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United States Patent |
5,291,010
|
Tsuji
|
March 1, 1994
|
Solid state imaging device having a chambered imaging chip corner
Abstract
This invention is a solid state imaging device provided with an imaging
chip having an imaging area and a package enclosing this imaging chip
wherein, among a plurality of corners of the image area on the imaging
chip, a plurality of corners of the imaging chip and a plurality of
corners of the above mentioned package, at least one corner in each
corresponding position is chamfered. The chamfered corner of the image
area is a region not required to display pictures and does not reduce the
displaying performance. In the electronic endoscope, the above mentioned
solid state imaging device is arranged within the small area of the
insertable section with the chamfered corner directed to the outside.
Inventors:
|
Tsuji; Kiyoshi (Musashino, JP)
|
Assignee:
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Olympus Optical Co., Ltd. (Tokyo, JP)
|
Appl. No.:
|
770274 |
Filed:
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October 3, 1991 |
Foreign Application Priority Data
Current U.S. Class: |
250/208.1; 257/433; 348/65; 600/104; 600/109 |
Intern'l Class: |
H01J 040/14 |
Field of Search: |
250/208.1,208.5
358/98,229,213.11
128/6
257/433
|
References Cited
U.S. Patent Documents
4760440 | Jul., 1988 | Bigler et al.
| |
4868644 | Sep., 1989 | Yabe et al. | 128/6.
|
Foreign Patent Documents |
62-16683 | Jan., 1987 | JP.
| |
62-94650 | Jun., 1987 | JP.
| |
Primary Examiner: Nelms; David C.
Assistant Examiner: Le; Que T.
Attorney, Agent or Firm: Armstrong, Westerman, Hattori, McLeland & Naughton
Claims
What is claimed is:
1. A solid state imaging device, comprising:
an imaging chip having an imaging area for imaging an image and a package
for enclosing said imaging chip, wherein at least one corner at a
corresponding position in said imaging chip, and said package is
chamfered.
2. A solid state imaging device according to claim 1, wherein three corners
at corresponding positions of the imaging chip and the package are
chamfered.
3. A solid state imaging device according to claim 1, wherein said imaging
chip has transfer lines for receiving electric charges from said image
area, and wherein said at least one corner at a corresponding position of
said imaging chip and said package, which is opposite a side on which said
transfer lines are arranged, is chamfered.
4. A solid state imaging device according to claim 1, wherein said solid
state imaging device is arranged in an electronic endoscope having an
insertable section, and wherein at least one corner of each of said
imaging chip and said package which is positioned on the outer peripheral
side of the insertable section of said electronic endoscope is chamfered.
5. A solid state imaging device according to claim 1, wherein said solid
state imaging device is arranged in an electronic endoscope having an
insertable section, and wherein at least one corner of each of said
imaging chip and said package, which is positioned inside the insertable
section of said electronic endoscope, is chamfered.
6. A solid state imaging device, comprising:
an imaging chip having an imaging area for imaging an image and a package
for enclosing said imaging chip, wherein at least one corner at a
corresponding position in the image area on said imaging chip, said
imaging chip, and said package is chamfered.
7. A solid state imaging device according to claim 6, wherein three corners
at corresponding positions of the image area on said imaging chip, the
imaging chip and the package are chamfered.
8. A solid state imaging device according to claim 6, wherein said imaging
chip has transfer lines for receiving electric charges from said image
area, and
wherein said at least one corner at a corresponding position of the image
area on said imaging chip, said imaging chip and said package, which is
opposite a side on which said transfer lines are arranged, is chamfered.
9. A solid state imaging device according to claim 8, wherein said imaging
chip has electrodes for inputting and for outputting electric charges
received by said transfer lines or for receiving signals from an outside
source; and
wherein said electrodes are located on a side on which non-chamfered
corners of said imaging chip and corners of packages are arranged.
10. A solid state imaging device according to claim 8, wherein said imaging
chip has electrodes for inputting and for outputting electric charges
received by said transfer lines or for receiving signals from an outside
source;
wherein said electrodes are located in non-chamfered corners of said
imaging chip and on the side on which a plurality of packages are
arranged.
11. A solid state imaging device according to claim 6,
wherein said solid state imaging device is arranged in an electronic
endoscope having an insertable section, and wherein at least one corner of
each of the image area on said imaging chip to be chamfered, said imaging
chip and said package which is positioned on the outer peripheral side of
the insertable section of said electronic endoscope is chamfered.
