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United States Patent |
6,193,136
|
Higashi
,   et al.
|
February 27, 2001
|
Component mounting method and apparatus
Abstract
Sealant 11 is supplied in advance to one or both of the electrical bonding
areas 5,6 of the component 3 and the mounting surface 4, and as the
component 3 is brought in contact with the mounting surface 4, the sealant
11 is compressed and filled therebetween in a required area. At the same
time ultrasonic vibration is applied to the component 3 for generating
friction between the electrical bonding areas 5, 6 of the component 3 and
the mounting surface 4 in tight contact with each other, so that both
electrical bonding areas 5, 6 are melted and ultrasonically bonded
together, and thereby the component 3 is mounted on the mounting surface
4.
Inventors:
|
Higashi; Kazushi (Neyagawa, JP);
Otani; Hiroyuki (Ikoma, JP);
Minamitani; Shozo (Ibaraki, JP);
Kanayama; Shinji (Kashihara, JP);
Takahashi; Kenji (Suita, JP)
|
Assignee:
|
Matsushita Electric Industrial Co., Ltd. (Osaka, JP)
|
Appl. No.:
|
373957 |
Filed:
|
August 13, 1999 |
Foreign Application Priority Data
| Aug 20, 1998[JP] | 10-233875 |
Current U.S. Class: |
228/106; 156/73.1; 228/110.1; 228/114 |
Intern'l Class: |
B23K 001/06; B23K 020/10; B23K 020/12; B23K 031/16 |
Field of Search: |
228/106,112.1,113,114,114.5,115,110.1,1.1,2.1,5.5
156/73.1
|
References Cited
U.S. Patent Documents
4157932 | Jun., 1979 | Hirata | 156/310.
|
5786271 | Jul., 1998 | Ohida et al. | 438/615.
|
5969461 | Oct., 1999 | Anderson et al. | 310/313.
|
6051093 | Apr., 2000 | Tsukahara | 156/251.
|
Foreign Patent Documents |
WO97/47031 | Dec., 1997 | JP.
| |
11288975A | Oct., 1999 | JP.
| |
Primary Examiner: Ryan; Patrick
Assistant Examiner: Stoner; Kiley
Attorney, Agent or Firm: Price and Gess
Claims
What is claimed is:
1. A method of mounting a component on a mounting surface by electrically
bonding metallic parts of both of the component and the mounting surface,
comprising the steps of:
supplying a sealant to one or both of the component and mounting surface;
placing the component in proximity to the mounting surface;
pressing an electrical bonding area of the component tightly to an
electrical bonding area of the mounting surface, whereby the sealant is
compressed and filled between the component and mounting surface in a
required area; and
generating friction between the electrical bonding areas of the component
and the mounting surface in tight contact with each other by moving the
component and mounting surface relative to each other, whereby both of the
electrical bonding areas are melted and welded together.
2. The method of mounting a component on a mounting surface according to
claim 1 wherein heat is applied to the sealant to set at the same time
when the component and the mounting surface are bonded to each other.
3. The method of mounting a component on a mounting surface according to
claim 1 wherein the sealant is coated using a dispenser.
4. The method of mounting a component on a mounting surface according to
claim 1 wherein the sealant is supplied by a printing process.
5. The method of mounting a component on a mounting surface according to
claim 1 wherein the sealant is supplied by a transferring process.
6. The method of mounting a component on a mounting surface according to
claim 1 wherein at least one of the electrical bonding areas of the
component and the mounting surface is a bump.
7. A method of mounting a component on a mounting surface by electrically
bonding metallic parts of both of the component and the mounting surface,
comprising the steps of:
supplying a sealant to one or both of the component and mounting surface;
placing the component in proximity to the mounting surface;
pressing an electrical bonding area of the component tightly to an
electrical bonding area of the mounting surface, whereby the sealant is
compressed and filled between the component and mounting surface in a
required area; and
generating friction between the electrical bonding areas of the component
and the mounting surface in tight contact with each other by applying
ultrasonic vibration to the component, whereby both of the electrical
bonding areas are melted and ultrasonically bonded together.
8. The method of mounting a component on a mounting surface according to
claim 7 wherein heat is applied to the sealant to set at the same time
when the component and the mounting surface are bonded to each other.
9. The method of mounting a component on a mounting surface according to
claim 7 wherein the sealant is coated using a dispenser.
10. The method of mounting a component on a mounting surface according to
claim 7 wherein the sealant is supplied by a printing process.
11. The method of mounting a component on a mounting surface according to
claim 7 wherein the sealant is supplied by a transferring process.
12. The method of mounting a component on a mounting surface according to
claim 7 wherein at least one of the electrical bonding areas of the
component and the mounting surface is a bump.
