Back to EveryPatent.com
United States Patent | 5,633,535 |
Chao ,   et al. | May 27, 1997 |
A method of forming standoff spacer pedestals on a device above the substrate by supporting the electronic device with the standoff spacer pedestals during solder reflow and bonding. Generally, the method comprising the steps of adhering at least one layer of film solder resist on the substrate, and eliminating the undesired portions of dry film solder resist to form the pedestals.
Inventors: | Chao; Clinton C. (51 Waterside Cir., Redwood City, CA 94065); Harper; Timothy V. (11260 West Hickory Hill Ct., Boise, ID 83704); Wynbeek; John C. (10471 Pharlap Dr., Cupertino, CA 95014); Schneider; Eric S. (3276 E. Boulder Hights, Boise, ID 83712) |
Appl. No.: | 379229 |
Filed: | January 27, 1995 |
Current U.S. Class: | 257/778; 257/738; 257/779; 257/780; 257/E21.511 |
Intern'l Class: | H01L 023/48; H01L 023/52; H01L 029/40 |
Field of Search: | 257/734,737,738,779,780,781 |
4927697 | May., 1990 | Hill | 428/198. |
4967950 | Nov., 1990 | Legg et al. | 228/180. |
5056215 | Oct., 1991 | Blanton | 29/840. |
5130779 | Jul., 1992 | Agarwala et al. | 357/67. |
5154341 | Oct., 1992 | Melton et al. | 228/180. |
5218234 | Jun., 1993 | Thompson et al. | 257/778. |
5448114 | Sep., 1995 | Kondoh et al. | 257/778. |