12. A solid state imaging device according to claim 6,
wherein said solid state imaging device is arranged in an electronic
endoscope having an insertable section, and wherein at least one corner of
each of the image area on said imaging chip to be chamfered, said imaging
chip and said package, which is positioned inside the insertable section
of said electronic endoscope, is chamfered.
13. An electronic endoscope having an insertable section tip portion,
comprising a solid state imaging device provided with an imaging chip
having an image area for imaging an image,
wherein at least one corner at a corresponding position of each of the
image area on said imaging chip of said solid state imaging device and
said imaging chip is chamfered to form said solid state imaging device.
14. An electronic endoscope according to claim 13, wherein said solid state
imaging device is arranged so that the image area on said imaging chip of
said solid state imaging device is parallel with a plane intersecting at
right angles with an axial direction of the insertable section of said
electronic endoscope.
15. An electronic endoscope according to claim 13, wherein said solid state
imaging device is arranged so that at least one of said chamfered corners
of the image area on said imaging chip of said solid state imaging device
and the imaging chip are along a contour of the insertable section of said
electronic endoscope.
16. An electronic endoscope according to claim 13, wherein said solid state
imaging device is arranged so that at least one of said chamfered corners
of the image area on said imaging chip of said solid state imaging device
and the imaging chip are directed to an inside portion of the insertable
section of said electronic endoscope and components are arranged adjacent
to the corners of said solid state imaging device which are arranged so as
to be directed to the inside portion of said insertable section.
17. An electronic endoscope according to claim 13, wherein the imaging chip
of said solid state imaging device has a transfer line for receiving an
electric charge from said image area, and wherein at least one of said
chamfered corners of the image area on said imaging chip and said imaging
chip is positioned opposite the side on which said transfer line is
arranged in said solid state imaging device.
18. An electronic endoscope according to claim 13, wherein the imaging chip
of said solid sate imaging device has an electrode for inputting and for
outputting an electronic charge received by said transfer line or for
receiving a signal from an outside source, and
wherein said solid state imaging device is arranged in the position of said
electrode as displaced on the side on which the non-chamfered corners of
said imaging chip and corners of said package are arranged.
19. An electronic endoscope according to claim 13, wherein the image area
on a non-chamfered imaging chip of said solid state imaging device and
components arranged near the corners of the imaging chip have
cross-sectioned areas which are smaller than the cross-sectioned areas of
the image area on said chamfered imaging chip and the components arranged
near the corners of the imaging chip.
20. A solid state imaging device, comprising:
an imaging chip having an imaging area for imaging an image and a package
for enclosing said imaging chip, wherein all the corners other than at a
corresponding position in the image area on said imaging chip, said
imaging chip and said package are chamfered.
21. A solid state imaging device having an insertable section, comprising
an imaging chip having an imaging area for imaging an image and a package
for enclosing said imaging chip
mounted at said insertable section, wherein at least one corner at a
corresponding position of each of said imaging chip and said package is
chamfered and is arranged at an outer peripheral side of said insertable
section.
22. A solid state imaging device having an insertable section, comprising
an imaging chip having an imaging area for imaging an image and a package
for enclosing said imaging chip
mounted at said insertable section, wherein at least one corner at a
corresponding position of each of said imaging chip and said package is
chamfered and is arranged at an inside portion of said insertable section.
23. A solid state imaging device, comprising an imaging chip having an
image area for imaging an image,
wherein at least one corner at a corresponding position of each of the
image area on said imaging chip of said solid state imaging device and
said imaging chip is chamfered to thereby provide a solid state imaging
device which can prevent an output image from darkening due to a shortage
of incident light in an image area corresponding to a peripheral part of
an objective lens.
24. A solid state imaging device according to claim 23, wherein the imaging
chip of said solid state imaging device has a transfer line for receiving
an electric charge from said image area, and wherein at least one of said
chamfered corners of the image area on said imaging chip and said imaging
chip is positioned opposite the side on which said transfer line is
arranged.
25. A solid state imaging device according to claim 24, wherein the imaging
chip of said solid state imaging device has an electrode for inputting and
for outputting an electric charge received by said transfer line or for
receiving a signal from an outside source, and
wherein said electrode is arranged as displaced in the position on the side
on which the non-chamfered corners of said imaging chip and corners of
said a package are arranged.
