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United States Patent | 6,173,576 |
Ishida ,   et al. | January 16, 2001 |
A cooling unit for an integrated circuit. The cooling unit may include a peltier device that may be coupled to the integrated circuit and a plurality of fins that are thermally coupled to the peltier device. The fins may be separated by at least one channel. The cooling unit may include a fan that generates a flow of fluid through the channel.
Inventors: | Ishida; Kenzo (Ibaraki-ken, JP); Inoue; Shuji (Ibaraki-ken, JP) |
Assignee: | Intel Corporation (Santa Clara, CA) |
Appl. No.: | 276254 |
Filed: | March 25, 1999 |
Current U.S. Class: | 62/3.7; 62/259.2 |
Intern'l Class: | F25B 021/02; F25D 023/12 |
Field of Search: | 62/3.2,3.7,259.2 |
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