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United States Patent | 5,778,522 |
Burns | July 14, 1998 |
A high density integrated circuit module having complex electrical interconnection is described, which includes a plurality of stacked level-one integrated circuit devices, wherein each level-one device includes an integrated circuit die and a plurality of electrical leads extending from the die; and a plurality of non-linear rails adapted to electrically and thermally interconnect selected leads of selected stacked level-one devices within the module, wherein at least some of the plurality of non-linear rail include a lead interconnect portion which is adapted to at most partially surround and receive a selected lead from one of the stacked level-one devices. Other embodiments include TSOP modules having leads reduced in width to allow additional selected non-linear rails to interconnect with select leads in the module. Strain relief for the rail/circuit board substrate connection in harsh environment applications is also provided.
Inventors: | Burns; Carmen D. (Austin, TX) |
Assignee: | Staktek Corporation (Austin, TX) |
Appl. No.: | 650721 |
Filed: | May 20, 1996 |
Current U.S. Class: | 29/830; 29/842; 29/857; 257/777; 257/E25.023; 361/735; 361/790; 439/69 |
Intern'l Class: | H05K 003/36; H01R 009/00 |
Field of Search: | 29/830,831,842,857,864 257/686,723,777 361/735,744,790,791 439/69 |
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4932873 | Jun., 1990 | LaShier | 29/842. |
4956694 | Sep., 1990 | Eide | 387/74. |
5057026 | Oct., 1991 | Sawai et al. | 439/507. |
5236117 | Aug., 1993 | Roane et al. | 228/180. |
5279029 | Jan., 1994 | Burns | 29/856. |
5279991 | Jan., 1994 | Minahan et al. | 437/208. |
5281852 | Jan., 1994 | Normington | 257/685. |
5367766 | Nov., 1994 | Burns et al. | 29/848. |
5394010 | Feb., 1995 | Tazawa et al. | 257/686. |
5475920 | Dec., 1995 | Burns et al. | 29/856. |
5499160 | Mar., 1996 | Burns | 361/790. |
5514907 | May., 1996 | Moshayedi | 257/686. |
5523619 | Jun., 1996 | McAllister et al. | 257/686. |
5543664 | Aug., 1996 | Burns | 257/686. |
5592364 | Jan., 1997 | Roane | 361/735. |
Catalog of Dense-Pac Microsystems, Inc. describing two products: DPS512X16A3 Ceramic 512K X 16 CMOS SRAM Module and DPS512X16AA3 High Speed Ceramic 512K X 16 CMOS SRAM Module, pp. 865-870. |