13. A method of electrically interconnecting and sealing an electronic
component with at least one electrode onto a mounting surface with at
least one conductor land comprising the steps of:
applying a sealant material to one or both of the component and mounting
surface in a predetermined amount;
aligning-the component and mounting surface to position the electrode and
conductor land for operative contact;
pressing the sealant material between the component and the mounting
surface to provide a predetermined sealed area;
apply a force to create a frictional welding of the electrode to the
conductor land; and
setting the sealant material to complete the desired seal.
14. The method of claim 13 further comprising the step of imaging the
sealant material applied, comparing the sealant image with a predetermined
image and adjusting the amount of sealant applied based on the comparison
result.
15. The method of claim 14 wherein the sealant material is applied to the
electronic component adjacent the electrode and subsequently imaged before
aligning with the mounting surface.
16. The method of claim 14 further comprising the step of providing a
plurality of sealant materials; and matching a specific sealant material
with a specific electronic component automatically before applying the
matched sealant.
17. The method of claim 14 further comprising the step of storing
information data on several different types of electronic components,
including image data; selecting a specific electronic component; imaging
the selected electronic component; and determining from the image of the
selected electronic component and the stored information data the specific
type of electronic component and selecting a specific sealant material to
be applied.
18. The method of claim 17 further comprising the step of determining the
amount of force to be applied from the stored information data to the
selected electronic component.
19. The method of claim 13 wherein the applied force is an ultrasound
vibrating force.
20. The method of claim 19 wherein the applied force is between 500 g and
5,000 g.
21. The method of claim 13 wherein the sealant material has a viscosity
range of 2,000 cps to 10,000 cps.
22. The method of claim 13 further including the step of heating the
sealant material to set the sealant material simultaneously with welding
of the electrode to the conductor.
23. A method of electrically interconnecting and sealing an electronic
component with at least one electrode onto a mounting surface with at
least one conductor land comprising the steps of;
applying a sealant material between the electronic component and the
mounting surface to encompass the electrode and the conductor land; and
apply a force to frictionally weld the electrode and the conductor land to
provide an electrical connection and a sealing of the electrical
connection.
Description
BACKGROUND OF THE INVENTION
1. Technical Field of the Invention
The present invention relates to component mounting method and apparatus
wherein a component is mounted on a mounting surface by bonding their
respective metallic electrical bonding interconnects. In particular, it
describes the process of and apparatus for manufacturing an electronic
circuit substrate wherein electronic components such as bare IC chips are
mounted on substrates such as printed-wiring circuit boards.
2. Description of Prior Art
Bare IC chips are formed of a semiconductor wafer on which circuit patterns
are fabricated using thin-film forming techniques and mounted on a printed
board for manufacturing an electronic circuit board. As shown in FIG. 11,
electrodes 107 are prefabricated in a circuit pattern on a bare IC chip
103 to be electrically connected to conductor lands 109 formed on a
printed-wiring board 104. For mounting such bare IC chip 103 on the
circuit board 104, a surface mount method is used wherein the bonding face
103a of the IC chip 103 where the electrodes 7 exist and the bonding face
104a of the circuit board 104 where the conductor lands 109 exist are
brought to a face-to-face contact and fixed to each other for achieving
electrical connection between the conductor lands 109 and electrodes 107.
Sealant 111 made of resin is then filled between the bonding faces 103a,
104a as shown in FIG. 12 for encapsulating the circuit pattern including
the electrical bonding areas formed on the bonding face 103a of the IC
chip 103.
In a mounting method which has been used in recent years, a bare IC chip
103, on which metal bumps 108 have been formed upon electrodes 107 as
shown in FIG. 11 by a wire bonding process or the like, is held by suction
with a suction nozzle 114 and is brought opposite to a circuit board 104
at a predetermined location, where the bumps 108 are pressed onto
conductor lands 109 on the circuit board 104 for bonding them in
electrical connection with each other. At the same time the bumps 108 and
conductor lands 109 are fixed to each other with adhesive 112 that may be
supplied in advance to bumps 108 or conductor lands 109 or with solder
paste that assists electrical bonding of metal interconnects. The bare IC
chip 103 is thus mounted on the circuit board 104. The circuit board 104
is then held in an inclined state as shown in FIG. 12, and sealant 111 is
flowed between the bonding faces 103a, 104a of the IC chip 103 and circuit
board 104 as shown in phantom lines in the figure with the use of a
dispenser 115 or the like. Sealing is completed when the sealant 111 is
filled between the IC chip 103 and circuit board 104 as shown in solid
lines in FIG. 12.
In such method the equipment cost is high, since the process of mounting
bare IC chips 103 on circuit boards 104 and the process of dispensing
sealant 111 between the bonding faces 103, 104a of IC chip 103 and circuit
board 104 differ substantially from each other in the handling of circuit
boards and the design of operations, and are performed separately in
different apparatuses. Moreover, the sealant 111 takes time to flow into
between the bonding faces 103, 104a, wherefore the productivity is low.
