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United States Patent | 6,204,181 |
Molnar | March 20, 2001 |
A method of using lubricating boundary layers for finishing semiconductor wafers is described. The lubricating boundary layer thickness is controlled to improve finishing and reduce unwanted surface defects. Differential lubricating boundary layer methods are described to differentially finish semiconductor wafers. Planarization and localized finishing can be improved using differential lubricating boundary layer methods of finishing.
Inventors: | Molnar; Charles J (Wilm, DE) |
Assignee: | Beaver Creek Concepts, Inc. (Wilm, DE) |
Appl. No.: | 435180 |
Filed: | November 5, 1999 |
Intern'l Class: | H01L 021/00 |
Field of Search: | 438/690,691,692,693,745,756,757,753 216/38,88,89 156/345 LP |
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