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United States Patent |
5,608,242
|
Kamasz
,   et al.
|
March 4, 1997
|
Variable width CCD register with uniform pitch and charge storage
capacity
Abstract
A CCD shift register includes a first gate electrode, a second gate
electrode disposed adjacent to and longitudinally spaced from the first
gate electrode, and a buried layer having a first dopant impurity
concentration. The first gate electrode is disposed over the buried layer
so as to define a first buried layer area. The second gate electrode is
disposed over the buried layer so as to define a second buried layer area
greater than the first buried layer area. In the buried layer, a trench
region is formed so as to have a second dopant impurity concentration
greater than the first dopant impurity concentration. The first gate
electrode is disposed over the trench region so as to define a first
trench area. The second gate electrode being disposed over the trench
region so as to define a second trench area less than the first trench
area. In the CCD shift register, the first buried layer area defines an
area for a first charge storage element characterized by a first charge
storage capacity, the first charge storage capacity being a function of
the first trench area. The second buried layer area defines an area for a
second charge storage element characterized by a second charge storage
capacity, the second charge storage capacity being a function of the
second trench area. The first and second trench areas are dimensioned so
that the first charge storage capacity is equal to or greater than the
second charge storage capacity. A tapped CCD shift register includes a
first CCD shift register segment and a second shift register segment, both
the first and second CCD shift register segments being characterized by a
pitch length in the longitudinal direction. The first CCD shift register
segment includes a sense node, and the second CCD shift register segment
includes a beginning shift register charge storage element, both the sense
node and the beginning shift register charge storage element being
disposed within one pitch length in the longitudinal direction.
Inventors:
|
Kamasz; Stacy R. (Waterloo, CA);
Farrier; Michael G. (Boyne City, MI)
|
Assignee:
|
Dalsa, Inc. (CA)
|
Appl. No.:
|
321267 |
Filed:
|
October 11, 1994 |
Current U.S. Class: |
257/216; 257/219; 257/221; 257/232; 257/240; 257/E27.154 |
Intern'l Class: |
H01L 029/768 |
Field of Search: |
257/216,219,220,221,223,231,232,239,240,448,450
|
References Cited
U.S. Patent Documents
4087832 | May., 1978 | Jambotkar | 357/24.
|
4210922 | Jul., 1980 | Shannon | 357/24.
|
4246591 | Jan., 1981 | Kosonocky et al. | 357/24.
|
4658278 | Apr., 1987 | Elabd et al. | 357/24.
|
4665420 | May., 1987 | Kosonocky et al. | 357/24.
|
4667213 | May., 1987 | Kosonocky | 357/24.
|
4698656 | Oct., 1987 | Kamata | 357/24.
|
4809048 | Feb., 1989 | Kimata et al. | 357/24.
|
4812887 | Mar., 1989 | Boudewijns | 357/24.
|
4866497 | Sep., 1989 | Kosonocky | 357/24.
|
4888633 | Dec., 1989 | Terui | 357/24.
|
4901125 | Feb., 1990 | Yamada | 357/24.
|
4965648 | Oct., 1990 | Yang et al. | 357/24.
|
4992841 | Feb., 1991 | Halvis | 357/24.
|
5065203 | Nov., 1991 | Yang et al. | 357/24.
|
5077592 | Dec., 1991 | Janesick | 357/24.
|
5155597 | Oct., 1992 | Lareau et al. | 358/213.
|
5233429 | Aug., 1993 | Jung | 358/213.
|
5289022 | Feb., 1994 | Iizuka et al. | 257/232.
|
5323034 | Jun., 1994 | Furumiya | 257/232.
|
Other References
Chen and Tseng, "A High Speed Tapped CCD Photodiode Linear Image Sensor",
IEEE Electron Device Letters, vol. EDL-2, No. 10, Oct. 1981.
|
Primary Examiner: Tran; Minhloan
Attorney, Agent or Firm: Banner & Witcoff, Ltd.
Claims
What is claimed is:
1. A trench region in a CCD shift register, the CCD shift register defining
a longitudinal direction, the CCD shift register having a buried layer, a
first gate electrode and a second gate electrode disposed longitudinally
from the first gate electrode, the buried layer including a semiconductor
material characterized as having a first dopant impurity concentration,
the first gate electrode being disposed over the buried layer so as to
define a first buried layer area, the second gate electrode being disposed
over the buried layer so as to define a second buried layer area, the
second buried layer area being greater than the first buried layer area,
the trench region comprising:
a region formed in the buried layer so as to have a second dopant impurity
concentration, the second dopant impurity concentration being greater than
the first dopant impurity concentration, the first gate electrode being
disposed over the trench region so as to define a first trench area, the
second gate electrode being disposed over the trench region so as to
define a second trench area, the first trench area being greater than the
second trench area.
