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United States Patent | 6,135,855 |
Vanell | October 24, 2000 |
Chemical mechanical planarization (CMP) of semiconductor wafers presents a harsh abrasive and chemical environment for equipment used in a polishing process. Prior art translation mechanisms are prone to failure due to corrosion and require maintenance that exposes the polishing process to contamination from lubricants. A translation mechanism (31) requiring no lubrication is designed to have maintenance at intervals greater than a CMP tool. The translation mechanism (31) includes a housing (32) and a moveable mount (33). The housing (32) and the moveable mount (33) are made of hardened stainless steel which is impervious to the CMP environment. Bearing shafts (39) buffer a threaded shaft (36) from side loading on the moveable mount (33). Polymer bearings (51) connected to moveable mount (33) provide a low friction contact surface to bearing shafts (39). A polymer translation nut (41) connects to the moveable mount (33) and is threaded onto the threaded shaft (36).
Inventors: | Vanell; James F. (Tempe, AZ) |
Assignee: | Motorola, Inc. (Schaumburg, IL) |
Appl. No.: | 124722 |
Filed: | July 30, 1998 |
Current U.S. Class: | 451/14; 451/288 |
Intern'l Class: | B24B 047/00 |
Field of Search: | 451/288,287,14,19,443,444,72,41 508/100,101 |
2998397 | Aug., 1961 | Riesing | 508/100. |
4604833 | Aug., 1986 | Kimura et al. | 451/14. |
5456627 | Oct., 1995 | Jackson et al. | 451/57. |
5499942 | Mar., 1996 | Pflager | 451/14. |