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United States Patent | 5,742,478 |
Wu | April 21, 1998 |
A printed circuit board and heat conductor plate assembly is secured within an housing that includes a front cover, a rear cover and a base plate, whereby heat is dissipated from the assembly through exterior fins of the housing by a fan which directs cool air between the walls of the housing and the heat conductor plate.
Inventors: | Wu; Chih-Hsien (Fl. 4, No. 59 1, Tsao Di Wei, Shen Keng Hsiang, Taipei Shien, TW) |
Appl. No.: | 719646 |
Filed: | September 25, 1996 |
Current U.S. Class: | 361/704; 361/715; 361/728; 361/730; 361/736 |
Intern'l Class: | H05K 007/20 |
Field of Search: | 307/150 361/688-690,694-695,704,707,709-710,714-716,728,730,752,756,759 |
3851226 | Nov., 1974 | Chen | 361/728. |
4471898 | Sep., 1984 | Parker | 361/730. |
4525769 | Jun., 1985 | Lehmann | 361/704. |
4546407 | Oct., 1985 | Benenati | 361/716. |
4656559 | Apr., 1987 | Fathi | 361/730. |
4710853 | Dec., 1987 | Reinhardt | 361/756. |
5461542 | Oct., 1995 | Kosak et al. | 361/716. |
5521792 | May., 1996 | Pleitz et al. | 361/715. |