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| United States Patent |
6,206,708
|
|
Chen
, et al.
|
March 27, 2001
|
Through via plate electrical connector and method of manufacture thereof
Abstract
For use with a plate having a via located therethrough an electrical
connector configured to transfer an electrical signal from one major
surface of a plate to the other major surface, a method of manufacturing
the electrical connector and a board mounted power supply utilizing the
same. In one embodiment, the electrical connector comprises a dielectric
layer coating a peripheral wall of the via and extending therefrom to coat
portions of the opposing major surfaces of the plate adjacent the via. The
electrical connector further comprises a conductive contact layer that
covers a portion of the dielectric layer and extends to portions of the
opposing major surfaces to form opposing contacts thereon.
| Inventors:
|
Chen; Shiaw-Jong S. (Plano, TX);
Hooey; Roger J. (Rockwall, TX);
Radke; Robert E. (Garland, TX)
|
| Assignee:
|
Lucent Technologies, Inc. (Murray Hill, NJ)
|
| Appl. No.:
|
482837 |
| Filed:
|
January 13, 2000 |
| Current U.S. Class: |
439/82; 174/266; 439/931 |
| Intern'l Class: |
H01R 12//00 |
| Field of Search: |
174/262,264,265,266
439/931,82,485,487
|
References Cited
U.S. Patent Documents
| Re29784 | Sep., 1978 | Chadwick et al. | 174/266.
|
| 3934334 | Jan., 1976 | Hanni | 174/266.
|
| 3934335 | Jan., 1976 | Nelson | 174/266.
|
| 4894271 | Jan., 1990 | Hani et al. | 174/264.
|
| 5374788 | Dec., 1994 | Endoh et al. | 174/266.
|
| 5414224 | May., 1995 | Adasko et al. | 174/262.
|
| 5590460 | Jan., 1997 | DiStefano et al. | 174/265.
|
| 5835350 | Nov., 1998 | Stevens | 361/704.
|
Other References
U.S. Patent Application Serial No. 09/482,839 filed on Jan. 13, 2000
entitled "Integrated Active Cooling Device for Board Mounted Electronic
Components" by Shiaw-Jong S. Chen, et al.
|
Primary Examiner: Bradley; Paula
Assistant Examiner: Ta; Tho D.
Claims
What is claimed is:
1. An electrical connector for providing electrical power to an active
cooling device coupled to a power supply chassis, comprising:
a chassis cover-plate of said chassis having a via located therethrough:
a dielectric layer coating a peripheral wall of said via and extending
therefrom to coat portions of opposing major surfaces of said chassis
cover-plate adjacent said via; and
a conductive contact layer covering a portion of said dielectric layer and
extending to said portions of said opposing major surfaces to form
opposing contacts of said connector thereon.
2. The electrical connector as recited in claim 1 wherein said conductive
contact layer comprises copper.
3. The electrical connector as recited in claim 1 wherein said electrical
connector is located proximate a plurality of other electrical connectors
extending through other vias in said chassis cover-plate.
4. The electrical connector as recited in claim 1 further comprising power
supply circuitry located within said power supply chassis having an output
electrically connected to said electrical connector.
5. The electrical connector as recited in claim 1 wherein said active
cooling device couplable to said chassis cover-plate.
6. The electrical connector as recited in claim 5 wherein said active
cooling device further includes a spring contact providing electrical
connectivity with said electrical connector.
7. A method of manufacturing an electrical connector for providing
electrical power to an active cooling device coupled to a power supply
chassis, comprising:
providing a chassis cover-plate for said chassis having a via located
therethrough;
coating a peripheral wall of said via with a dielectric layer, said
dielectric layer extending from said peripheral wall to coat portions of
opposing major surfaces of said chassis cover-plate adjacent said via; and
covering a portion of said dielectric layer with a conductive contact
layer, said conductive contact layer extending to said portions of said
opposing major surfaces to form opposing contacts of said connector
thereon.
8. The method of manufacturing an electrical connector as recited in claim
7 wherein said conductive contact layer is formed by plating.
9. The method of manufacturing as recited in claim 7 wherein said chassis
cover-plate has a plurality of vias therethrough and forming a plurality
of said electrical connectors.