2. The trench region of claim 1, wherein:
the first buried layer area defines an area for a first charge storage
element characterized by a first charge storage capacity, the first charge
storage capacity being a function of the first trench area;
the second buried layer area defines an area for a second charge storage
element characterized by a second charge storage capacity, the second
charge storage capacity being a function of the second trench area; and
the first and second trench areas are dimensioned so that the first charge
storage capacity is equal to the second charge storage capacity.
3. A buried layer in a CCD shift register, the CCD shift register defining
a longitudinal direction, the CCD shift register having a first gate
electrode and a second gate electrode disposed longitudinally from the
first gate electrode, the buried layer comprising:
a layer having a first dopant impurity concentration, the first gate
electrode being disposed over the buried layer so as to define a first
buried layer area, the second gate electrode being disposed over the
buried layer so as to define a second buried layer area, the second buried
layer area being greater than the first buried layer area, the buried
layer having a trench region formed therein, the trench region having a
second dopant impurity concentration, the second dopant impurity
concentration being greater than the first dopant impurity concentration,
the first gate electrode being disposed over the trench region so as to
define a first trench area, the second gate electrode being disposed over
the trench region so as to define a second trench area, the first trench
area being greater than the second trench area.
4. The buried layer of claim 3, wherein:
the first buried layer area defines an area for a first charge storage
element characterized by a first charge storage capacity, the first charge
storage capacity being a function of the first trench area;
the second buried layer area defines an area for a second charge storage
element characterized by a second charge storage capacity, the second
charge storage capacity being a function of the second trench area; and
the first and second trench areas are dimensioned so that the first charge
storage capacity is equal to the second charge storage capacity.
5. A CCD shift register defining a longitudinal direction comprising:
a first gate electrode;
a second gate electrode disposed longitudinally from the first gate
electrode;
a buried layer having a first dopant impurity concentration, the first gate
electrode being disposed over the buried layer so as to define a first
buried layer area, the second gate electrode being disposed over the
buried layer so as to define a second buried layer area, the second buried
layer area being greater than the first buried layer area, the buried
layer having a trench region formed therein, the trench region having a
second dopant impurity concentration, the second dopant impurity
concentration being greater than the first dopant impurity concentration,
the first gate electrode being disposed over the trench region so as to
define a first trench area, the second gate electrode being disposed over
the trench region so as to define a second trench area, the first trench
area being greater than the second trench area.
6. The CCD shift register of claim 5, wherein:
the first buffed layer area defines an area for a first charge storage
element characterized by a first charge storage capacity, the first charge
storage capacity being a function of the first trench area;
the second buried layer area defines an area for a second charge storage
element characterized by a second charge storage capacity, the second
charge storage capacity being a function of the second trench area; and
the first and second trench areas are dimensioned so that the first charge
storage capacity is equal to the second charge storage capacity.
7. A tapped CCD shift register defining a longitudinal direction comprises
a plurality of CCD shift register segments, the plurality of CCD shift
register segments including a first CCD shift register segment and a
second shift register segment, wherein:
the first CCD shift register segment includes a sense node; and
the second CCD shift register segment includes a buried layer, a first gate
electrode, a second gate electrode disposed longitudinally from the first
gate electrode, the buried layer having a first dopant impurity
concentration, the first gate electrode being disposed over the buried
layer so as to define a first buried layer area, the second gate electrode
being disposed over the buried layer so as to define a second buried layer
area, the second buffed layer area being greater than the first buffed
layer area, the buffed layer having a trench region formed therein, the
trench region having a second dopant impurity concentration, the second
dopant impurity concentration being greater than the first dopant impurity
concentration, the first gate electrode being disposed over the trench
region so as to define a first trench area, the second gate electrode
being disposed over the trench region so as to define a second trench
area, the first trench area being greater than the second trench area.
8. The tapped CCD shift register of claim 7, wherein:
the first buffed layer area defines an area for a first charge storage
element characterized by a first charge storage capacity, the first charge
storage capacity being a function of the first trench area;
the second buried layer area defines an area for a second charge storage
element characterized by a second charge storage capacity, the second
charge storage capacity being a function of the second trench area; and
the first and second trench areas are dimensioned so that the first charge
storage capacity is equal to the second charge storage capacity.
