves is not restricted to anisotropic etching,
and isotropic etching by means of dry etching can be adopted for the same
purpose.
As mentioned in the above, according to the invention, since the plural
optical fibers are supported by the fiber block which is fitted to the
basic member using the V grooves formed on the substrate having the
optical device mounted thereon as a guide, the optical module which makes
optical adjustments for aligning the optical axes of the optical fibers
with those of the optical device unnecessary and withstands the repeated
load applied thereto in case that the optical fiber connector is fitted to
and removed from the optical module can be provided.
Although the invention has been described with respect to specific
embodiment for complete and clear disclosure, the appended claims are not
to be thus limited but are to be construed as embodying all modification
and alternative constructions that may be occurred to one skilled in the
art which fairly fall within the basic teaching here is set forth.
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