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United States Patent | 6,043,490 |
Sakai | March 28, 2000 |
Mechanical vibration detecting sensors and a sound wave sensor are provided in a column, and mechanical vibration detecting sensors, a sound wave sensor and electromagnetic wave detecting antennas are provided in a sample stage side. Outputs of the sensors and the antennas are processed by signal processing circuits and correction signals generated by these signal processing circuits are added to X-direction and Y-direction scanning signals from signal generating circuits.
Inventors: | Sakai; Katsuhiko (Kawasaki, JP) |
Assignee: | Hitachi, Ltd. (Tokyo, JP) |
Appl. No.: | 012757 |
Filed: | January 23, 1998 |
Jan 27, 1997[JP] | 9-012399 |
Current U.S. Class: | 250/310; 250/306; 250/311; 250/440.11 |
Intern'l Class: | G06K 009/40; H01J 037/28 |
Field of Search: | 250/310,311,440.11,306 |
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