9. The tapped CCD shift register of claim 7, wherein:
the first and second CCD shift register segments are characterized by
respective first and second pitch lengths in the longitudinal direction,
the first pitch length being equal to the second pitch length; and
the first gate electrode is so disposed that both the sense node and the
first buried layer area are contained within a same pitch length in the
longitudinal direction.
10. The tapped CCD shift register of claim 7, wherein:
the tapped CCD shift register defines a lateral direction transverse to the
longitudinal direction;
the sense node is characterized by a node width in the lateral direction;
and
the buried layer is characterized by a channel width in the lateral
direction, the node width being less than the channel width.
11. The tapped CCD shift register of claim 10, wherein the sense node is
characterized by a parasitic capacitance, the parasitic capacitance being
reduced due to the node width being less than the channel width.
12. A tapped CCD shift register defining a longitudinal direction comprises
a plurality of CCD shift register segments, the plurality of CCD shift
register segments including a first CCD shift register segment and a
second shift register segment, the first and second CCD shift register
segments being characterized by respective first and second pitch lengths
in the longitudinal direction, the first pitch length being equal to the
second pitch length, wherein:
the first CCD shift register segment includes a sense node; and
the second CCD shift register segment includes a beginning shift register
charge storage element, both the sense node and the beginning shift
register charge storage element being disposed within a same pitch length
in the longitudinal direction.
13. The tapped CCD shift register of claim 12, wherein:
the tapped CCD shift register defines a lateral direction transverse to the
longitudinal direction;
the sense node is characterized by a node width in the lateral direction;
and
the beginning shift register charge storage element is characterized by a
channel width in the lateral direction, the node width being less than the
channel width.
14. The tapped CCD shift register of claim 13, wherein the sense node is
characterized by a parasitic capacitance, the parasitic capacitance being
a reduced capacitance due to the node width being less than the channel
width.
15. A buried channel structure of a CCD shift register comprising:
a first buried channel region of a first register element characterized by
a first buried channel region size;
a second buried channel region of a second register element characterized
by a second buried channel region size, the first buried channel region
size being different than the second buried channel region size; and
a trench structure formed in and extending through both the first and
second buried channel regions, the trench structure being characterized by
an increased impurity concentration relative to an impurity concentration
which characterizes one of the first buried channel region and second
buried channel region so that a charge storage capacity of the first
register element is equal to a charge storage capacity of the second
register element.
16. The buried channel structure of claim 15 wherein:
the trench structure includes a first trench region and a second trench
region;
the first trench region is a region of the trench structure formed in the
first buffed channel region, the first trench region being characterized
by a first trench region size; and
the second trench region is a region of the trench structure formed in the
second buffed channel region, the second trench region being characterized
by a second trench region size, the first trench region size being greater
than the second trench region size.
17. A buried channel structure of a CCD shift register comprising:
a first buried channel region of a first register element characterized by
a first buried channel region size; and
a second buried channel region of a second register element characterized
by a second buffed channel region size, the second buffed channel region
size being greater than the first buffed channel region size; and
a trench structure formed in and extending through both the first and
second buffed channel regions, the trench structure being characterized by
an increased impurity concentration relative to an impurity concentration
which characterizes one of the first buried channel region and second
buried channel region, the trench structure including a first trench
region and a second trench region, the first trench region being a region
of the trench structure formed in the first buffed channel region, the
first trench region being characterized by a first trench region size, the
second trench region being a region of the trench structure formed in the
second buried channel region, the second trench region being characterized
by a second trench region size, the first trench region size being greater
than the second trench region size.
Description
BACKGROUND OF THE INVENTION
1. Field of the Invention
This invention relates to charge coupled devices (CCD) and particularly to
CCD readout registers which have multiple output structures for high data
rate focal plane applications.
2. Description of Related Art
Two dimensional imaging arrays generally take a snap shot of an image where
the whole photoactive array of pixels integrates photogenerated charge for
a period of time. At the end of the integration time, the information is
transferred from the sensor to an external circuit element using a
parallel to serial transfer scheme. Each line of pixel data is transferred
into a horizontal CCD shift register. The line of data is then transferred
serially to an output device at the end of the register.
Generally the data rate at which signal charge can be transferred is
limited by the bandwidth of the output device.
In applications where the data rate must be in excess of the amplifier
bandwidth, the horizontal CCD shift register must be partitioned into
subregisters. Each subregister or register segment will then transfer
signal charge to its own separate output device which operates at the
bandwidth limit of the output device. The data is then multiplexed
off-chip to reconstruct the image at the higher data rate which is the
amplifier bandwidth multiplied by the number of output devices or taps.