For example, in the case of mounting an IC chip 103 of 10 mm.times.10 mm
size, the dispenser 115 is moved along the upper side of the IC chip from
one end to another and returned so as to apply the sealant 111 to the
entire area between the bonding faces 103a, 104a. The operation is
finished only when the sealant has filled between IC chip 103 and circuit
board 104 to the extent that a wetted portion 113 is formed around the IC
chip 103 as shown in FIG. 12. In such method it takes about 10 seconds for
the operation of mounting one IC chip 103. Furthermore, there is not much
choice of sealing materials, i.e., the sealant 111 must have a viscosity
in the range 2000 to 3000 cps, since it is poured into the very small gap
of about 50 .mu.m between the bonding faces 103a, 104a. Moreover, a
sealant 111 having such viscosity needs to be heated at a relatively high
temperature of from 40 to 60.degree. C. to set, because of which the
operation time is further increased. It is also undesirable in the
interest of economy in energy since heat consumption is high.
In addition, there is a risk that fillers contained in the sealant 111 that
is poured in between the bonding faces 103a, 104a may be distributed in
stripes, causing a sealing failure. Also, since electrical connection
between bumps 108 of IC chips 103 and conductor lands 109 of circuit
boards 104 is accomplished only by mutual contact, a defective bond is
sometimes formed, even though the electrical bonding areas on IC chips and
circuit boards are fixed with each other with adhesive 112 and sealant
111. The yield of product is thereby decreased. The bumps 108 and lands
109 may be fixed with each other using solder paste, which will, however,
result in consumption of more heat and time for heating solder paste and
for letting it set.
SUMMARY OF THE INVENTION
An object of the present invention is to provide a method and an apparatus
for mounting components in which electrical bonding of components on a
mounting surface is achieved without failure in a short period of time
with simple equipment and low heat consumption.
To accomplish the above object, the component mounting method according to
the present invention comprises the steps of: supplying a sealant to one
or both of the component and mounting surface; placing the component in
proximity to the mounting surface; pressing an electrical bonding area of
the component tightly to an electrical bonding area of the mounting
surface, whereby the sealant is compressed and filled between the
component and mounting surface in a required area; and generating friction
between the electrical bonding areas of the component and the mounting
surface in tight contact with each other by moving the component and
mounting surface relative to each other, whereby both of the electrical
bonding areas are melted and welded together.
By the above method, the sealant can be forcibly and instantaneously filled
in a required area between the component and mounting surface without any
additional operation or time. Therefore, the bonding of both electrical
bonding areas and the filling of the sealant can be achieved with one
operation in a short time. There are no viscosity restrictions on the
sealant as in the case of the flowing method and a sealant of high
viscosity can be used, wherefore the sealant can be set in a short time at
a low temperature during the above operation. The component mounting can
thus be accomplished with simple operation and apparatus in a short period
of time with low heat consumption. Moreover, the electrical bonding areas
are securely welded together by melting metal, whereby the formation of a
defective bond is prevented and the yield is improved. The production cost
can be accordingly reduced.
In particular, when pressure-welding the electrical bonding areas of the
component and mounting surface by friction therebetween, the metal welding
can be swiftly performed if ultrasonic vibration is applied to the
component thereby ultrasonically bonding the electrical bonding areas.
The sealant is supplied in advance to at least one of the bonding faces of
the component and mounting surface. Since it is provided in a mass, air is
hardly mixed therein. Alternatively, the sealant may be coated using a
dispenser, printed, or transferred at an appropriate time. Either way, the
sealant can be fed simply and swiftly during or in association with the
operations for handling the component or mounting surface.
By using a bump for at least one of the electrical bonding areas of the
component and the mounting surface, the ultrasonic bonding of the local
electrical bonding areas of the component and mounting surface can be
achieved easily and securely with a sufficient amount of metal and without
being interfered by other elements.
In order to achieve the above objects, the component mounting apparatus of
the present invention comprises a component feeding section for feeding
components to a predetermined location; a mounting surface handling device
for handling and positioning a mounting surface at a predetermined
location for component mounting and for transferring the mounting surface
to other places; a component handling device having a component handling
tool for picking up the component fed from the component feeding section,
bringing a bonding face of the component into tight contact with a bonding
face of the mounting surface, and pressing the component onto the mounting
surface; an ultrasonic vibration device for applying ultrasonic vibration
to the component held by the component handling tool through this tool;
and a controller, wherein the controller performs controlling of the above
sections and devices such that a metallic electrical bonding area of the
component is located to face a metallic electrical bonding area of the
mounting surface at the component mounting position, and both are tightly
pressed to each other, so that a sealant that is supplied in advance to
one of the bonding faces of the component and the mounting surface is
compressed and filled between both bonding faces in a required area, and
at the same time the ultrasonic vibration device is activated so as to
ultrasonically bond the electrical bonding areas of the component and the
mounting surface together. With the above apparatus, the above described
method can be automatically implemented stably at a high speed by the
control of the controller in accordance with a predetermined program.