10. The method of manufacturing an electrical connector as recited in claim
7 further comprising providing power supply circuitry within said power
supply chassis that is electrically connected to said electrical
connector.
11. The method of manufacturing an electrical connector as recited in claim
7 further comprising an active cooling device couplable to said chassis
cover-plate.
12. The method of manufacturing an electrical connector as recited in claim
11 wherein said active cooling device further includes a spring contact
providing electrical connectivity with said electrical connector.
Description
TECHNICAL FIELD OF THE INVENTION
The present invention is directed, in general, to an interconnect for an
active cooling system and, more specifically, to a device for providing an
electrical interconnection through a plate between an electronic device
and another associated device.
BACKGROUND OF THE INVENTION
Designers of electronic circuits must incorporate into their designs
methods to control heat generated by electronic components in the circuit.
Unless controlled, the heat build-up will cause component and circuit
failure. Temperature control, therefore, is vital to circuit reliability.
The preferred method to controlling temperature is to dissipate the excess
heat into the ambient air surrounding the electronic circuit before
temperatures rise to a level where damage can occur.
The traditional method to contain temperature build-up is to associate heat
generating components with heat dissipation devices, such as heat sinks.
The heat dissipation device absorbs heat from the component and provides
for a more efficient transfer of excess heat into the surrounding ambient
air. In most cases, the heat generating component will be mounted directly
to the heat dissipation device to more efficiently remove the excess heat.
Although traditional heat sinking methods can be used successfully in most
cases, the problems associated with temperature control have become more
pronounced as electronic circuits have become more complex. Such circuit
complexity often results in a circuit that requires a larger number of
components, which frequently are more powerful and can generate even more
heat. The problem is further complicated by the fact that lower profile
and more compact electronic systems have become the preferred choice of
customers. This means that space must be found in such low profile,
compact systems for both the electronic components that make up the
circuit as well as the heat dissipation devices that such components
require in order to prevent heat related damage. In short, as the power
density of circuits has increased, the use of classic finned heat sinks
may no longer adequately address the corresponding heat dissipation
requirements.
Some of the foregoing problems have been resolved by using active, rather
than passive, systems to control temperature build up. For example,
certain board mounted electronic components that generate large amounts of
heat can have an active cooling device, such as a small fan, dedicated
solely to the device. In those situations where a fan is used as the
active device, the fan is typically mounted directly on the component and
improves cooling by moving more ambient air over the component. Using a
fan in this manner will provide more efficient cooling in less space than
a classic finned heat sink.
Notwithstanding the benefits of having an active cooling device associated
directly with a heat generating component, active cooling devices have
certain shortcomings. One shortcoming is that such a device requires its
own power source in order to operate. Prior art methods of providing this
power usually involved the provision of a separate wiring path for the
active device. Such a path may be provided by using separate connector
pins on the substrate that are directly connected to the active device.
This solution to the power problem raises additional problems, such as the
added manufacturing expense of connecting the active device to an
electrical power source during the assembly process. Other detrimental
factors may arise when the active device must be removed for replacement
or maintenance. Usually the active device must be manually disconnected
and, when reinstalled, manually reconnected. This increases maintenance
time and the potential for error.
Accordingly, what is needed in the art is a device that can provide
electrical power to an active cooling device mounted on an electronic
device that does not require a separately wired circuit.
SUMMARY OF THE INVENTION
To address the above-discussed deficiencies of the prior art, the present
invention provides an electrical connector for use with a plate having a
via located therethrough that is configured to transfer an electrical
signal from one major surface of the plate to the other major surface of
the plate. In one embodiment, the electrical connector is comprised of a
dielectric layer coating a peripheral wall of the via and extending
therefrom to coat portions of the opposing major surfaces of the plate
adjacent the via. The electrical connector is further comprised of a
conductive contact layer that covers a portion of the dielectric layer and
extends to portions of the opposing major surfaces to form opposing
contacts thereon.
The present invention, in broad scope, introduces an electrical connector
that can be used to receive an electrical signal from an electronic device
coupled to one side of a plate and transfer that electrical signal to
another electronic device coupled to the other side of the plate. For
example, the present invention can be used to electrically interconnect a
board mounted power device and an active cooling device where the
baseplate of the active cooling device is mounted on top of the power
device. The electrical interconnect can be used for a number of purposes,
such as furnishing operating power to the active cooling device or
providing a feedback signal from the cooling device to the board mounted
power device.