This register architecture is known as a multi-tapped horizontal readout
register.
Tapped register designs require placement of an output device within the
horizontal pitch of the register. For high density CCD sensor designs
where the pitch is small in view of the minimum dimensions permitted by
the design rules for the state of the processing technology used to make
the CCD, it is difficult to position an output device within the register
pitch such that the output device will have high performance (high
conversion efficiency and low noise) while not sacrificing the performance
of the horizontal register.
This invention solves the problem of placing a high performance output
device within one element of a high density horizontal CCD shift register
such that the adjacent shift register elements are not altered in
performance. This invention allows for a partial reduction in the area of
the first element of a register segment adjacent an output tap without
reducing the charge handling capacity of that element.
The invention may be generally applied to any CCD layout which requires
that CCD register elements have unequal physical dimensions but which
require the same charge handling capacity. In brief, this invention allows
for the equilibration of maximum charge handling capacity for CCD well
areas of different size. For example, a 10 micron by 10 micron register
element can be made to have the same charge handling capacity as a 10
micron by 15 micron register element.
In previous work, this charge handling equilibration would have been
achieved making use of stepped oxides under the polysilicon CCD gate
electrodes thereby increasing or decreasing the capacitance of the
register element. The stepped oxide technique is not very satisfactory
since it is difficult to control the process and the electrical parameters
of the register element. The stepped oxide technique is not cost
effective. This invention improves the state of the art in that it allows
for equilibration of charge handling capacity with a simple implant step.
This invention uses the concept of a special implant to create a buried
channel CCD notch or trench in a register element (see U.S. Pat. No.
4,667,213 granted May 19, 1987 to Kosonocky). The trench is used to
increase the charge storage per unit area of a small pitch CCD shift
register and to improve the charge transfer efficiency of the register for
small signals in cooled devices.
SUMMARY OF THE INVENTION
This invention applies the principle of trench technology to the
equilibration of charge handling capacity of CCD register elements of
dissimilar size.
In principle and in practice this invention uses the concept of creating a
region of increased charge storage density (usually measured in units of
number of electrons per unit area) within a CCD register element using an
extra implant of a channel doping species (i.e., channel trench implant).
The dimension of the channel trench region is designed to compensate for
the loss in charge storage capacity (usually measured in units of total
number of electrons) of a register element which has been reduced in size
from its neighbor. The combination of the regions of differing charge
storage densities is designed to equilibrate the total charge storage
capacities of two CCD register storage elements which differ in area.
Charge storage capacity can be equilibrated alternatively by changing one
of the other independent dimensions of the register storage element such
as the gate length (if the channel width is decreased) or the channel
width if the gate length is decreased. In some cases the other dimensions
are fixed and cannot be altered to equilibrate charge storage capacity.
This case arises when inserting an output tap structure into a fixed pitch
horizontal shift register. The gate length cannot be increased or
decreased due to the fixed pitch of the sensor, but the insertion of the
tap structure requires the reduction of channel width. The channel width
must be reduced to allow for the placement of metal, contact, and
diffusion structures which are minimized in area for minimum parasitic
capacitance at the output node or termination of the shift register.
A trench implant is used to increase the charge storage density of a CCD
channel by creating a region within the CCD channel which has a heavier
doping of n-type species than the surrounding channel doping. Thus the
charge handling capacity of the more heavily doped region is increased and
the combination charge handling capacities of the normally doped channel
plus that of the additionally doped channel yields an increase in the
average charge handling capacity which is proportional to the relative
areas of normal channel vs trench implanted channel.
In order to insert a tap structure into the CCD register, the area of the
first CCD register element of an adjacent register must be reduced, which
would normally reduce the charge handling capacity of that register dement
relative to the adjacent full area register element. The trench implant is
then used to increase the area of trench storage area within the narrowed
register element such that its average charge storage capacity is
equivalent to that of the full sized register element.
In accordance with this invention, the charge handling capacity of all the
CCD register elements can be maintained substantially equal, thus
maintaining the performance of the sensor, while achieving a low
capacitance output tap structure in a high density CCD register structure.
It is an object of the present invention to facilitate a high density area
imaging array as measured by the pitch between photoelements. It is a
further object of the present invention to facilitate concatenation (i.e.,
the linking together in a series) of plural subarrays of photoelements
into a large area array. It is a further object of the present invention
to provide shift registers capable of passing image signals having wide
dynamic ranges. It is another object of the present invention to minimize
"blooming" effects in photoelement arrays. It is another object of the
present invention to equilibrate the charge storage capacity of charge
storage elements of a CCD shift register when at least one charge storage
element has an area different than the areas of the other charge storage
elements. It is another object of the invention to provide an output
structure with reduced parasitic capacitance and corresponding high speed
operating performance.