By providing a sealant feeder for supplying the sealant to one of the
bonding faces of the component and the mounting surface before the
component and the mounting surface are located to face each other, the
sealant feeder being activated by the controller, a single apparatus can
automatically perform the component mounting operation including the
process of supplying sealant to one of the component and mounting surface.
The application conditions of sealant fed by the sealant feeder may be
varied by means of the controller in accordance with the type of component
to be mounted. In this way the sealant can be applied in a suitable amount
and in a favorable condition for various types of components that differ
from each other in terms of the size of their bonding faces, and sealing
conditions that may vary depending on the types of component can also be
automatically varied. The type of component being mounted can be
recognized by any of manually inputted component data, component data
stored in mounting program data, and component data read from the
component being fed or its support member.
By providing a detector for detecting the amount of sealant from the
information obtained by recognizing images of the sealant filled between
the component and mounting surface, the amount of sealant fed from the
sealant feeder can be corrected by the controller in accordance with the
detected amount of sealant. In this way, even if the amount of sealant in
a predetermined condition increases or decreases for some unknown reasons,
it can be corrected automatically so that favorite sealing is constantly
achieved.
The mounting surface handling device feeds the mounting surface such that
its bonding face is upwards for mounting operation, whereas the component
feeding section feeds the component with its bonding face upwards where
the electrical bonding area exists, and the component handling device
comprises a flipping device which picks up the component from above and
turns the component handling tool so that the bonding face of the
component faces down, and a bonding device equipped with the ultrasonic
vibration device, which picks up the component from above of which bonding
face has been turned upside down and feeds the component for the
ultrasonic bonding operation on the mounting surface at the component
mounting position. Components that are fed with their active faces upwards
such as bare IC chips can be mounted in order on a mounting surface that
also faces upwards by such actions of the flipping device and bonding
device cooperating with each other.
The sealant can be cured simply by being left, but if a heater for heating
the sealant directly or indirectly is provided at least at the component
mounting position, the setting of the sealant can be forcibly completed at
the same time when the bonding of the component on the mounting surface is
finished. Instead of heating by a heater, the sealant may also be cured
using light such as ultraviolet.
While novel features of the invention are set forth in the preceding, the
invention, both as to organization and content, can be further understood
and appreciated, along with other objects and features thereof, from the
following detailed description and examples when taken in conjunction with
the attached drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a cross-sectional view showing major parts in one embodiment of
the mounting method and apparatus of the present invention;
FIG. 2 is a diagram given in explanation of one example of how to apply a
sealing material on the bonding face of a component;
FIG. 3 is a diagram given in explanation of another example of how to apply
a sealing material on the bonding face of a component;
FIG. 4 is a diagram given in explanation of yet another example of how to
apply a sealing material on the bonding face of a component;
FIG. 5 is a perspective view schematically showing the overall construction
of one embodiment of the component mounting apparatus of FIG. 1;
FIG. 6 is a perspective view showing a bonding stage disposed at a
component mounting position in the apparatus shown in FIG. 5;
FIG. 7 is a perspective view showing a flipping device of the component
handling device in the apparatus shown in FIG. 5;
FIG. 8 is a perspective view showing a bonding device of the component
handling device in the apparatus shown in FIG. 5;
FIG. 9 is a cross section of the bonding device of FIG. 8;
FIG. 10 is a block diagram showing the main control system of a controller
in the apparatus of FIG. 5;
FIG. 11 is a cross-sectional view showing a state in a prior art component
mounting method wherein a component is temporarily mounted on a board; and
FIG. 12 is a cross-sectional view showing a state in a prior art component
mounting method wherein the component which has been temporarily mounted
on the board is sealed.
DESCRIPTION OF PREFERRED EMBODIMENTS
Preferred embodiments of a component mounting method and an apparatus of
the present invention will be hereinafter described with reference to FIG.
1 through FIG. 10.
FIGS. 5 and 10 show an aspect of the embodiment whereby each bare IC chip 3
that is diced from a semiconductor wafer 1 on a dicing sheet 2 is handled
as a component and mounted on a mounting surface or a circuit board 4,
such as a printed-wiring board, and then the metal electrical bonding
areas of the chip and the board are ultrasonically bonded by the friction
created when ultrasound vibration is used to cause the chip and board to
move in opposite directions against each other.
FIG. 1 shows an embodiment where the electrical bonding area 5 of the IC
chip 3 is formed as a metallic bump 8 provided by wire bonding technique
on an electrode 7 fabricated by film-forming technique on a semiconductor
wafer 1, and the electrical bonding area 6 of the circuit board 4 is
formed as a conductor land 9 provided on its surface. It should be noted
that the present invention is not limited to this arrangement but can also
be applied to all additional cases where other electrical components and
components other than electrical components for mounting on mounting
surfaces other than circuit boards and in other arrangements; and to when
conducting melting, bonding, and mounting by pressing two electrical
bonding areas against each other and causing them to move opposite to each
other using ultrasound vibration or another method.