Description
BACKGROUND OF THE INVENTION
1. Field of the Invention
This invention relates to a solid state imaging device wherein the corners
including the image area of an imaging chip are chamfered and an
electronic endoscope provided with the above mentioned solid state imaging
device.
2. Related Art And Prior Art Statement
The imaging chip of a conventional solid state imaging device, for example,
in a CCD is generally formed as shown in FIG. 1. An imaging chip 31
comprises an image area 32 consisting of a photodiode and vertical
transfer lines, a horizontal transfer line 33 receiving electric charges
from the final steps of the above mentioned vertical transfer lines, an
output step 34 receiving an electric charge from the final step of this
horizontal transfer line 33 and outputting it and electrodes 35 for
transmitting and receiving signals and power sources for these respective
parts. The above mentioned image area 32 is formed to be like a rectangle
corresponding to the aspect ratio of a television displayed picture.
The above mentioned imaging chip is composed of silicon and is therefore
enclosed within a package to improve the durability to the humidity and
external force. As an example of a solid state imaging device enclosing
the above mentioned imaging chip, there is such solid state imaging device
enclosing an imaging chip in a ceramic package as is disclosed in the
publication of Japanese Utility Model Application Laid Open No. 94650/1987
and shown in FIGS. 2(A) and 2(B). This imaging chip 41 is housed in an
imaging chip housing recess 14 on a ceramic substrate 12 and is
air-tightly sealed with a sealing glass 13 through a resin 16. As an
example of making the package small, there is such solid state imaging
device resin-sealing an imaging chip 42 with a transparent resin as is
disclosed in Japanese Patent Application Laid Open No. 16683/1987 and
shown in FIG. 3 and this imaging chip 42 is fixed and arranged on the
package 17 and is resin-sealed with a transparent resin.
Now, an electronic endoscope has the above mentioned solid state imaging
device arranged within an insertable section tip shown in FIG. 5 to be
inserted into a body cavity or the like for observation and required to be
fine in the diameter. This electronic endoscope is provided at the
insertable section tip with a light guide emitting window 6a, an air and
water feeding nozzle 7, a forceps channel 8 and an objective lens 9 as
shown, for example, in FIGS. 5 and 6. A solid state imaging device 11
shown by the two-point chain line in FIG. 6 is arranged on the inner side
of this objective lens 9.
If the above mentioned respective components are arranged so that the
outside diameter of the tip part of the above mentioned electronic
endoscope may be as fine as possible, they will be as shown in FIG. 6. If
the respective outside diameters of the above mentioned respective
components are set so that, for example, the diameter of the light guide 6
may be about 2.8 Mm, the diameter of the air and water feeding nozzle 7
may be about 2 mm, the diameter of the forceps channel 8 may be about 4 mm
and further the image area 32 of the solid state imaging device 30 is set
to be, for example, 3.times.3 Mm, the outside diameter of the above
mentioned endoscope tip part will be about 9.1 Mm at the minimum.
On the other hand, as the image area 2 corresponding to the peripheral part
of the above mentioned objective lens 9 lacks the incident light amount,
the displayed picture of the above mentioned endoscope will become dark in
the four corners. Also, by the characteristics of the lens, the resolution
will reduce. In order to cope with this fact, as shown in FIG. 4, on the
picture 22 of the endoscope image displaying monitor 21, the endoscope
image displaying area 23 is chamfered in the four corners so as to be
octagonal. This shows that, in the conventional purely optical medical
endoscope, as the observing area shape is circular, even in the electronic
endoscope, the shape of the displayed picture need not always be square
and is well usable.
In case the area of the imaging surf ace of the above mentioned solid state
imaging device is to be made as small as possible, it will be restricted
by the contour dimension of the imaging chip. Also, the shape of the above
mentioned imaging surface will be restricted by the shape of the above
mentioned imaging chip and will therefore become rectangular. Further, in
the case of the above mentioned electronic endoscope as an example of an
instrument having a solid state imaging device built-in, in order to
reduce the pain of the patient when the endoscope is inserted into the
body cavity, it is preferable that the outside diameter of the tip part is
as fine as possible but, if the outside diameter of the light guide is
made fine, the illuminating light amount will decrease and the uniformly
illuminatable illumination range will become narrow. In order that many
kinds of forceps may be inserted in response to various medical
treatments, it is preferable that the outside diameter of the channel is
large. Therefore, in order that an instrument in which a solid state
imaging device is arranged may be made small to the extremity, the above
mentioned solid state imaging device must be able to be arranged within an
area as small as possible.