These and other objects are achieved with a CCD shift register defining
longitudinal and lateral directions which includes a first gate electrode,
a second gate electrode disposed adjacent to and longitudinally spaced
from the first gate electrode, and a buried layer having a first dopant
impurity concentration. The first gate electrode is disposed over the
buried layer so as to define a first buried layer area. The second gate
electrode is disposed over the buried layer so as to define a second
buried layer area greater than the first buried layer area. In the buried
layer, a trench region is formed so as to have a second dopant impurity
concentration greater than the first dopant impurity concentration. The
first gate electrode is disposed over the trench region so as to define a
first trench area. The second gate electrode being disposed over the
trench region so as to define a second trench area less than the first
trench area.
In the CCD shift register, the first buried layer area defines an area for
a first charge storage element characterized by a first charge storage
capacity, the first charge storage capacity being a function of the first
trench area. The second buried layer area defines an area for a second
charge storage element characterized by a second charge storage capacity,
the second charge storage capacity being a function of the second trench
area. The first and second trench areas are dimensioned so that the first
charge storage capacity is equal to or greater than the second charge
storage capacity.
These and other objects are achieved with a tapped CCD shift register
defining longitudinal and lateral directions and including a first CCD
shift register segment and a second shift register segment, both the first
and second CCD shift register segments being characterized by a pitch
length in the longitudinal direction. The first CCD shift register segment
includes a sense node, and the second CCD shift register segment includes
a beginning shift register charge storage element, both the sense node and
the beginning shift register charge storage element being disposed within
one pitch length in the longitudinal direction.
BRIEF DESCRIPTION OF DRAWINGS
The invention will be described in detail in the following description of
preferred embodiments with reference to the following figures wherein:
FIG. 1 is a topographical view of a layout of a conventional CCD shift
register;
FIG. 2 is a topographical view of a layout of a conventional tapped CCD
shift register;
FIG. 3A is a cross sectional view of a CCD shift register according to the
present invention;
FIG. 3B is a potential well diagram of the cross sectional view of FIG. 3A;
FIG. 4 is a topographical view of a layout of an end section of a
conventional tapped CCD shift register with an output node at the end of
the active shift register region;
FIG. 5 is a topographical view of a layout of two concatenated CCD shift
register segments according to the present invention;
FIGS. 6 and 6A-6C are enlarged topographical view of a layout of two
adjacent CCD register elements, one with a reduced area, both with a
trench implant, the area of the trench implant being increased in the
register element with the reduced area according to the present invention;
and
FIG. 7 is a block diagram of an exemplary embodiment of the invention.
DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS
The method and apparatus of the invention will be described in the context
of a specific exemplary embodiment wherein a floating diffusion tap
structure for a charge coupled device (CCD) shift register serves as the
signal output mechanism for a 5040.times.5040 element full frame CCD image
sensor. However, it should be understood that the invention may be
advantageously employed in any CCD register structure which utilizes a
trench implant where layout constraints require both (1) that the physical
dimension of at least one register element vary from the physical
dimension of the other register elements, and (2) that the performance of
the register elements with respect to charge handling capacity be
uniformly maintained. For example, a CCD register design which, for the
purpose of minimizing capacitance, might be required to be tapered from a
wide channel width to a narrow channel width without reducing the charge
handling capacity of the register elements would benefit from the use of
this invention.
Referring first to FIG. 1, there is shown a conventional CCD image sensor
block diagram having imaging area 1, serial or horizontal register area 2,
an output node defined by N+diffusion 3, and analog output signal
amplifier 4 which converts photogenerated charge into a voltage signal.
Imaging array 1 can be of any of several constructions generally employed
in the industry, for example, full frame, frame transfer, interline
transfer, time delay and integration, and frame interline transfer
architectures. The serial readout register 2 shown is known as a standard,
low speed, single output CCD readout register which is commonly employed
in the industry. The termination of the serial readout register is shown
as an N+floating diffusion 3 and is commonly employed as a charge sensing
node in the CCD image sensor industry. Floating diffusion 3 is used as an
input node to a gated charge integrator type amplifier. Output amplifier 4
has numerous configurations but is commonly designed as a one or two stage
source follower amplifier.