In a component mounting method of the embodiment the bare IC chip 3 and the
circuit board 4 are placed in proximity to each other and the bump 8 of
the bare IC chip 3 is pressure welded to the conductor land 9 of the
circuit board 4 such that a sealant 11 that was applied in advance to
either the bump or land or to both is compressed between both while
filling the space between them as shown in FIG. 1. The sealant 11 consists
of silica and resin binder, etc., and is applied in advance to the top of
the circuit board 4 as shown by the imaginary line in FIG. 1. Pressure
welding the IC chip 3 and the circuit board 4 to each other causes the
sealant 11 to spread an appropriate amount outward from around both
bonding faces 3a and 4a within the limits possessed by a wetted area 13 as
shown in FIGS. 1 and 10. At the same time ultrasonic vibration is applied
to the bare IC chip 3 with the bump 8 of the bare IC chip 3 pressed
against the conductor land 9 of the circuit board 4 as described above to
cause friction in the direction of the arrow shown in the figure to melt
the bump 8 and the land 9 to create ultrasonic fusion. As a result, the
welded bonding area 10 creates an electrical contact between the bare IC
chip 3 and the circuit board 4.
When applying ultrasound while pressure welding the bump 8 of the bare IC
chip 3 to the conductor land 9 of the circuit board 4, it is preferred
that a suction nozzle 14, for example, be used as the automatic component
handling tool for mounting the bare IC chip 3. The mounting apparatus of
this embodiment employs a voice coil motor 15 as shown in FIG. 5 to raise
and lower the suction nozzle 14 to apply an electromagnetic pressure of
500 g to 5 kg to effect the above-mentioned pressure welding. A horn 17
which receives the vibration from a piezoelectric element 16 is connected
to the suction nozzle 14 as shown in FIG. 8, and to the suction nozzle 14
is applied an ultrasonic vibration with a frequency of 60 KHz and an
amplitude of 1 to 2 .mu.m to cause friction between the above-mentioned
bump 8 and conductor land 9 that are pressed together. Depending on the
type of component, however, a variety of component handling tools, such as
those that use a chuck, adhesion, or screws to hold the components, can be
used as long as an ultrasonic vibration is applied to the component being
handled through the component handling tool. To prevent the suction nozzle
14 from being broken by the above-mentioned ultrasonic vibration, a
support shaft 81 is connected through the agency of a flexible tube 82 to
the horn 17 as shown in FIG. 9, and the suction from the support shaft 81
side also reaches the suction nozzle 14 via the flexible tube 82. But this
has not been limited to a specific configuration, and a variety of designs
are possible.
When the bond that results from the melting caused by the friction between
the electrical bonding areas 5 and 6 is effected by the above-mentioned
application of ultrasonic vibration to at least one of the component or
mounting surface the required time is shortened by in units of 1/10 sec.
The present invention is not limited to this method and it is also
possible to melt and bond the electrical bonding areas 5 and 6 from the
friction created by simply moving the component and mounting surface in
opposite directions to each other.
In this manner, when the bump 8 of the bare IC chip 3 and the conductor
land 9 of the circuit board 4 are pressed against each other, the
electrical bonding areas 5 and 6 of the bare IC chip 3 and circuit board
4, respectively, are melted to create an electrical connection through
ultrasonic bond while at the same time the sealant 11 that is applied in
advance to at least one of the bonding faces 3a and 4a of the bare IC chip
3 and circuit board 4, respectively, is compressed by the contact between
both bonding faces 3a and 4a and forced to instantaneously fill the
required area. Therefore, special work or time is not required to apply
the sealant 11, so the electrical contact between the bump 8 and the
conductor land 9 and the filling of the sealant 11 in the required area
can be done in a short time during one operation and with just one
apparatus.
In addition, there are no viscosity restrictions on the sealant 11 that is
used as there are when using the flowing method. For example, a wide
viscosity range of 2,000 to 10,000 cps can be set, so highly viscous
substances can be used to achieve hardening in a short period of time
while the above-mentioned work is conducted at a low temperature of
25.degree. C. for example. The types of the sealant 11 include epoxy
compounds, acrylic compounds, and polyimide compounds. In this embodiment
the sealant 11 is composed of a filler such as silicone, and a binder
consisting of an adhesive obtained by mixing an acid anhydride or phenyl
compound as a resin hardener to the above mentioned resin. The sealant 11
is not limited to these, however, for a variety of substances that will be
developed hereafter can be used.
In accordance with the present invention, mounting of a component to a
mounting surface can be conducted with one simple operation and a single
apparatus in a short time with little heat consumption. Because the
electrical bonding areas 5,6 such as the bump 8 and the conductor land 9
are fused by melting metal together, they make good interconnections, so
defects from poor contacts are eliminated and yield is improved. The
product cost is accordingly reduced. Incidentally, the time required to
mount the 10 mm.times.10 mm bare IC chip 3 on the circuit board 4 using
ultrasonic bonding together with a sealing processing was shortened to
about 0.4 sec.
