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United States Patent |
6,217,362
|
Pei
,   et al.
|
April 17, 2001
|
Electrical connector having improved contact elements
Abstract
An electrical connector includes an insulative base (8) defining a
plurality of contact receiving bores (81) for each receiving a contact
element (9) therein. A cover plate (5) is attached to the base to define a
space therebetween for movably receiving a slide plate (7). The slide
plate defines a plurality of slots (72) corresponding to the contact
receiving bores of the base and each slot retains a conductive member (70)
therein. The cover plate defines holes (51) therein corresponding to the
slots and adapted to guide pins (4) of a chip module into the slots. The
slide plate is moveable between a released position and an engaged
position where the conductive member engages with both the pin and the
contact element to establish electrical connection therebetween. Each
contact element includes a soldering section (92) extending beyond the
base and adapted to be soldered to a circuit board (3), and an engaging
section (93) extending into the corresponding slot for being engaged by
the conductive member. A retention section (91) fixed in the base is
spaced from and connected to the soldering section by a connection section
(910) thereby allowing a reduction of thickness of the connector without
sacrificing the mechanical strength thereof. The connection section is
resiliently deformable to accommodate a relative movement between the
retention section and the soldering section caused by a difference in
thermal expansion between the connector and the circuit board.
Inventors:
|
Pei; Wen-Chun (Taipei, TW);
Huang; Yao-Chi (Yung-Ho, TW)
|
Assignee:
|
Hon Hai Precision Ind. Co., Ltd. (Taipei Hsien, TW)
|
Appl. No.:
|
321706 |
Filed:
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May 28, 1999 |
Foreign Application Priority Data
Current U.S. Class: |
439/342 |
Intern'l Class: |
H01R 004/50; H01R 013/625 |
Field of Search: |
439/342,259,266
|
References Cited
U.S. Patent Documents
5044973 | Sep., 1991 | Noda et al. | 439/296.
|
5492488 | Feb., 1996 | Hsu | 439/342.
|
5622514 | Apr., 1997 | Crompton, III et al. | 439/342.
|
5855489 | Jan., 1999 | Walker | 439/342.
|
Primary Examiner: Sircus; Brian
Assistant Examiner: Webb; Brian S.
Attorney, Agent or Firm: Chung; Wei Te
Claims
What is claimed is:
1. An electrical connector adapted to be mounted on a circuit board for
electrically connecting an electronic device to the circuit board,
comprising:
a plurality of contact elements;
an insulative base defining a plurality of contact receiving bores for each
receiving a corresponding contact element therein;
a slide plate movably supported on the base, the slide plate defining a
plurality of slots therein corresponding to the contact receiving bores of
the base, each slot being adapted to receive a pin of the electronic
device;
driving means coupled to the slide plate for moving the slide plate with
respect to the base between a released position and an engaged position
for establishing electrical connection between the pin and the contact
element;
each contact element comprising a soldering section extending beyond a
bottom face of the base to be connected to the circuit board, an engaging
section extending into the corresponding slot of the slide plate to be
electrically engaged by the pin, and an offset retention section spaced
from and connected to the soldering section by a connection section; and
the slide plate comprising a conductive member retained in each of the
slots thereof, the conductive member being configured to contact both the
pin of the electrical device and the contact element of the base when the
slide plate is at the engaged position for establishing electrical
connection between the pin and the contact element.
2. The electrical connector as claimed in claim 1, wherein the connection
section of the contact element is resiliently deformable for accommodating
a relative movement between the soldering section and the retention
section.
3. The electrical connector as claimed in claim 1, wherein the retention
section is received in a cavity defined in the base, the retention section
having barbs engaging with an inside surface of the cavity for securing
the retention section in the cavity thereby retaining the contact element
in the contact receiving bore.
4. The electrical connector as claimed in claim 1, wherein the conductive
member of the slide plate comprises two resilient arms respectively
engaging with the pin and the contact element when the slide plate is at
the engaged position.
