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United States Patent | 6,130,448 |
Bauer ,   et al. | October 10, 2000 |
A package that encapsulates an integrated circuit optical sensor and mounts on a support substrate includes a base substrate constructed of an insulating material. The optical sensor bottom surface is bonded to the base substrate top surface. Conductive strips on the base substrate top surface extend from a region near the optical sensor to an edge of the base substrate top surface. Wires are bonded on one end to a sensor bonding pad for which connection is desired and on the other end to a corresponding conductive strip. A window is bonded to the base substrate top surface in a spaced-apart relationship using seal material extending around the sensor enclosing each wire bond. Various means are provided for connecting each conductive strip to a corresponding trace on the support substrate. An electrochromic variable attenuator may be formed on the window, allowing control over the intensity of light striking the optical sensor.
Inventors: | Bauer; Fred T. (Holland, MI); Stam; Joseph Scott (Holland, MI) |
Assignee: | Gentex Corporation (Zeeland, MI) |
Appl. No.: | 137909 |
Filed: | August 21, 1998 |
Current U.S. Class: | 257/222; 257/215; 257/291; 257/434; 257/692; 257/E31.118 |
Intern'l Class: | H01L 027/148 |
Field of Search: | 257/432,433,434,291,215,222,680,642,696,704 361/387 |
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