Back to EveryPatent.com
United States Patent | 6,129,610 |
Stephens | October 10, 2000 |
A chemical-mechanical planarization (CMP) process is provided whereby cyclical pressure means varies the force against the wafer and polishing pad during the planarizing operation with the planarizing pad specially defined to have a relaxation time which is correlated with the force cycle so that the planarizing is enhanced. The relaxation time of the pad is greater than the downward an/or upward force cycle time on the wafer or pad and provides a planarizing process wherein the height of the pad during planarization is intermediate between a decompressed pad position and a compressed pad position typically encountered in a conventional CMP process.
Inventors: | Stephens; Jeremy K. (Ossining, NY) |
Assignee: | International Business Machines Corporation (Armonk, NY) |
Appl. No.: | 134718 |
Filed: | August 14, 1998 |
Current U.S. Class: | 451/41; 451/36; 451/63; 451/160 |
Intern'l Class: | B24B 001/00 |
Field of Search: | 451/41,36,63,160,164,170,285-290,286,304,305,307 |
4270316 | Jun., 1981 | Kramer et al. | |
4313284 | Feb., 1982 | Walsh. | |
4910155 | Mar., 1990 | Cote et al. | |
4918869 | Apr., 1990 | Kitta. | |
5036630 | Aug., 1991 | Kaanta et al. | |
5104828 | Apr., 1992 | Morimoto et al. | |
5423716 | Jun., 1995 | Strasbaugh. | |
5486129 | Jan., 1996 | Sandhu et al. | |
5486265 | Jan., 1996 | Salugsugan. | |
5522965 | Jun., 1996 | Chisholm et al. | |
5647792 | Jul., 1997 | Katsuoka et al. | |
5722879 | Mar., 1998 | Cronin et al. | |
5769697 | Jun., 1998 | Nishio. | |
5839947 | Nov., 1998 | Kimura et al. |
Teres .TM.CMP System--Linear Planarization Technology (LPT) Lam Research Bulletin 1998. Linerar Planarization Technology .TM.On Track Systems Inc., Product Bulletin. |