5. The electrical connector as claimed in claim 1, wherein the driving
means comprises a plate pivotally attached to the base and rotatable
between a first angular position and a second angular position, the plate
forming a camming contour engaged by a follower section formed on the
slide plate whereby when the plate is rotated between the first and second
angular positions, the slide plate is moved between the engaged position
and the released position.
6. The electrical connector as claimed in claim 5, wherein the camming
contour is defined by a curved rib formed on the plate of the driving
means, and wherein the slide plate defines an opening for movably
receiving the curved rib therein, an inward projection being formed in the
opening for engaging with the curved rib to serve as the follower section.
7. The electrical connector as claimed in claim 5, wherein the plate of the
driving means comprises a manual operating section extending beyond the
base and adapted to be manually operated to move the slide plate between
the released position and the engaged position.
8. The electrical connector as claimed in claim 1, wherein the base
comprises two opposite side walls defining a space therebetween for
accommodating the slide plate therein, a cover plate being attached to the
base plate by being supported on the side walls to enclose the slide
plate, the cover plate defining a plurality of holes corresponding to the
slots of the slide plate for entry of the pins of the electronic device
into the slots.
9. The electrical connector as claimed in claim 8, wherein each side wall
of the base comprises barbs and the cover plate forms two flaps
respectively extending downwardly from two sides thereof, and the cover
plate defines three openings near each of the flaps, the barbs of each
side wall of the base engaging with a corresponding flap of the cover
plate at a position just below the openings for securing the cover plate
to the base.
10. The electrical connector as claimed in claim 1, wherein the free end of
the soldering section of each contact element has a solder ball attached
thereto.
11. The electrical connector as claimed in claim 1, wherein the base
defines a recess in the bottom face thereof surrounding the free end of
the soldering section of each contact element.
12. An electrical connector comprising an insulative body defining a
plurality of contact receiving holes in a top face thereof for each
receiving a contact element, each contact element comprising a main
section and an offset section spaced from and connected to the main
section by means of a connection section, the offset section being
received and retained in a cavity defined in the insulative body, the
cavity being in communication with the contact receiving hole, the main
section extending in a vertical direction with a soldering section at a
bottom thereof, and the connection section extending in a horizontal
direction so as to isolate the offset section to the soldering section.
13. The electrical connector as claimed in claim 12, wherein the offset
section comprises barbs engaging with an inside surface of the cavity for
securing the contact element in the contact receiving hole.
14. An electrical connector adapted to be mounted to a circuit board having
a first thermal expansion coefficient, the electrical connector comprising
a housing made of an insulative material having a second thermal expansion
coefficient, the housing defining a plurality of holes receiving contact
elements therein, each contact element having a main section received and
free to move in the corresponding hole and having a free end extending
beyond the housing for being soldered to the circuit board, an offset
section spaced from and connected to the main section by means of a
connecting section, the offset section being secured in a cavity defined
in the housing for retaining the contact element in the hole, the
connection section being resiliently deformable for accommodating a
relative movement between the offset section and the main section caused
by a difference between the first and second thermal expansion
coefficients.
15. An electrical connector adapted to be mounted on a circuit board for
electrically connecting an electronic device to the circuit board,
comprising:
a plurality of contact elements;
an insulative base defining a plurality of contact receiving bores for each
receiving a corresponding contact element therein;
a slide plate movably supported on the base, the slide plate defining a
plurality of slots therein corresponding to the contact receiving bores of
the base, each slot being adapted to receive a pin of the electronic
device;
driving means coupled to the slide plate for moving the slide plate with
respect to the base between a released position and an engaged position
for establishing electrical connection between the pin and the contact
element;
each contact element comprising a soldering section extending beyond a
bottom face of the base to be connected to the circuit board, an engaging
section extending into the corresponding slot of the slide plate to be
electrically engaged by the pin, and an offset retention section spaced
from and connected to the soldering section by a connection section for
retaining the contact element in the insulative base.