As described above, in order that the imaging chip may be made small by the
requirement of making small the instrument mounted with the above
mentioned solid state imaging device, the area of the above mentioned
imaging surface must be made small. However, there is a defect that, if
the dimension of the above mentioned imaging chip is made small, the
resolution and sensitivity will reduce.
OBJECTS AND SUMMARY OF THE INVENTION
An object of the present invention is to provide a solid state imaging
device which can be arranged within a small area by well securing the size
of the image area and without reducing the displaying performance and by
which, as a result, such instrument wherein it is arranged as, for
example, an endoscope can be made small or fine in the diameter.
Another object of the present invention is to provide a solid state imaging
device whereby the space within the instrument can be effectively utilized
by extending the diameter or increasing the number of such components
provided in the instrument as, for example, a forceps channel and light
guide.
Farther another object of the present invention is to provide an electronic
endoscope wherein the insertable section having a solid state imaging
device can be made fine in the diameter.
Further another object of the present invention is to provide an electronic
endoscope wherein the space within the insertable section can be
effectively utilized by extending the diameter or increasing the number,
for example, of forceps channels and light guides provided in the
insertable section having a solid state imaging device.
Another object of the present invention is to provide a solid state imaging
device which can prevent an output image from darkening due to the
shortage of incident light in an image area corresponding to a peripheral
part of an object lens.
Briefly the present invention is a solid state imaging device which is
provided with an imaging chip having an image area imaging an image and a
package enclosing this imaging chip and in which at least one corner part
of the image area on the above mentioned imaging chip and the corner part
corresponding to at least the above mentioned image area of the above
mentioned imaging chip are chamfered and the corner part of the above
mentioned package corresponding to this imaging chip is also chamfered.
The other features and advantages of the present invention will become
apparent enough with the following detailed description.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a plan view of an imaging chip of a related art.
FIG. 2(A) is a disassembled perspective view of a solid state imaging
device as an example of a prior art.
FIG. 2(B) is a sectioned view of FIG. 2(A).
FIG. 3 is a perspective view of a solid state imaging device of another
prior art.
FIG. 4 is an explanatory view of a displaying monitor of an electronic
endoscope of a prior art.
FIG. 5 is a perspective view of an electronic endoscope tip part of a
related art.
FIG. 6 is a sectioned explanatory view of a solid state imaging device of a
related art as arranged in an electronic endoscope tip part.
FIGS. 7 to 10 relate to the first embodiment of the present invention.
FIG. 7 is an elevation of a solid state imaging device.
FIG. 8 is an arrangement explaining view of an electronic endoscope
provided with a solid state imaging device.
FIG. 9 is a general view of the electronic endoscope.
FIG. 10 is an arrangement explaining view different from FIG. 8 of an
electronic endoscope provided with a solid state imaging device.
FIGS. 11 and 12 relate to the second embodiment of the present invention.
FIG. 11 is an explanatory view of a solid state imaging device.
FIG. 12 is a sectioned view of the solid state imaging device as arranged
in an electronic endoscope tip part.
BEST MODE FOR CARRYING OUT THE INVENTION
An imaging chip 1 of a solid state imaging device 20 shown in FIG. 7 is
formed, for example, of a CCD. On this imaging chip 1 is formed an image
area 2 comprising a photodiode receiving a light and vertical transfer
lines transferring electric charges. A horizontal transfer line 3
receiving electric charges from the final steps of the above mentioned
vertical transfer lines is formed in the end part of this image area 2. An
output step 4 receiving from the final step of the above mentioned
horizontal transfer line 3 the transferred electric charge is formed on
the side of this horizontal transfer line 3. An electric charge is output
from this output step 4. Electrodes 5 for transmitting and receiving
signals and power sources for the above mentioned respective parts are
formed in the end part of the above mentioned imaging chip 1. Further, the
above mentioned imaging chip 1 is enclosed within a package 10.
As an instrument mounted with the above mentioned solid state imaging
device 20, there is an electronic endoscope for observing, for example, a
body cavity interior or the like.