The sealant 11 is supplied to either or both of the bonding faces 3a, 4a of
the bare IC chip 3 and circuit board 4 in a mass as shown in phantom lines
in FIG. 1 and in broken lines in FIG. 2. In this way, no air is mixed into
the sealant. The sealant 11 may be coated using a dispenser 62 from below
or above as respectively shown in FIGS. 3 and 10, or may be provided by a
printing or transferring process. Especially when depositing sealant 11 on
a surface facing downwards, printing or transferring should preferably be
used since there will be no dripping of the sealant. Alternatively, the
sealant 11 can be applied to the bonding face 3a of the bare IC chip 3
held by the suction nozzle 14 by contacting the IC chip 3 to a heap of
sealant 11 as shown in FIG. 2.
These operations can be performed simply in a short period of time
utilizing a time lag between operations for handling bare IC chips 3 or
circuit boards. Alternatively, it may be performed as one of preparatory
processes associated with the handling of bare IC chips 3 or circuit
boards 4 depending on cases.
A bump may be formed on conductor land 9 on circuit board 4 in place of or
in addition to bump 8 on electrode 7 of chip 3 as shown in FIG. 1 and FIG.
2. Provision of such bump on at least one of electrical bonding areas of
chip 3 and circuit board 4 enables local ultrasonic bonding to be
performed securely with a sufficient amount of metal and without being
interfered or damaged by other parts.
The component mounting apparatus of this embodiment shown in FIG. 5
comprises a component feeding section 21 where components such as bare IC
chips 3 are fed to a predetermined position A, a mounting surface handling
device 22 by which a mounting surface such as circuit board 4 is fed to a
component mounting position B and transferred to a next step after chips
have been mounted thereon, a component handling device 23 having the
component handling tool or the suction nozzle 14 for bringing a component
to a position opposite to circuit board 4 so that the bonding face 3a of
IC chip 3 where electrical bonding areas 5 or bumps 8 exist and the
bonding face 4a of circuit board 4 where electrical bonding areas 6 or
conductor lands 9 exist face each other and their electrical bonding areas
5,6 are pressure-welded, an ultrasonic vibration device 24 for applying
ultrasonic vibration to the component through the component handling tool
such as suction nozzle 14, and a controller 25. The controller 25 controls
the above sections and devices such that at the component mounting
position B, the bare IC chip 3 handled by the component handling device 23
is brought to a face-to-face contact with the circuit board 4 handled by
the mounting surface handling device 24 and pressed thereto so as to
compress the sealant 11 that is provided in advance to either one of the
bonding faces 3a, 4a and to fill same in a required area, and at the same
time the ultrasonic vibration device 24 is activated for ultrasonic
bonding electrical bonding areas such as bumps 8 and conductor lands 9
with each other. The above process can be automatically performed stably
at a high speed by means of the controller 25 which execute control in
accordance with predetermined program data as shown in FIG. 10.
Preferably but not limited, microcomputers may be used for the controller
25. Various other construction and modes for controlling operations of the
apparatus may be employed. Program data 26 may be stored in a memory
inside the controller 25 or in an outer memory, or may take any other form
or structure such as a hardware circuitry for performing sequence control.
In the example shown in FIG. 5, the mounting surface handling device 22 is
disposed in the front part of a base body 31, where the circuit board 4 is
handled such that its bonding face 4a is upwards, so that IC chips can be
readily mounted thereon from above. The mounting surface handling device
22 comprises a loader 33 at one end of rails 32 and an unloader 34 at the
other end thereby constituting a transfer mechanism for transporting a
circuit board 4 in a direction X. The mounting surface handling device 22
may be constructed such as to transport the circuit board by other types
of carrier in accordance with the size and shape of mounting surface. The
rails 32 include an independent portion 32a immediately downstream of
loader 33 as shown in FIG. 5 and FIG. 6, which is the area defined as the
component mounting position B. Behind the rails 32 a bonding stage 35 is
provided that holds the rail 32a together with a circuit board 4 received
on the rail 32a by suction from below. The rail 32a and the bonding stage
35 are supported on a Y-direction table 36 and thereby moved in a
direction Y orthogonal to the aforementioned direction X between a
delivery position B1 where the rail 32a is aligned in single file with the
rails 32 and an operating position B2 therebehind where the component
mounting is performed.
When a circuit board 4 carried in from loader 33 arrives at the component
mounting position B on rail 32a, it is received on bonding stage 35 at a
predetermined location defined by a stopper 30a shown in FIG. 6, and is
positioned by a locator 30b which presses circuit board 4 towards one side
of rail 32a. After being located, the circuit board 4 is held by suction
on bonding stage 35. Meanwhile, bonding stage 35 itself is moved and
located at the operating position B2 thereby feeding circuit board 4 for
mounting operation. After component installing is completed at operating
position B2, bonding stage 35 moves to the delivery position Bl and
releases circuit board 4 for allowing it to be fed downstream and
transferred to unloader 34 where it is discharged for a next step. Thus a
multiplicity of circuit boards 4 are successively fed for mounting
operation and electronic circuit boards can be continuously manufactured.
