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United States Patent |
5,227,761
|
Sugimoto
,   et al.
|
July 13, 1993
|
Magnetoresistive sensor
Abstract
A magnetoresistive sensor includes a magnetic field detecting portion
composed of a ferromagnetic thin film formed on one side of an insulating
rectangular substrate, at least two terminal electrode portions and wiring
portions. In the magnetoresistive sensor, the surface level of at least
two corner portions is lower than that of the surface portion of the
substrate other than at least two corner portions on the one side of the
substrate, the at least two terminal electrode portions are separately
formed at the corner portions having the lower surface level and the
magnetic field detecting portion composed of the ferromagnetic thin film
is formed on a portion of the surface of the substrate other than the at
least two corner portions. In the magnetoresistive sensor, the terminal
electrode portions are formed on the corner portions of the substrate
whose level is lower than that of the surface on which the magnetic field
detecting portion is formed and accordingly, when a resin mold is applied
for the purpose of reinforcing the bonded portions, the resin mold can be
formed such that the surface level of the molded portion is almost equal
to that of the surface on which the magnetic field detecting portion is
formed.
Inventors:
|
Sugimoto; Yoshiyasu (Shizuoka, JP);
Shibasaki; Ichiro (Shizuoka, JP)
|
Assignee:
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Asahi Kasei Kogyo Kabushiki Kaisha (Osaka, JP)
|
Appl. No.:
|
761948 |
Filed:
|
October 31, 1991 |
PCT Filed:
|
January 25, 1991
|
PCT NO:
|
PCT/JP91/00082
|
371 Date:
|
October 31, 1991
|
102(e) Date:
|
October 31, 1991
|
PCT PUB.NO.:
|
WO91/11729 |
PCT PUB. Date:
|
August 8, 1991 |
Foreign Application Priority Data
Current U.S. Class: |
338/32R; 324/249; 324/252; 338/306 |
Intern'l Class: |
H01L 043/00 |
Field of Search: |
338/32 R,306,307,314
324/207.21,249-252
264/61
|
References Cited
U.S. Patent Documents
4477794 | Oct., 1984 | Nomura et al. | 338/32.
|
Foreign Patent Documents |
58-154478 | Oct., 1983 | JP.
| |
59-97487 | Jul., 1984 | JP.
| |
59-179320 | Nov., 1984 | JP.
| |
59-179321 | Nov., 1984 | JP.
| |
59-179322 | Nov., 1984 | JP.
| |
61-158966 | Oct., 1986 | JP.
| |
63-34986 | Feb., 1988 | JP.
| |
63-43987 | Feb., 1988 | JP.
| |
1-214784 | Aug., 1989 | JP.
| |
Primary Examiner: Lateef; Marvin M.
Attorney, Agent or Firm: Finnegan, Henderson, Farabow, Garrett & Dunner
Claims
We claim:
1. A magnetoresistive sensor comprising:
a substrate having a surface including corner portions, said substrate
having a surface level of at least two corner portions that is lower than
that of a remaining substrate surface, said remaining substrate surface
being substantially flat;
at least two terminal electrodes separately disposed at said at least two
corner portions having the lower substrate surface, respectively;
means for detecting a magnetic field including a patterned ferromagnetic
thin film disposed on the remaining substrate surface other than said at
least two corner portions; and
a wiring portion disposed on said surface for connecting said magnetic
field detecting means to said at least two terminal electrodes.
2. A magnetoresistive sensor as claimed in claim 1, wherein said at least
two corner portions on said surface of said substrate have stepped
portions for forming the lower surface level.
3. A magnetoresistive sensor as claimed in claim 1, wherein said at least
two corner portions on the surface of said substrate are inclined with
respect to the remaining substrate surface for forming the lower surface
level.
4. A magnetoresistive sensor as claimed in claim 1, wherein the substrate
has a regular square shape.
5. A magnetoresistive sensor as claimed in claim 4, wherein said magnetic
field detecting means includes a sensor pattern with a longitudinal
direction, said longitudinal direction of said sensor pattern being formed
parallel to a diagonal line of said square substrate.
6. A magnetoresistive sensor as claimed in claim 1, wherein said terminal
electrodes include input and output terminals that are disposed at
symmetrical positions with one another with respect to a center of the
surface of said substrate.
7. A magnetoresistive sensor as claimed in claim 1, wherein said lower
surface level of the corner portions on which said terminal electrode
portions are disposed is at least 50 .mu.m lower than the substrate
surface on which said magnetic field detection means is disposed.
8. A magnetoresistive sensor as claimed in claim 1, further comprising an
electric resistance element disposed on the surface of said substrate.
9. A magnetoresistive sensor as claimed in claim 1, further comprising
functional elements disposed on the surface of said substrate.
10. A magnetoresistive sensor as claimed in claim 1, wherein said wiring
portions have a width larger than a width of said patterned ferromagnetic
thin film.
11. A magnetoresistive sensor as claimed in claim 1, wherein each one of
said terminal electrodes is disposed at a different one of said at least
two corner portions.