Description
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention generally relates to an electrical connector, and in
particular to a zero insertion force (ZIF) ball grid array (BGA) connector
having firmly secured contact elements for effectively forming an
electrical connection with pins of a chip module.
2. The Prior Art
Chip modules have been improved significantly. The amount and speed of data
transferred by the chip modules has increased rapidly. Thus, a
corresponding modification of a connector connecting the chip module to a
circuit board is required. Corresponding examples are disclosed in Taiwan
Patent Application Nos. 83207257, 83208396, 83212080 and 83212081.
FIGS. 1A, 1B, 1C and 1D show a conventional connector wherein FIGS. 1A and
1C are top views of a portion of the connector while FIGS. 1B and 1D are
corresponding cross-sectional views. The conventional connector defines a
number of contact receiving holes 21 in an insulative body 2 for retaining
contact elements 1 therein. Each contact element 1 has an elongate body 10
comprising an engaging section 11 at one end and a retention section 12 at
an opposite end. A soldering section 13 further extends from the retention
section 12 and protrudes beyond the body 2 for being soldered to a circuit
board 3 by solder 31. The retention section 12 comprises barbs 121 for
engaging with an inside surface of the contact receiving hole 21 to secure
the contact element 1 therein.
Pins 4 of a chip module are inserted into the contact receiving holes 21 of
the body 2 but are initially separated from the contact elements 1. The
chip module is then moved relative to the body 2 to bring the pins 4 into
contact with contact elements 1 as shown in FIGS. 1C and 1D whereby the
pins 4 are electrically connected to the contact elements 1.
A disadvantage associated with the conventional connector is that during
the movement of the chip module, a great force is applied to the contact
element 1 by the pin 4 which in turn induces a large moment at the
retention section 12. The retention section 12 may thus be moved and
separated from the body 2 as shown in FIG. 1D, causing damage to the
solder 31 connection.
Furthermore, since the retention section 12 and the soldering section 13
are immediately adjacent to each other, a strain may be induced on the
solder 31 connection due to a difference in thermal expansion of the
insulative body 2 and the circuit board 3. The strain may sometimes cause
breakage of the solder 31 connection. In addition, the retention section
12 and the soldering section 13 are vertically stacked on each other
thereby hindering a reduction of the thickness of the insulative body 2
while maintaining the same mechanical strength when securing the retention
section 12 in the contact receiving hole 21.
It is thus desirable to have an electrical connector that overcomes the
problems mentioned above.
SUMMARY OF THE INVENTION
Accordingly, an object of the present invention is to provide an electrical
connector comprising contact elements firmly secured in contact receiving
bores defined in an insulative body.
Another object of the present invention is to provide an electrical
connector comprising contact elements each having a resiliently deformable
section for accommodating strain caused by different thermal expansions
between the insulative body and a circuit board to which the connector is
soldered.
A further object of the present invention is to provide an electrical
connector comprising a number of contact elements each having a retention
section offset from a main section thereof thereby allowing a reduction of
the thickness of the connector while maintaining the same mechanical
strength to secure the contact element in the connector.
To achieve the above objects, an electrical connector in accordance with
the present invention comprises an insulative base defining a plurality of
contact receiving bores for each receiving a contact element therein. A
cover plate is attached to the base to define a space therebetween for
movably receiving a slide plate. The slide plate defines a plurality of
slots corresponding to the contact receiving bores of the base and each
slot retains a conductive member therein. The cover plate defines holes
therein corresponding to the slots and adapted to guide pins of a chip
module into the slots. The slide plate is movable between a released
position and an engaged position where the conductive member engages with
both the pin and the contact element to establish electrical connection
therebetween. Each contact element includes a soldering section extending
beyond the base and adapted to be soldered to a circuit board, and an
engaging section extending into the corresponding slot for being engaged
by the conductive member. A retention section fixed in the base is spaced
from and connected to the soldering section by a connection section
thereby allowing a reduction of thickness of the connector without
sacrificing the mechanical strength thereof. The connection section is
resiliently deformable to accommodate a relative movement between the
retention section and the soldering section caused by a difference in
thermal expansion between the connector and the circuit board.