Loader 33 and bonding stage 35 respectively have a preliminary heater 33a
and main heater 35a as shown in FIG. 5 and FIG. 6. Circuit board 4 is
first heated at preliminary heater 33a and then heated at main heater 35a
so that a sealant 11 filled between circuit board 4 and bare IC chip 3 is
heated to a temperature of about 25.degree. C. Because of such low
temperature heating the sealant 11 can be cured during chips 3 are
ultrasonically bonded on a circuit board 4. Preliminary heating may be
omitted but should preferably be performed for smooth heating. Light such
as ultraviolet may also be used for setting sealant 11.
Component feeding section 21 is disposed behind rails 32 downstream of
component mounting position B and comprises a component magazine 38 in
which bare IC chips 3 diced from a semiconductor wafer 1 on a dicing sheet
2 are stocked. Component magazine 38 is moved upward and downward by a
magazine lifter 41. Magazine lifter 41 determines the height of component
magazine 38 such that a dicing sheet 2 carrying thereon a desired type of
chips 3 is positioned opposite to a discharge means (not shown). Dicing
sheet 2 pushed or pulled out is held and spread on an expand stage 37 so
that the IC chips 3 are distanced from each other and readily picked up.
Expand stage 37 is moved in X and Y directions by tables 42, 43
respectively so that the chip 3 on dicing sheet 2 which is to be picked up
is located at a component feeding position A where chips are thrust
upwards by a push-up pin 44. When the feeding of IC chips 3 is completed
or the types of IC chips 3 need to be changed, the dicing sheet 2 on
expand stage 37 is accordingly exchanged with another. Thus various kinds
of IC chips 3 are successively and automatically fed and mounted as
required. It should be noted that the component feeding section 21 may be
arranged variously according to the types and feeding modes of components
to be mounted, and may be disposed in combination with various other types
of component feeders.
Since the circuit board 4 is fed with its bonding face 4a upwards while the
component feeding section 21 supplies IC chips 3 with their bonding faces
upwards in this embodiment, the component handling device 23 comprises a
flipping device 23a and a bonding device 23b as shown in FIG. 5 and FIG.
7. Flipping device 23a picks up a component with a component handling tool
such as a suction nozzle 45 from above and turns over the component upside
down. More specifically, flipping device 23a turns the component handling
tool around a point on its suction face 45a or a point C somewhat off from
the suction face 45a so as to turn over the component 3. Bonding device
23b equipped with ultrasonic vibration device 24 as shown in FIG. 8 and
FIG. 9 then picks up the component 3 and feeds it for ultrasonic bonding
on circuit board 4 at the component mounting position B.
IC chips 3 may be fed on a dicing sheet 2 spread on expand stage 37,
whether used alone or in combination with other parts feeders which supply
components in a different form. When mounting these components in a great
number in succession, IC chips 3 on the dicing sheet 2 are first picked up
and turned over by the flipping device 23a. The bonding device 23b then
picks up the component from above and presses it to the bonding face 4a of
the circuit board 4 at the component mounting position B for
ultrasonically bonding bumps 8 and conductor lands 9. The flipping device
23a and bonding device 23b cooperate with each other in mounting chips 3
fed with their faces upwards on a circuit board 4 continuously as
described above.
Referring to FIG. 5 and FIG. 7, flipping device 23a comprises a base 57, a
motor 51, a shaft 52 driven to rotate by motor 51, and a flipping head 54
equipped with one or a plurality of component handling tools or suction
nozzles 45 as in this embodiment mounted around shaft 52. Base 57 is moved
by a table 56 in a direction X between the component feeding position A
where the flipping device 23a picks up chips 3 and the delivery position D
where it delivers the inverted chip to the bonding device 23b. Suction
nozzle 45 is advanced and retracted on flipping head 54 in an axial
direction by means of an air cylinder 55.
Suction nozzle 45 is faced downward and moved up and down at component
feeding position A for picking up chips 3, and then is turned around the
point C mentioned before to be upwards for turning over the chip 3 before
feeding it to the bonding device 23b at delivery position D.
Bonding device 23b having the suction nozzle 14 is moved between delivery
position D and mounting position B by a table 58 in direction X, whereby
bonding device 23b performs ultrasonic bonding operation repeatedly such
that it picks up a bare IC chip 3 with its bonding face 3a down at
delivery position D, and moves to the operating position B2 for
pressure-welding the IC chip at a predetermined position on a circuit
board 4 located in a certain position. In this way bare IC chips that are
fed from the component feeding section 21 with their bonding faces 3a
upwards can be mounted on circuit boards 4 as required by the flipping
device 23a and bonding device 23b cooperating with each other. The
construction may be arranged such that the flipping device 23a is set
stationary at component feeding position A whereas the bonding device 23b
is capable of moving between feeding position A and mounting position B,
or conversely, the flipping device 23a may be moved from feeding position
A to mounting position B while the bonding device 23b stays at mounting
position B.
