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United States Patent | 5,335,145 |
Kusui | August 2, 1994 |
An IC card exhibiting improved electrical insulation, heat radiation capability, and radiation noise resistance includes circuit boards stacked in two layers and spaced apart from each other and surface panels of the IC card while maintaining satisfactory mechanical strength in the card. Board supporting portions extending in a frame portion of a main frame and sub-frames disposed on the board supporting portions hold the circuit boards, maintain a predetermined interval between the two circuit boards and between each circuit board and the surface panels, and provide the desired mechanical strength for the card.
Inventors: | Kusui; Masaaki (Itami, JP) |
Assignee: | Mitsubishi Denki Kabushiki Kaisha (Tokyo, JP) |
Appl. No.: | 074535 |
Filed: | June 11, 1993 |
Jun 16, 1992[JP] | 4-156311 |
Current U.S. Class: | 361/737; 174/261; 361/749; 361/770; 361/785; 361/792; 439/77 |
Intern'l Class: | H05K 001/14 |
Field of Search: | 361/728,736,737,748,749,770,784,785,787,792,813,807 439/67,77 174/52.4,255,261 257/666,686 |
3766439 | Oct., 1973 | Isaacson | 317/100. |
4905124 | Feb., 1990 | Banjo et al. | 361/395. |
Foreign Patent Documents | |||
2243493 | Oct., 1991 | GB. | |
2248973 | Apr., 1992 | GB. |