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United States Patent | 6,104,619 |
Shigehiro | August 15, 2000 |
A tape carrier package (TCP) and method of fabricating a tape carrier package (TCP) are provided to reduce a width dimension in a slim tape carrier package (TCP) used in a flat-panel display apparatus, such as a liquid crystal display (LCD) apparatus. While some margin in width is necessary for absorbing the spreading of potting resin that seals a driver integrated circuit (IC), the spreading is limited within a narrow area by providing a configuration that is formed of an insulating film on a flexible insulating board. An insulating-film-omission region for not arranging an insulating film is installed within a band of the insulating film for covering a group of wirings on the insulated film board and is arranged to surround the mounting region of the driver integrated circuit (IC). The insulating-film-omission region serves for storing the sealing resin, while an inner edge of the band of the insulating film serves as a levee for preventing the sealing resin from wetting and spreading.
Inventors: | Shigehiro; Koji (Tokyo, JP) |
Assignee: | Kabushiki Kaisha Toshiba (Kawasaki, JP) |
Appl. No.: | 210803 |
Filed: | December 15, 1998 |
Dec 16, 1997[JP] | 9-346574 |
Current U.S. Class: | 361/749; 257/668; 257/690; 257/734; 257/735; 257/E23.055; 257/E23.124; 349/150; 361/748; 361/751; 361/760; 361/762 |
Intern'l Class: | H05K 007/02 |
Field of Search: | 361/749,748,751,760,762,767,772,764 257/668,690,734,735,736,737,780 349/150 |
5569964 | Oct., 1996 | Ikebe | 257/780. |
5614760 | Mar., 1997 | Osono et al. | 257/668. |
5659198 | Aug., 1997 | Okutomo et al. | 257/659. |
5726491 | Mar., 1998 | Tajima et al. | 257/668. |
5821614 | Oct., 1998 | Hashimoto et al. | 257/679. |
5841188 | Nov., 1998 | Murasawa | 257/668. |
5844307 | Dec., 1998 | Suzuki et al. | 257/690. |
5952717 | Sep., 1999 | Taniguchi et al. | 257/734. |
5963287 | Oct., 1999 | Asada et al. | 349/150. |
5977617 | Nov., 1999 | Kata | 257/668. |