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United States Patent | 6,001,235 |
Arken ,   et al. | December 14, 1999 |
A rotary plater and method of plating are provided which improve the uniformity of plating across a plating surface of a workpiece. A plating solution distribution device is located in a plating cup between an anode and a cathode in a spaced relationship therebetween and is centered about a vertical axis of the plating cup. A motor is provided for relatively rotating the cathode and the plating solution distribution device with respect to one another. The plating solution distribution device distributes the plating solution over the plating surface at a distribution rate which increases radially outwardly from the vertical axis. With this arrangement the volume of plating solution at the outer periphery of the plating surface is enriched with ions to promote plating uniformity.
Inventors: | Arken; David M. (San Jose, CA); Chiu; Andrew (San Jose, CA); Fatula, Jr.; Joseph John (San Jose, CA); Hitzfield; Robert William (San Jose, CA); Hsiao; Wen-Chien David (San Jose, CA); Hsiao; Yiping (San Jose, CA) |
Assignee: | International Business Machines Corporation (Armonk, NY) |
Appl. No.: | 881040 |
Filed: | June 23, 1997 |
Current U.S. Class: | 205/137; 204/212; 204/224R; 204/237; 204/273; 204/DIG.7; 205/80; 205/98 |
Intern'l Class: | C25D 005/00; C25D 021/06; C25D 017/00; C25B 015/00 |
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