Referring now to FIG. 2, there is shown an imaging array 5 (as in FIG. 1),
a tapped serial CCD shift register 6, multiple N+floating diffusion output
nodes or taps 7, and multiple amplifier circuits 8.
In this exemplary embodiment the imaging array is constructed as a full
frame transfer buried channel CCD array with 12 micron spacing between
photoelements. Metal bus structures for signal lines run along channel
stop boundaries between the photoelements. Charges generated in the
photoelements are carded to the serial CCD shift register 6 via other CCD
shift registers. Serial CCD shift register 6 is clocked with a three phase
clock source to drive three polysilicon gate layers. This embodiment
incorporates the division of the imaging array into 16 distinct and
separately accessible sections, in the horizontal direction, for the
purpose of operating each section of the array at different clocking
speeds to facilitate compensation of an image motion gradient within a
scene. U.S. Pat. No. 5,155,597 granted Oct. 13, 1992 to Lareau, et al.
describes an array of pixels divided into rows and columns where the
columns are organized into a plurality of column groups, each column group
having its own charge transfer rate corresponding to the image motion rate
in that column group.
FIGS. 3A and 3B show an abbreviated sectional view, and a corresponding
potential well diagram, taken transverse to the longitudinal or principal
axis of serial CCD shift register 6. Several structural layers are not
shown for simplicity. In FIG. 3A, P type semiconductor substrate 10 is
implanted with N type dopant impurities in a channel region of shift
register 6 characterized by width W to form N- type buried layer 12. A
portion of buried layer 12 is further implanted, or originally implanted
to heavier impurity concentrations, with N type dopant impurities to form
N type trench region 14. The designation N- and N type dopant impurity
indicates known relative impurity concentrations suitable for CCD
structures rather than absolute concentrations. Trench region 14 is not
necessarily disposed physically at a different depth than buried layer 12;
however, in the context of CCD operations, trench region 14 is
characterized by a "deeper" potential well 24 (see FIG. 3B) in comparison
to the potential well which characterizes buried layer 12 since the
concentration of dopant impurities implanted in trench region 14 is
greater in comparison to the concentration of dopant impurities implanted
in buried layer 12. A region with a deeper potential well can store more
signal charges 26 per unit area in comparison to a region with a less deep
potential well. Channel stopper regions 16 are preferably formed with P
type dopant impurities on lateral sides of the channel. Field oxide 18 and
relatively thin gate oxide 20 are formed over the channel and channel
stopper regions. These oxide regions may be formed of combinations of
silicon dioxide and silicon nitride. CCD gate 22, preferable formed of
doped polysilicon, is formed over a gate oxide 20 so as to be oriented to
laterally traverse the longitudinal axis of serial CCD shift register 6.
It will be appreciated by persons of ordinary skill in the art that there
are other semiconductor process which may be used to form the structure
shown in FIG. 3A, for example, buried layer 12 may be grown as an
epitaxial layer on substrate 10 by thermal decomposition of gases in a low
pressure chemical vapor deposition process.
Referring now to FIG. 4, there is shown end section 30 of serial CCD shift
register 6. Imaging array sections 32 (shown vertically as depicted in
FIG. 4) couple signal charge to end section 30 (shown horizontally as
depicted in FIG. 4). At the termination of end section 30 is N+floating
diffusion sense node 40. Three CCD shift register gate electrodes, gates
34, 36 and 38, preferably of doped polysilicon construction, are
recurrently disposed to form recurrent storage locations along the length
of end section 30. In operation, signal charge is stored in the channel
area under one of the gates 34, 36 or 38. Clock signals are applied to the
gates to transfer charge "down" the shift register (from right to left as
depicted in FIG. 4), for example, in a conventional three phase manner,
until the signal charge is transferred to N+floating diffusion sense node
40. Shift register charge storage elements, which function as capacitors,
are defined by the channel area under one of the gates. The charge storage
capacity of such a capacitor is defined as:
N=C/A.multidot.A.multidot.V.div.q
where:
N=number of electrons,
C/A=capacitance per unit area in picofarads per micron squared,
A=area of the capacitor in microns squared,
V=voltage difference in the channel between the storage capacitor gate and
the two adjacent gates in volts, and
q=charge of the electron in coulombs.
In FIG. 4, N+floating diffusion sense node 40 extends beyond the edge of
the last imaging array section 32. Since the N+floating diffusion sense
node 40 extends beyond the edge of the last imaging array section 32, a
gap is forced between the imaging array sections 32 corresponding to the
current serial CCD shift register 6 (i.e., a register segment out of the
whole horizontal register) and imaging array sections 32 corresponding to
the next serial CCD shift register 6 to be disposed adjacent to the
current serial CCD shift register 6 (to the left of the register depicted
in FIG. 4).