One embodiment of the invention provides for the electrical connector to
have a copper layer as the conductive contact layer covering the
dielectric layer. Of course, any material used as a conductive layer
covering the dielectric layer will be within the scope of the present
invention.
A particularly useful embodiment of the invention provides for the
electrical connector to be located proximate a plurality of other
electrical connectors that extend through other vias in the plate. This is
particularly advantageous where certain connectors are used to transfer
power, perhaps of different voltages, through the plate while other
connectors are used to furnish other information, such as temperature or
air velocity.
In one embodiment of the invention, the electrical connector is formed
through a via of a base plate for a board mounted power supply. In another
aspect of this embodiment, the board mounted power supply has an output
that is electrically connected to the electrical connector.
In still another embodiment, the invention provides for an active cooling
device that is couplable to the plate. An aspect of this embodiment
provides for the active cooling device to further include a spring contact
that provides electrical connectivity with the electrical connector.
The foregoing has outlined, rather broadly, preferred and alternative
features of the present invention so that those skilled in the art may
better understand the detailed description of the invention that follows.
Additional features of the invention will be described hereinafter that
form the subject of the claims of the invention. Those skilled in the art
should appreciate that they can readily use the disclosed conception and
specific embodiment as a basis for designing or modifying other structures
for carrying out the same purposes of the present invention. Those skilled
in the art should also realize that such equivalent constructions do not
depart from the spirit and scope of the invention in its broadest form.
BRIEF DESCRIPTION OF THE DRAWINGS
For a more complete understanding of the present invention, reference is
now made to the following descriptions taken in conjunction with the
accompanying drawings, in which:
FIG. 1A illustrates an isometric view of an embodiment of a board mounted
power supply constructed in accordance with the principles of the present
invention;
FIG. 1B illustrates another isometric view of the board mounted power
supply of FIG. 1A;
FIG. 2 illustrates a planar side view of the board mounted power supply of
FIG. 1A and an unmounted active cooling device; and
FIG. 3 illustrates a cross-sectional view of an embodiment of an electrical
connector constructed in accordance with the principles of the present
invention.
DETAILED DESCRIPTION
Referring initially to FIGS. 1A and 1B, illustrated are isometric views of
an embodiment of a board mounted power supply 100 constructed in
accordance with the principles of the present invention. More
specifically, FIG. 1A illustrates the board mounted power supply 100 with
a top mounted integrated liquid cooling device 150 thereon. FIG. 1B
illustrates another isometric view of the board mounted power supply 100
of FIG. 1A. The board mounted power supply 100 has the integrated liquid
cooling device 150 separated to reveal a top view of the board mounted
power supply 100.
With continuing reference to FIGS. 1A and 1B, the illustrated board mounted
power supply 100 has a chassis 110 with power circuitry (not visible)
located in the chassis 110. The power circuitry, including the rectifiers,
switches, transformer or combination of such devices contained in the
chassis 110 will be familiar to those skilled in the pertinent art. The
board mounted power module 100 has a base plate 120 located thereon that
substantially covers the chassis 110. The plate 120 has electrical
connectors 130 associated with it, each of which is constructed in a via
135 through the plate 120, as hereinafter described. The power supply
circuitry in the chassis 110 has an output to which at least one of the
electrical connectors 130 is coupled.
The present invention is particularly advantageous when used in combination
with the illustrated integrated liquid cooling device 150. The integrated
liquid cooling device 150 is described in detail in U.S. patent
application Ser. No. LUCT-120016, entitled INTEGRATED ACTIVE LIQUID
COOLING DEVICE FOR BOARD MOUNTED ELECTRONIC COMPONENTS, to Chen,
Shiaw-Jong, et. al., commonly assigned with the invention and incorporated
herein by reference.
Located on the integrated liquid cooling device 150 are contacts 160 (not
visible) that correspond to the electrical connectors 130 on the plate
120. When the integrated liquid cooling device 150 is mounted on the board
mounted power supply 100, electrical connectivity will be established
between the cooling device 150 and the electrical connectors 130. In order
to assure electrical connectivity, in one embodiment of the invention, the
contacts 160 on the cooling device 150 may be spring contacts.
