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United States Patent | 5,254,833 |
Okiyama | October 19, 1993 |
The brittle material cleavage-cutting apparatus of the present invention comprises a placing stand for holding a brittle material and beam scanning device for deflecting a laser beam from a laser source so that a brittle material placed on the placing stand is scanned along a planned cleavage-cutting line. By the beam scanning device, the laser-beam irradiation position on the brittle material is repeatedly moved in short cycles along the planned cleavage-cutting line.
Inventors: | Okiyama; Toshihiro (Himeji, JP) |
Assignee: | Soei Tsusho Company, Ltd. (Osaka, JP) |
Appl. No.: | 935906 |
Filed: | August 27, 1992 |
Jan 11, 1991[JP] | 3-2026 |
Current U.S. Class: | 219/121.68; 65/105; 65/112; 219/121.8 |
Intern'l Class: | B23K 026/00 |
Field of Search: | 219/121.67,121.68,121.81 65/103,105,112 |
5132505 | Jul., 1992 | Zonneveld et al. | 219/121. |