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United States Patent | 5,789,496 |
Tarbet ,   et al. | August 4, 1998 |
A method for the removal, separation, and concentration of cesium cations from a source solution which may contain larger concentrations of other alkali metal ions comprises bringing the source solution into contact with a polymeric resin containing poly(hydroxyarylene) ligands. The poly(hydroxyarylene) ligand portion(s) of the polymeric resins has affinity for cesium, thereby removing cesium from the source solution. The source solutions from which the cesium has been removed may then be treated or disposed of as desired and the cesium cations are then removed from the polymeric resin through contact with a much smaller volume of a receiving solution in which these cesium cations are soluble and has greater affinity for such cations than does the poly(hydroxyarylene) ligand or protonates the ligand, thereby quantitatively stripping the completed cesium cations from the ligand and recovering them in concentrated form in said receiving solution. The concentrated cesium cations thus removed may be further separated and recovered by known methods. The process is useful in the removal of cesium cations from a variety of source solutions such as from semiconductor, nuclear waste cleanup, metals refining, electric power, and other industrial enterprises. The invention is also drawn to the poly(hydroxyarylene)-ligand-containing polymeric resins.
Inventors: | Tarbet; Bryon J. (Highland, UT); Maas; Garren (Provo, UT); Krakowiak; Krzysztof E. (Provo, UT); Bruening; Ronald L. (Springville, UT) |
Assignee: | IBC Advanced Technologies, Inc. (American Fork, UT) |
Appl. No.: | 788526 |
Filed: | January 24, 1997 |
Current U.S. Class: | 525/480; 521/39; 525/7.3; 528/129; 528/148; 528/212; 528/217; 549/354 |
Intern'l Class: | C08G 063/91; B01D 015/00; B01D 039/00 |
Field of Search: | 525/480,7.3 528/129,148,212,217 521/39 549/354 210/660 |
4423159 | Dec., 1983 | Ebra et al. | 521/35. |
5143784 | Sep., 1992 | Mita | 428/336. |
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60-202113 | Oct., 1985 | JP. | |
05271149 | Oct., 1993 | JP. | |
WO91/09891 | Jul., 1991 | WO. |
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