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United States Patent | 6,237,489 |
Williams | May 29, 2001 |
A support and tensioning frame for a stencil to enable solder paste to be applied to printed circuit boards and other electronic substrates includes a support frame engaged with at least two opposed mounting members. Each mounting member includes at least one projection for engaging an aperture in a stencil to mount the stencil under tension. A permanent-biasing mechanism engages one or more of the mounting members to place the stencil under tension. A second biasing mechanism engages the mounting member to provide a bias opposite that of the permanent-biasing mechanism to facilitate release of a mounted stencil.
Inventors: | Williams; David Godfrey (6A Courtenay Road, Hoylake, Wirral, Merseyside L47 1HD, Wirral, GB) |
Appl. No.: | 483253 |
Filed: | January 13, 2000 |
Intern'l Class: | B05C 017/05 |
Field of Search: | 101/114,127,127.1,129,415.1 38/102-102.91 160/327,328,329,372,378,395 |
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6067903 | May., 2000 | Williams | 101/127. |
Foreign Patent Documents | |||
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