As shown in FIG. 9, this electronic endoscope 51 is provided with a
flexible insertable section 52 to be inserted into an object to be
inspected and a thick operating section 53 connected to this insertable
section 52 at the rear end. A flexible universal cord 54 is extended
sidewise from the above mentioned operating section and is provided at the
end with a connector not illustrated which is to be connected to a light
source apparatus, video processor and monitor not illustrated.
The above mentioned insertable section 52 comprises a rigid tip part 52a, a
bendable part 52b and a flexible part 52b in the order from the tip side.
Also, in FIG. 9 is shown the above mentioned tip part 52a as magnified to
be perspective. This tip part 52a is provided with a light guide 56
emitting window 56a, an air and water feeding nozzle 57, a forceps channel
port 58 and an objective lens 59.
The above mentioned light guide 56 comprises a fiber bundle, is inserted
through the above mentioned insertable section 52, operating section 53
and universal cord 54 and is connected to the above mentioned connector.
An illuminating light emitted from a light source lamp not illustrated
within the above mentioned light source apparatus is to enter this light
guide 56 at the entrance end.
An air and water feeding tube not illustrated is connected to the above
mentioned air and water feeding nozzle 57, is inserted through the above
mentioned insertable section 52, operating section 53 and universal cord
54 and is connected to the above mentioned connector. Also, the above
mentioned forceps channel port 58 is connected through a channel
connecting pipe not illustrated to a forceps inserting port 60 provided in
the operating section 53.
The above mentioned bendable part 52b is bendable in the
vertical/horizontal direction by the operation of an angle operating knob
61 provided on the operating section 53.
Further, inside the above mentioned objective lens 59, the above mentioned
solid state imaging device 20 is provided and the image area 2 of this
solid state imaging device 20 and the objective lens 59 are arranged as
opposed to each other. The above mentioned solid state imaging device 20
converts the observed image coming in through the objective lens 59 to an
electric signal which is output to the above mentioned video processor.
The above mentioned monitor displays the endoscope observed image.
The entering light amount is so short in the image area 2 corresponding to
the peripheral part of the objective lens 59 that the displayed picture of
the above mentioned endoscope will be dark in the four corners and will
also reduce in the resolution as a characteristic of the lens. Therefore,
as shown in FIG. 4, the displayed picture 23 of the above mentioned
endoscope is made, for example, octagonal with the four corners chamfered.
In this case, the image signals obtained from the four corners of the
image area on the imaging chip will be electrically removed at the time of
displaying or the image area will be optically masked in the four corners.
Thus, depending on the instrument mounted with the solid state imaging
device, the four corners of the image area of the solid state imaging
device are not always necessary.
Therefore, in this embodiment, two of the four corners of the above
mentioned image area 2 are chamfered. The two corners in contact with the
above mentioned horizontal transfer line 3 among the corners of this image
area 2 can not be chamfered because the above mentioned vertical transfer
lines transferring electric charges can not be removed though the above
mentioned photodiode structure is not necessary. Therefore, the two
corners not in contact with the above mentioned horizontal transfer line 3
among the corners of the above mentioned image area 2 are chamfered. Also,
the corners of the above mentioned imaging chip 1 corresponding to them
are chamfered. Further, on the package 10 enclosing the chamfered imaging
chip 1, two corners corresponding to the chamfers of the imaging chip 1
are chamfered.
Thus, the solid state imaging device 20 including the image area 2 in this
embodiment can be changed to be of a polygonal contour from the square
contour and can be made small in the area by chamfering the corners.
Therefore, this solid state imaging device 20 can be arranged within a
small area so as to be able to be arranged in an instrument required to be
small or fine in the diameter to meet the requirement. That is to say, as
shown in FIG. 8, in case the solid state imaging device 20 in this
embodiment is used in the above mentioned electronic endoscope 51, the
solid state imaging device 20 will be arranged with the two chamfered
corners directed to the outer peripheral side of the tip part 52a of the
endoscope.
In case the above mentioned image area 2 is not chamfered, for example, in
the corner parts, unless the dimension of the image area is made small,
the image area 2 will not be able to be arranged in the fine diameter tip
part 52a of the above mentioned endoscope 51. However, the above mentioned
image area 2 can be formed to be large in the required dimension, can well
secure the displaying performance and can be arranged in the fine diameter
tip part 52a of the above mentioned endoscope 51.