The advantages of the present invention are clearly illustrated in FIGS. 1A
and 1B. The integrated liquid cooling device 150 is commonly known in the
art as an active cooling device. That is, instead of relying on a heat
sink to passively conduct heat from a heat generating component of the
board mounted power supply 100 to a surface where it is transferred to the
surrounding ambient air, the cooling device actively gathers the heat from
the component and transfers it to the surrounding ambient air.
In the present case, the integrated liquid cooling device 150 moves a
coolant through a closed-circuit circulation pipe 170 to gather heat from
the board mounted power supply 100 and transfer it to the surrounding
ambient air. In order to pump the coolant through the closed-circuit
circulation pipe 170, the cooling device 150 has a pump 180 that is
coupled to the pipe 170. When the pump 180 moves the coolant to a position
where it can readily be dissipated into the surrounding ambient air, a fan
190 moves air across the pipe 170 and accelerates the transfer of heat.
It is readily apparent that both the pump 180 and the fan 190 on the
integrated liquid cooling device 150 require power in order to operate.
Prior art solutions to providing power to the fan 190 and pump 180 would
require power cords from the fan 190 and pump 180 to be connected to a
power source. The present invention, however, advantageously provides
electrical power to run the fan 190 and pump 180 directly from the power
supply circuitry in the chassis 110. In the illustrated embodiment, the
chassis 110 has an output to the electrical connector 130 on the chassis
110 side of the base plate 120. When the integrated liquid cooling device
150 is mounted on the board mounted power supply 100, the contacts 160 on
the cooling device 150 complete the circuit through the connectors 130
formed through the vias 135 in the base plate 120 to provide electrical
power to the pump 180 and fan 190.
Although the present invention requires only one electrical connector 130,
in the illustrated embodiment, a plurality of vias 135 and connectors 130
are provided. The plurality of connectors 130 can be used for a variety of
purposes, including powering more than one device or providing feedback of
temperature and other useful information to the board mounted power supply
100.
Turning now to FIG. 2, illustrated is a planar side view of the board
mounted power supply 100 of FIG. 1A and an unmounted active cooling device
200. This embodiment illustrates the provision of electrical power to an
active cooling device 200 that is only using a fan 210. The power module
100 has a base plate 120 with electrical connectors 130 in vias 135
through the base plate 120. An output of the board mounted power supply
100 is electrically connected to the electrical connectors 130. This
embodiment of the active cooling device 200 has spring contacts 220. When
the active cooling device 200 is mounted on the board mounted power supply
100, the contacts 220 will be electrically connected to the electrical
connectors 130 and provide electrical power to run the fan 210. Other
contacts 220 may be connected to other electrical connectors 130 to
provide power to other devices or to provide feedback information.
Turning now to FIG. 3, illustrated is a cross-sectional view of an
embodiment of an electrical connector 130 constructed in accordance with
the principles of the present invention. The electrical connector 130 is
employable with a plate 120 having a via 135 located therethrough. The via
135 has a dielectric layer 310 coating a peripheral wall of the via 135
and extending therefrom to coat a portion of an opposing major surface 315
on each side of the plate 120 adjacent to the via 135. In the illustrated
embodiment, the dielectric layer 310 may be 1 to 8 mils thick. Of course,
the thickness of the dielectric layer 310 may be modified as a particular
application may dictate.
Covering a portion of the dielectric layer 310 is a conductive contact
layer 320 that covers a portion of the dielectric layer 310 and extends to
portions of the opposing major surfaces 315 to form an opposing contact
330 on each of the opposing major surfaces 315. Those skilled in the
pertinent art will readily understand and recognize that an electrical
power source connected to the contact 330 on one side of the plate 120
will be electrically connected to the contact 330 on the opposing side of
the plate 120. In the illustrated embodiment, the conductive contact layer
320 is a copper layer that is 2 to 6 ounces thick. Of course, the
thickness of the copper layer may be modified as a particular application
may dictate. Although the illustrated embodiment of the invention provides
for the conductive contact layer 320 to be comprised of copper, other
conductive materials, such as platinum, gold, silver, etc., can also be
used as the conductive contact layer 320.
Although the present invention has been described in detail, those skilled
in the art should understand that they can make various changes,
substitutions and alterations herein without departing from the spirit and
scope of the invention in its broadest form.
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