The combination of movements of bonding device 23b in the direction X and
movements of bonding stage 35 in the direction Y enables a chip 3 to be
mounted at any location on circuit board 4. The construction should not be
limited to this example and may be variously arranged.
Both flipping device 23a and bonding device 23b are not necessarily be
moved linearly but in various other forms including non-linear movements,
and various components including IC chips may take any movement paths.
The apparatus of this embodiment shown in FIG. 5 further has a sealant
feeder 61 for supplying sealant 11. Controller 25 controls the mounting
surface handling device 22, component handling device 23, and sealant
feeder 61 such that the sealant 11 is applied to at least one of bonding
faces 3a, 4a of IC chip 3 and circuit board 4 before they are located to
face each other. In this way, a single apparatus automatically performs
both of the process of providing sealant 11 to at least one of the IC chip
3 and circuit board 4, and the process of mounting IC chips on circuit
boards 4.
Sealant feeder 61 may be, for example, disposed such as to be moved in the
direction X together with bonding device 23b by the table 58 as shown in
FIG. 5. By way of example, sealant feeder 61 in this embodiment operates
such that when it is moved to component mounting position B, it lowers a
dispenser 62 by means of a cylinder 63 for feeding sealant 11 on the
bonding face 4a of circuit board 4 as shown in phantom lines in FIG. 1.
After the feeding is completed, dispenser 62 is lifted and sealant feeder
61 is retreated sidewards. At the same time the bonding device 23b moves
to component mounting position B and presses the IC chip 3 down upon the
sealant 11 on circuit board 4 with the suction nozzle 14.
The application conditions of sealant 11 fed by the sealant feeder 61 can
be varied by means of the controller 25 in accordance with the type of
component to be mounted. Therefore, sealant 11 can be applied in a
suitable amount and in a favorable condition for each of various types of
components that differ from each other in terms of the size of their
bonding faces. Sealing conditions that may vary depending on the type of
component can also be automatically varied. Air is blown into the
dispenser 62 so as to compress and discharge sealant 11 in a fixed amount.
As shown in FIG. 10, the amount of dispensed sealant 11 can be adjusted by
controlling a solenoid valve 64 for air supply and a pressure adjusting
valve 65. It is also possible to provide several different types of
sealant feeders 61 and to change the modes of application of sealant by
selectively using a suitable sealant feeder according to the purposes. For
example, there may be set two modes; in one mode the sealant is provided
in a mass and in another mode the sealant is coated to the entire surface
of the bonding face. Alternatively, the construction may be such that the
surface to which sealant 11 is provided is switched over from one of the
bonding faces 3a, 4a to another or to both of them.
The type of component being mounted can be recognized by any of component
data 71 that are inputted manually, program data 26 for controlling
mounting operation, component data stored in an inner or outer memory 70,
and component data read from marks indicative of type of component such as
a bar code 72 provided to the component being fed from the component
feeding section or a support member of components such as dicing sheet 2
or tray (not shown). A recognition camera 73 is provided at the component
feeding position A for recognizing the type of component from its image.
Another recognition camera 74 is provided at the operating position B2 of
the component mounting position B such as to be operable both upwards and
downwards for recognizing the attitude of the component held by the
suction nozzle 14 for chip alignment and the condition of the bonding face
of the circuit board 4 from the picked-up images. The above mentioned data
concerning the type of component can be read using these recognition
cameras 73, 74. The image of component data taken by the cameras can then
be recognized using an image processing circuit 75 provided for processing
image data of images picked up by recognition cameras 73, 74. Therefore,
no additional device for image recognition of component data is necessary.
Controller 25 has a detector 25a as its inner function for detecting the
amount of sealant 11 after a bare IC chip has been mounted on a circuit
board 4 based on the information obtained by picking up images of the
sealant 11 filled between the IC chip 3 and circuit board 4 by the
recognition camera 74, and by recognizing the presence and size of the
wetted portion 13 by the image processing circuit 75 from these images.
Controller 25 then corrects the amount of sealant 11 fed by sealant feeder
61 correspondingly to the detected amount of sealant. In this way, even if
the amount of sealant 11 in a predetermined condition increases or
decreases for some unknown reasons, the amount of sealant can be corrected
automatically so that favorite sealing is constantly achieved. Furthermore
a monitor 76 is connected to the image processing circuit 75 so that an
operator can monitor the above described image recognition process.
Although the present invention has been fully described in connection with
the preferred embodiment thereof, it is to be noted that various changes
and modifications apparent to those skilled in the art are to be
understood as included within the scope of the present invention as
defined by the appended claims unless they depart therefrom.
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