In FIG. 10 as different from FIG. 8, the solid state imaging device 20 is
shown to be arranged with the two chamfered corners directed to the inside
of the tip part 52a. In the case of this arrangement, inside the endoscope
tip part 52a, a space can be made by the two chamfered corner parts of the
solid state imaging device 20 and therefore the illuminating light amount
can be efficiently fed to the inspected object, for example, with two
light guides 56 or the forceps channel 58 and nozzle 57 can be made large
in the diameter.
FIGS. 11 and 12 relate to the second embodiment of the present invention.
FIG. 11 is an explanatory view of a solid state imaging device. FIG. 12 is
a sectioned explanatory view of the solid state imaging device of FIG. 11
as arranged in the tip part of an electronic endoscope.
As shown in FIG. 11, the solid state imaging device 21 of this embodiment
is chamfered in three corners as against the solid state imaging device 20
of the first embodiment chamfered in two corners.
The imaging chip 1A of the above mentioned solid state imaging device 21 is
formed substantially the same as in the first embodiment and is enclosed
in a package 10A chamfered in three corners. The other same formations and
operations as in the first embodiment shall bear the same reference
numerals and shall not be explained here.
In this embodiment, two corners of the image area 2 are chamfered the same
as in the first embodiment and, in addition, one of the remaining corners
of the above mentioned imaging chip 1A is chamfered. That is to say, in
the imaging chip 1A, a total of three corners are chamfered. The
electrodes 5 in the above mentioned imaging chip 1A are displaced in the
direction of the above mentioned output step 4 and thereby the corner
positioned on the horizontal transfer line 3 side opposite the output step
4 is chamfered. Further, the package 10A enclosing the chamfered imaging
chip 1A is chamfered in three corners so as to correspond to the chamfers
of the imaging chip 1.
FIG. 12 shows the solid state imaging device 21 enclosing the above
mentioned imaging chip 1A as arranged in the electronic endoscope tip part
52a. In the tip part 52a of the above mentioned electronic endoscope are
arranged the above mentioned solid state imaging device 21, light guide 6,
air and water feeding nozzle 7 and forceps channel 8. The above mentioned
light guide 6 emits an illuminating light toward the object from the tip
and is formed, for example, of an optical fiber bundle. The air and water
feeding nozzle 7 feeds air and water to elevate the pressure within the
body cavity and wash the objective lens. The forceps channel 8 is to have
various forceps inserted through it to make such medical treatments as
collecting living body tissues and injecting dyes and medicinal liquids.
If the respective outside diameters of the above mentioned respective
components are set, for example, so that the diameter of the light guide 6
may be about 2.8 mm, the diameter of the air and water feeding nozzle 7
may be about 2 mm and the diameter of the forceps channel 8 may be about 4
mm and further the image area 2 of the above mentioned solid state imaging
device 21 is set to be, for example, 3.times.3 mm, the outside diameter of
the above mentioned endoscope tip part will be about 8.3 Mm at the
minimum. Therefore, in case the solid state imaging device 21 of this
embodiment is arranged in the above mentioned endoscope, the outside
diameter of the endoscope tip part will be able to be made smaller by
about 10% than in the prior example.
Thus, in the case of arranging a circular component and solid state imaging
device within a circular instrument, if the corner parts not always
necessary in the above mentioned solid state imaging device 21 are
chamfered, the contour of the above mentioned solid state imaging device
21 will be able to be near to a circle, will be able to be arranged within
a small area without reducing the displaying performance and will be able
to make small the instrument in which the above mentioned solid state
imaging device is arranged.
Furthermore, in the endoscope tip part 52a, as one of the three chamfered
corners of the solid state imaging device 21 is arranged inside the tip
part 52a, a space will be made so that, for example, the light guide 56
may be made large in the diameter or another forceps channel may be
arranged.
By the way, the number of the chamfers of the solid state imaging device is
not limited to the above mentioned embodiment. Depending on the contour of
the instrument in which the solid state imaging device is arranged, the
imaging device may be chamfered so that the contour may be optimum to make
the device small. If the image area can be chamfered, the imaging chip
will not be limited to the CCD.
It is apparent that, in this invention, different working modes can be
formed in a wide range on the basis of the spirit of the invention. This
invention is not restricted by its specific working mode except being
limited by the appended claims.
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