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United States Patent | 5,656,854 |
Westerkamp | August 12, 1997 |
A lead frame for a multiplicity of terminals, in particular of large-scale integrated semiconductor chips, arranged in a very confined space and consisting of metallic conductors which converge from large outer spacings toward the terminals and can be connected to the terminals. The lead frame allows a high number of terminals with a low degree of spacing of the conductors to be produced. The conductors are produced in the outer region by a conventional production method and at their ends pointing toward the terminals by laser cutting of a uniformly metallic material.
Inventors: | Westerkamp; Hugo (Wolfenbuettel-Salzdahlum, DE) |
Assignee: | LSI Logic Products GmbH (Brunswick, DE) |
Appl. No.: | 554967 |
Filed: | November 13, 1995 |
Oct 10, 1988[DE] | 38 34 361.4 |
Current U.S. Class: | 257/666; 257/775; 257/E23.043 |
Intern'l Class: | H01L 023/495 |
Field of Search: | 257/666,775,669,676,672,674 |
3842492 | Oct., 1974 | Kamerbeek et al. | 29/588. |
3906621 | Sep., 1975 | Epple | 29/591. |
4403134 | Sep., 1983 | Klingel | 219/121. |
4405875 | Sep., 1983 | Nagai | 310/344. |
4514750 | Apr., 1985 | Adams | 357/70. |
4529958 | Jul., 1985 | Person et al. | 338/275. |
4711700 | Dec., 1987 | Cusack | 257/666. |
4733292 | Mar., 1988 | Jarvis | 357/70. |
4872260 | Oct., 1989 | Johnson et al. | 257/666. |
5034591 | Jul., 1991 | Fang | 219/121. |
5270570 | Dec., 1993 | Westerkamp | 257/666. |
5466967 | Nov., 1995 | Westerkamp | 257/666. |
Foreign Patent Documents | |||
0 213 764 | Mar., 1987 | EP. | |
0 247 775 | Dec., 1987 | EP. | |
0 321 326 | Jun., 1989 | EP. | |
31 10 235 | Oct., 1982 | DE. | |
35 17 438 | Dec., 1985 | DE. | |
36 08 410 | Sep., 1987 | DE. |