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United States Patent | 5,295,043 |
Beijer | March 15, 1994 |
A low-profile, clip-on heat sink for computer chip packages that releasably engages the side of the package and method for cooling computer chips is disclosed. The sink comprises a contact pad attached to a set of beams. Flanges extend down from the outer edges of the beams. The sink is engaged to the package by the flanges which attach to the sides of the package. When the sink is engaged to the package, the contact pad contacts the computer chip. When the chip is operating, heat flows from the chip to the contact pad. Heat then flows from the contact pad to the beams where it dissipates into the ambient surroundings. The sink may be released from engagement by deforming the flanges.
Inventors: | Beijer; Gene (Moorpark, CA) |
Assignee: | Tandon Corporation (Moorpark, CA) |
Appl. No.: | 830057 |
Filed: | February 3, 1992 |
Current U.S. Class: | 361/704; 165/185; 174/16.3; 257/720; 257/E23.086; 361/752; 361/756 |
Intern'l Class: | H05K 007/20; 752; 767; 765; 756 |
Field of Search: | 361/381,383,386,388,389,392,394,399,403,411,418,702-704,709,711,715,730,707,714 165/80.3,185 357/79,80,81 174/16.3 439/487 257/720,723 |
4345267 | Aug., 1982 | Corman et al. | 357/81. |
4594643 | Jun., 1986 | Hermann. | |
4679118 | Jul., 1987 | Johnson et al. | 361/386. |
4716494 | Dec., 1987 | Bright et al. | 361/386. |
Foreign Patent Documents | |||
3304952 | Aug., 1984 | DE. | |
3335332 | Apr., 1985 | DE. | |
3335377 | Apr., 1985 | DE. | |
3335644 | Apr., 1985 | DE. |
European Search Report dated Mar. 29, 1993. Computer Design Magazin, p. 73; EG&G Wakefield Engineering Series heat sink/clip assembly--Feb. 1992. Semiconductor Accessories Brochure; Thermalloy, Inc., Dec. 1990. |