BRIEF DESCRIPTION OF THE DRAWINGS
The present invention will be apparent to those skilled in the art by
reading the following description of a preferred embodiment thereof, with
reference to the accompanying drawings, in which:
FIG. 1A is a plan view of a portion of a conventional connector when a pin
of a chip module does not contact a contact element of the connector;
FIG. 1B is a cross-sectional view of FIG. 1A;
FIG. 1C is a plan view of a portion of the conventional connector when the
pin is brought into contact with the contact element of the connector;
FIG. 1D is a cross-sectional view of FIG. 1C;
FIG. 2 is an exploded view of an electrical connector constructed in
accordance with the present invention;
FIG. 3 is an assembled view of FIG. 2;
FIG. 4A is a plan view of a portion of the connector of the present
invention with a cover plate removed when a conductive member retained in
a side plate does not engage with a pin of an external electronic device
and a contact element retained in a base of the connector;
FIG. 4B is a cross-sectional view of FIG. 4A;
FIG. 5A is a plan view of a portion of the connector of the present
invention with the cover plate removed when the conductive member retained
in the slide plate is brought into engagement with a pin of the external
electronic device and the contact element retained in the base of the
connector;
FIG. 5B is a cross-sectional view of FIG. 5A;
FIG. 6A is a cross-sectional view of the base of the connector and a
circuit board to which the contact element is to be soldered; and
FIG. 6B is a cross-sectional view similar to FIG. 6A but showing the
contact element soldered to the circuit board.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
Referring to the drawings and in particular to FIGS. 2 and 3, a zero
insertion force (ZIF) ball grid array (BGA) connector in accordance with
the present invention comprises a base 8 having a bottom wall 89 defining
contact receiving bores 81 in a top face 86 thereof for receiving contact
elements 9, and two opposite side walls 80 extending from the bottom wall
89 defining a space therebetween (not labeled) for slidably receiving a
slide plate 7 therein. The slide plate 7 is guided by the side walls 80 to
move between a released position (FIGS. 4A and 4B) and an engaged position
(FIGS. 5A and 5B). A cover plate 5 is attached to the base 8 to enclose
the slide plate 7. The base 8 forms three barbs 82 on each of the side
walls 80 thereof. The cover plate 5 forms two elongate flaps 53
respectively extending downwardly from two lateral sides thereof. Each
flap 53 extends the entire length of its respective lateral side of the
cover plate 5. The cover plate 5 defines three openings 52 in a top face
(not labeled) along each lateral side thereof and adjacent an inner
surface (not labeled) of the respective flap 53. The cover plate 5 and the
base 8 are assembled together by engaging the barbs 82 with the flaps 53
at a position just below the openings 52.
The slide plate 7 defines a number of slots 72 corresponding to the contact
receiving bores 81 of the base 8 for partially receiving the contact
elements 9 therein. The slots 72 are dimensioned to not interfere with the
contact elements 9 during movement of the slide plate 7 between the
engaged position and the released position. The cover plate 5 defines a
number of holes 51 therein corresponding to the slots 72 of the slide
plate 7 for entry of pins 4 (FIGS. 4A, 4B, 5A and SB) of an external
electronic device, such as a central processing unit chip (not shown),
into the slots 72.
A driving plate 6 is pivotally attached to and interposed between the
bottom wall 89 of the base 8 and the cover plate 5 with a manual operating
section 62 extending beyond an edge 87 of the base 8 for exhibiting manual
access to rotate the driving plate 6 between a first angular position and
a second angular position. The driving plate 6 has a cam portion 61
forming a camming contour engaged by a follower section 73 formed on the
slide plate 7 whereby rotating the driving plate 6 between the first
angular position and the second angular position causes the slide plate 7
to move between the engaged position and the release position.
