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United States Patent | 5,521,431 |
Tahara | May 28, 1996 |
The molded type semiconductor device has a semiconductor chip mounted and molded on a lead frame. The device includes a stub which has an open end at a portion of the lead frame and which is connected to a ground electrode of the semiconductor chip, and a mold resin which molds the stub together with the semiconductor chip. The stub has a length that is a 1/4 wavelength of a signal wavelength used in the device. The stub is formed in a zigzag form or a spiral form. Due to such stub, the satisfactory grounding is ensured to accomplish a simple molded type structure and to improve circuit characteristics.
Inventors: | Tahara; Kazuhiro (Tokyo, JP) |
Assignee: | NEC Corporation (Tokyo, JP) |
Appl. No.: | 364300 |
Filed: | December 27, 1994 |
Dec 24, 1993[JP] | 5-348271 |
Current U.S. Class: | 257/676; 257/666; 257/728; 257/E23.031; 257/E23.043 |
Intern'l Class: | H01L 023/48 |
Field of Search: | 257/666,690,786,668,787,676,672,728 |
4780795 | Oct., 1988 | Meinel | 257/703. |
4989068 | Jan., 1991 | Yasuhara et al. | 257/677. |
5229846 | Jul., 1993 | Kozuka | 257/666. |
5276352 | Jan., 1994 | Komenaka et al. | 257/787. |
5382829 | Jan., 1995 | Inoue | 257/668. |
Foreign Patent Documents | |||
3-198402 | Aug., 1991 | JP. | |
0251629 | Sep., 1993 | JP | 257/728. |
0104372 | Apr., 1994 | JP | 257/531. |