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United States Patent | 5,631,809 |
Takagi ,   et al. | May 20, 1997 |
A semiconductor device comprising a semiconductor chip, a sheet-like metal member electrically connected to a major surface of the semiconductor chip and serving as a ground electrode for the chip, and input/output electrodes electrically connected to the semiconductor chip and situated in the same plane as that of the sheet-like metal member, the chip, the metal member, and the input/output electrodes being encapsulated in an electrically insulating member having a bottom surface and adapted to be mounted on a surface of a circuit board. The sheet-like metal member is brought out from inside the electrically insulating member without being bent and has its one end face situated in substantially the same plane as the bottom surface of the electrically insulating member which faces to the surface of the circuit board when the metal member is mounted on the circuit board and the major surface of the chip is approximately prependicular to the end face of the sheet-like metal member.
Inventors: | Takagi; Eiji (Yokosuka, JP); Iseki; Yuji (Yokohama, JP); Ono; Naoko (Tokyo, JP) |
Assignee: | Kabushiki Kaisha Toshiba (Kawasaki, JP) |
Appl. No.: | 305397 |
Filed: | September 13, 1994 |
Sep 17, 1993[JP] | 5-231674 |
Current U.S. Class: | 361/820; 174/35R; 174/51; 174/52.4; 257/659; 257/692; 257/693; 257/696; 257/728; 257/E23.044; 257/E23.124; 333/247; 361/772; 361/783; 361/816; 361/818 |
Intern'l Class: | H05K 009/00; H05K 007/02; H01L 023/043; H01L 023/552 |
Field of Search: | 174/51,52.1,52.2,52.3,52.4,35 R,35 TS 333/33,246,247 257/659,664,691,728,735,730,696 361/813,816,818,820,212,220 439/68,83 |
5057805 | Oct., 1991 | Kadowaki | 333/247. |
5075759 | Dec., 1991 | Moline | 257/728. |
5294897 | Mar., 1994 | Notani et al. | 333/246. |
Foreign Patent Documents | |||
62-134945 | Jun., 1987 | JP | 257/730. |
62-263667 | Nov., 1987 | JP | 257/696. |
63-188961 | Aug., 1988 | JP | 257/728. |
6-140528 | May., 1994 | JP | 257/728. |
6-168988 | Jun., 1994 | JP. |
"Maxim Integrated Circuits Data Handbook", 1989, p. A-12. Claude L. Bertin, et al., "Evaluation of a Three-Dimensional Memory Cube System", IEEE Trans. on CHMT, vol. 16, No. 8, pp. 1006-1011, 1993. |