Referring to FIG. 5, there is shown a section of a CCD array, similar to
that of FIG. 4, which depicts end section 50 and beginning section 60. End
section 50 is a modified version of end section 30. End section 50 differs
from end section 30 in that N+floating diffusion sense node 40 (of FIG. 4)
has been reduced to a smaller dimensioned N+floating diffusion sense node
52. The lateral width W.sub.N (depicted vertically in FIG. 5), across the
channel, of node 52 is preferably less than half of the width of the
channel. At the same time, the beginning section 60 includes beginning
shift register charge storing element 62. Beginning shift register charge
storing element 62 is reduced in dimension in comparison to other charge
storage elements in the serial CCD shift register. The lateral width
W.sub.E (also depicted vertically in FIG. 5), across the channel, of
charge storage element 62 is preferably less than half of the width of the
channel. This permits end section 50 and beginning section 60 to be
disposed adjacent to each other so that imaging array sections 32,
corresponding to both end section 50 and beginning section 60, are
disposed in a linear array of imaging sections 32 so as to have a uniform
pitch P by eliminating the gap forced by the layout depicted in FIG. 4.
It will be appreciated by persons skilled in the art that the total channel
width available may be partitioned between the lateral width of beginning
shift register charge storing element 62 and the lateral width of sense
node 52 in such ratio as other design constraints may dictate. For
example, the lateral width (depicted vertically in FIG. 5) of sense node
52 may be reduced to minimize parasitic capacitance and maximize output
signal bandwidth so that the lateral width (depicted vertically in FIG. 5)
of beginning shift register charge storing element 62 may be expanded to
fill the rest of the channel width.
The smaller area dimensions of beginning charge storage element 62 creates
a reduced area for functioning as a capacitor which would normally result
in a reduced capacitance in comparison to the capacitance of other charge
storage elements. A reduced capacitance of beginning charge storage
element 62 would correspond to a reduced charge storage capacity. The
smaller dimensions of beginning charge storage element 62 of the CCD shift
register is made necessary in some cases to accommodate insertion of a low
capacitance, high performance sense node, such as node 52, and amplifier
in a design which contains a very high density pixel pitch; however, it is
desirable for beginning charge storage element 62 to maintain the same
charge storage capacity as other elements.
Sense node 52 is reduced in area to minimize capacitance so as to
facilitate a high speed and a high charge to voltage conversion output
structure. The area where the register width is reduced or notched (i.e.,
element 62) is the location where the closest elements (e.g., contacts and
metal buses) of the first stage of the amplifier (e.g., amplifier 8 in
FIG. 2) and reset gates would be positioned. In this configuration, first
register storage element 62 would ordinarily have a reduced charge storage
capacity with respect to adjacent full width register elements. This
imbalance in the charge storage capacities of the register elements
facilitates an early onset of signal charge spillover or blooming in the
register element with the reduced capacity. Thus, the dynamic range
performance of the entire image sensor is degraded by the loss of the
storage capacity in the one register element. The present invention
facilitates the equilibrating of the charge storage capacity of both
storage elements regardless of the narrowing of the channel width.
Referring to FIG. 6, there is shown an enlarged portion 70 of serial CCD
shift register 6 (FIG. 2) with two storage elements characterized by
different areas. Enlarged portion 70 includes buffed layer 72 and trench
region 74. Trench region 74 is shown in cross section in FIG. 3. In FIG.
6, first gate 76 overlays buffed layer 72 so as to define a first buffed
layer area (64 in FIG. 6A), and second gate 78 overlays buffed layer 72 so
as to define a second buried layer area (66 in FIG. 6A). The second buried
layer area is greater than the first buried layer area. The size of the
second buried channel region is greater than the size of the first buried
channel region. The first storage element is characterized by a first
charge storage capacity which is a function of the first buried layer
area. The second storage element is characterized by a second charge
storage capacity which is a function of the second buried layer area.
The charge storage capacity per unit area of a storage element is a
function of the dopant impurity concentration in the underlying
semiconductor. Trench region 74 is a region of buried layer 72 into which
an additional implantation of N type dopant impurities has been applied to
create a region of increased charge storage capacity per unit area. The
trench pattern has a substantially uniform lateral width through the
region of the CCD shift register where the storage elements are
dimensioned to have a full lateral width. The trench pattern has an
increased lateral width in the region of the CCD shift register where a
storage element is dimensioned to have a reduced lateral width. An example
of a storage element which has been dimensioned to have a reduced lateral
width is beginning register charge storage element 62 (FIG. 5).
