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United States Patent | 5,600,180 |
Kusaka ,   et al. | February 4, 1997 |
A sealing structure for bumps on a semiconductor integrated circuit chip to be bonded through the bumps onto a circuit board is provided wherein a plurality of pads are formed on the semiconductor integrated circuit chip. Each of the pads is formed with a bump thereon. A coating material is provided to coat at least surfaces of the above a plurality of bumps. The material is made of an insulation material having a hardness sufficiently small for showing, when bonding the chip onto the circuit board, a deformation thereby at least a top portion of each of the bumps is made contact with pads provided on the circuit board.
Inventors: | Kusaka; Teruo (Tokyo, JP); Senba; Naoji (Tokyo, JP); Nishizawa; Atsushi (Tokyo, JP); Takahashi; Nobuaki (Tokyo, JP) |
Assignee: | NEC Corporation (Tokyo, JP) |
Appl. No.: | 505152 |
Filed: | July 21, 1995 |
Jul 22, 1994[JP] | 6-170612 |
Current U.S. Class: | 257/692; 257/698; 257/737; 257/778; 257/780; 257/785; 257/E21.503; 257/E23.021 |
Intern'l Class: | H01L 023/48 |
Field of Search: | 257/778,779,698,780,692,785,737 |
5283468 | Feb., 1994 | Kondo et al. | 257/698. |
5461197 | Oct., 1995 | Hiruta et al. | 257/778. |
Foreign Patent Documents | |||
186818 | Jul., 1986 | EP | 257/778. |
2-142134 | May., 1990 | JP | 257/778. |
9424704 | Oct., 1994 | WO | 257/778. |