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United States Patent | 5,789,820 |
Yamashita | August 4, 1998 |
In a method for manufacturing a heat radiating resin-molded semiconductor device, a protrusion is formed on a side peripheral surface of a semiconductor chip, and the semiconductor chip is sealed with resin, so that spreading of the resin toward a back surface of the semiconductor chip is prevented by the protrusion. Also, a heat radiator is mounted on a back surface of the semiconductor chip.
Inventors: | Yamashita; Chikara (Tokyo, JP) |
Assignee: | NEC Corporation (Tokyo, JP) |
Appl. No.: | 808531 |
Filed: | February 28, 1997 |
Feb 28, 1996[JP] | 8-067124 |
Current U.S. Class: | 257/787; 257/706; 257/707; 257/E23.069; 257/E23.101; 257/E23.125; 257/E29.022 |
Intern'l Class: | H01L 023/28 |
Field of Search: | 257/787,668,782,666,783,730,706,707 438/122,126,127,113,977 |
5397746 | Mar., 1995 | Blish, II | 438/122. |
Foreign Patent Documents | |||
2-154482 | Jun., 1990 | JP | 257/787. |
4-245462 | Sep., 1992 | JP. | |
4-312933 | Nov., 1992 | JP | 257/783. |
6-140563 | May., 1994 | JP | 257/782. |