The first buried layer area includes (1) a first trench area (64 T in FIG.
6B) and (2) a first difference area (64D in FIG. 6C), the first difference
area being defined as the first buried layer area less the first trench
area. A first difference area charge storage capacity for the region over
the first difference area is a function of a first dopant impurity
concentration characterizing buried layer 72. A first trench area charge
storage capacity for the region over the first trench area is a function
of a second dopant impurity concentration, greater than the first dopant
impurity concentration, characterizing trench region 74. The first
difference area charge storage capacity and the first trench area charge
storage capacity are combinable to form a first charge storage capacity
(C/A).sub.1 characterizing an average charge storage capacity over the
first buried layer area A.sub.1.
Similarly, the second buried layer area includes (1) a second trench area
(66T in FIG. 6b), and (2) a second difference area (66D in FIG. 6C), the
second difference area being defined as the second buried layer area less
the second trench area. The first trench area is greater than the second
trench area. The size of the first trench region is different than the
size of the second trench region. A second difference area charge storage
capacity for the region over the second difference area is a function of
the first dopant impurity concentration characterizing buried layer 72. A
second trench area charge storage capacity for the region over the second
trench area is a function of the second dopant impurity concentration,
greater than the first dopant impurity concentration, characterizing
trench region 74. The second difference area charge storage capacity and
the second trench area charge storage capacity are combinable to form a
second charge storage capacity (C/A).sub.2 characterizing an average
charge storage capacity over the second buried layer area A.sub.2.
The maximum number of electrons which can be stored by each reduced size
register element, characterized by the first buried layer area, is given
by:
N.sub.1 =(C/A).sub.1 .multidot.A.sub.1 .multidot.V.div.q, and
the maximum number of electrons which can be stored by each full size
register element, characterized by the second buried layer area, is given
by:
N.sub.2 =(C/A).sub.2 .multidot.A.sub.2 .multidot.V.div.q,
thus, it becomes clear how to adjust the first and second trench areas so
that N.sub.2 =N.sub.1 to equilibrate the charge handling capacity of CCD
register elements of dissimilar size.
It will be appreciated by persons skilled in the art that the geometric
pattern of the trench region, or for that matter of the buried layer, is
not restricted to rectangular patterns as depicted in FIG. 6. For example,
the trench region might be in the form of a laterally expanding taper, or
the buried layer might be in a tapered form and the trench region in the
form of a counter taper, or in the form of a series of laterally extending
stubs where the stub extension length corresponds to the narrowing width
of the tapering buried layer.
In FIG. 7, an exemplary embodiment of the invention has been applied to a
full frame CCD image sensor 80 comprising 5040.times.5040 photoelements, a
horizontal register 82, the photoelements and horizontal register having a
pitch of 12 microns, 8 separate output taps 84 being equally spaced on the
horizontal shift register, 16 sections of vertical clocks 86, three
polysilicon gates, buried channel processing, metal bus straps for signals
running vertically along channel isolations between pixels, and a second
layer of metal serving as a light shield over the non-imaging sections of
the image sensor.
Evaluation of this exemplary embodiment of the invention has confirmed that
the reduction in capacitance afforded by the minimization of geometries in
the tap region (e.g., N+floating diffusion sense node 52), which, in turn,
is possible due to the reduction in area of the first register element
(e.g., beginning shift register charge storage element 62) of the adjacent
readout register section, improves the sensitivity of the output structure
by a factor of 2 over the output structure construction which
characterizes the prior art. The reduction in area of the first stage of
the register adjacent to the output tap is, in turn, accomplished without
reducing the saturation charge capacity of that register element by the
proper enlargement of the channel trench implant in that register element.
The efficacy of the invention has been demonstrated. The saturation
capacity of the notched register element is equal to or greater than the
saturation capacity of the neighboring, full sized, register element.
Having described preferred embodiments of a novel CCD readout register
having multiple outputs (which are intended to be illustrative and not
limiting), it is noted that modifications and variations can be made by
persons skilled in the art in light of the above teachings. It is
therefore to be understood that changes may be made in the particular
embodiments of the invention disclosed which are within the scope and
spirit of the invention as defined by the appended claims.
Having thus described the invention with the details and particularity
required by the patent laws, what is claimed and desired protected by
Letters Patent is set forth in the appended claims.
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