In the embodiment illustrated, the cam portion 61 is formed by a curved rib
which is movably received in an opening 71 defined in the slide plate 7.
The opening 71 has an inward projection contacting the curved rib of the
cam portion 61 to serve as the follower section 73 of the slide plate 7.
Referring to FIGS. 4B and 5B, each contact element 9 comprises a main (not
labeled) constituting a soldering section 92 extending beyond the bottom
wall 89 of the base 8 to be connected to a circuit board 3 (FIGS. 6A and
6B) and an engaging section 93 extending into the corresponding slot 72 of
the slide plate 7. The contact element 9 further comprises an offset
retention section 91 spaced from and substantially parallel to the
soldering section 92 and connected thereto by a connection section 910.
The retention section 91 is received and retained in a cavity 84 defined
in the bottom wall 89 of the base 8 and in communication with the contact
receiving bore 81 thereby securing the contact element 9 in the contact
receiving bore 81. The retention section 91 has barbs 911 engaging with
inside surfaces (not labeled) of the cavity 84 for retaining the retention
section 91 in the cavity 84. It should be noted that contrary to the prior
art, the soldering section 92 of the present invention is free to move
with respect to the base 8.
A conductive member 70 is retained in each of the slots 72 of the slide
plate 7. The conductive member 70 has a first resilient arm 701 and a
second resilient arm 702, preferably in the form of a "U". The resilient
arms 701, 702 are dimensioned to respectively contact the engaging section
93 of the corresponding contact element 9 and the pin 4 of the external
electronic device when the slide plate 7 is moved from the released
position to the engaged position. Electrical connection is thus
established between the pin 4 of the external electronic device and the
contact element 9 of the connector.
In the embodiment illustrated, the retention section 91 of the contact
element 9 is arranged at the side of the soldering section 92 that is
opposite the second resilient arm 702 of the conductive member 7 thereby
providing a more sound support of the contact element 9 against the force
acting thereupon by the contact with the second resilient arm 702 when the
slide plate 7 is moved toward the engaged position.
As shown in FIG. 6A, the soldering section 92 of each contact element 9 has
a free end projecting beyond a bottom face 88 of the bottom wall 89 of the
base 8 to which a solder ball 31 is attached for connecting the contact
element 9 to the circuit board 3. The solder ball 31 is molten and
connects the contact element 9 to the circuit board 3 as shown in FIG. 6B.
Due to the difference in thermal expansion coefficients between the base 8
of the connector and the circuit board 3, a relative movement between the
retention section 91 and the soldering section 92 caused by different
expansions occurs during the soldering process as indicated by phantom
lines shown in FIG. 6B. The connection section 910 between the retention
section 91 and the soldering section 92 is resiliently deformable thereby
accommodating the relative movement occurring between the retention
section 91 and the soldering section 92. Thus, the solder ball 31
connection is protected from being acted upon by excessive internal stress
and the corresponding strain. A stable solder ball 31 connection is thus
maintained.
Preferably, a recess 83 is defined in the bottom face 88 of the base 8
surrounding the free end of the soldering section 92 of the contact
element 9 for accommodating molten soldering material from the solder ball
31.
In addition to allowing the soldering section 92 to freely move with
respect to the base 8, arranging the retention section 91 parallel to the
soldering section 92 rather than vertically stacking provides an
additional advantage of reducing a thickness of the bottom wall 89 of the
base 8 without sacrificing the mechanical strength thereof for securing
the contact element 9 in the contact receiving bore 81 of the base 8.
Although the present invention has been described with reference to the
preferred embodiment, it is apparent to those skilled in the art that a
variety of modifications and changes may be made without departing from
the scope of the present invention which is intended to be defined by the
appended claims.
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