12. A magnetoresistive sensor comprising:
a magnetoresistive sensor substrate having a surface including corner
portions, said substrate having a surface level of at least two corner
portions lower than that of a remaining substrate surface;
at least two terminal electrodes separately disposed at said at least two
corner portions having the lower surface level, respectively;
means for detecting a magnetic field including a ferromagnetic thin film
disposed on the remaining substrate surface other than said at least two
corner portions; and
a magnetic signal processing unit connected to the terminal electrodes and
including an integral circuit element disposed on a semiconductor
substrate.
13. A magnetoresistive sensor comprising:
a substrate having a surface including corner portions, said substrate
having a surface level of at least two corner portions and a part of
peripheral portions that is lower than that of a remaining substrate
surface, said remaining substrate surface being substantially flat;
at least two terminal electrodes separately disposed at said at least two
corner portions and said part of peripheral portions having the lower
substrate surface, respectively;
means for detecting a magnetic field including a patterned ferromagnetic
thin film disposed on the remaining substrate surface other than said at
least two corner portions; and
a wiring portion disposed on said surface for connecting said magnetic
field detecting means to said at least two terminal electrodes, said
wiring portion having a width larger than a width of said patterned
ferromagnetic thin film.
14. A method for producing a magnetoresistive sensor including a portion
for detecting a magnetic field provided on a flat surface of an insulating
substrate having a rectangular shape, terminal electrodes provided on at
least two corners of said insulating substrate, and a wiring portion for
connecting said magnetic field detecting portion to said terminal
electrodes, the method comprising the steps of:
forming a plurality of recesses on a flat surface of an insulating sheet
having a rectangular shape, said recesses being aligned in arrays and
disposed parallel to both sides of said insulating sheet, said recesses
being equidistantly aligned in a direction along one side of said
insulating sheet and equidistantly aligned in a direction along another
side of said insulating sheet;
depositing a ferromagnetic thin film on an entire surface of said
insulating substrate;
forming terminal electrodes on said recesses;
patterning said ferromagnetic thin film to form the magnetic field
detecting portion and the wiring portion; and
cutting said insulating substrate along said arrays to form a plurality of
individual magnetoresistive sensor pellets.
15. A method as claimed in claim 14, wherein said insulating sheet is a
green insulating sheet, said green insulating sheet being subjected to
firing after said plurality of recesses are formed.
16. A method as claimed in claim 15, wherein said recesses forming step
comprises the step of pressing said green insulating sheet to form said
plurality of recesses.
17. A method as claimed in claim 15, wherein said recesses forming step
comprises the steps of:
preparing a first green insulating sheet having a flat surface and a
rectangular shape and a second green insulating sheet having a plurality
of holes; and
laminating said second green insulating sheet on the flat surface of said
first insulating green sheet to form a laminated green insulating sheet
having a plurality of said recesses on the surface thereof.
18. A method as claimed in claim 14, wherein said plurality of recesses are
formed on a surface of an insulating sheet subjected to firing.
Description
TECHNICAL FIELD
The present invention relates to a magnetoresistive sensor having a
ferromagnetic thin film and for use in, for instance, a capstan motor for
video cassette recorders (VCR) and a magnetic encoder.
BACKGROUND ART
Recently, a magnetoresistive sensor having a ferromagnetic thin film has
been used for an accurate control of a magnetic encoder or an accurate
control of a capstan motor for VCR and it has been necessary to use such a
sensor for controlling a motor with high accuracy. FIG. 1 is a schematic
cross sectional view of a capstan motor for VCR in which a conventional
magnetoresistive sensor is incorporated. In this capstan motor shown in
FIG. 1, reference numerals 16, 17 and 10' respectively represent a rotor
yoke, a rotor magnet and a frequency-generating magnet (FG magnet) in
which N poles and S poles are alternatively magnetized at small pitches
and these elements constitute a rotor part. Reference numeral 18 stands
for a stator coil for driving the motor and reference numeral 19
represents a case. Reference numeral 15 represents a magnetoresistive
sensor which is fixed to a holder 15H made of a resin. The magnetic field
detecting portion 15S is arranged facing the FG magnet 10' normally at a
distance of about 100 .mu.m, and thus, the rotation control of the motor
is performed by the output signal from the magnetoresistive sensor.
Reference numeral 7 stands for a lead portion of the magnetoresistive
sensor for electrically connecting the magnetoresistive sensor 15 and a
printed circuit board 20.
The FG magnet is in general magnetized at small pitches, and
correspondingly, the intensity of the generated magnetic field is small.
For this reason, a desired output cannot be obtained if the gap between
the magnetoresistive sensor 15 and the FG magnet 10' is large.
FIG. 2A shows a plan view of a conventional magnetoresistive sensor before
it is attached to the holder made of resin, and FIG. 2B shows a sectional
view thereof taken along the line A--A of FIG. 2A. Reference numerals 15S,
15M and 7 represent a magnetic field detecting portion of the
magnetoresistive sensor 15, a molded portion for reinforcing lead-bonding
portion and a lead, respectively. In the structure as shown in FIGS. 2A
and 2B, the electrical connection between the lead and the sensor pellet
is usually performed through the bonding with a solder. Moreover, an
electrical short often arises and the lead is sometimes peeled off from
the lead-bonding portions when they are in the exposed state. Thus, the
bonding portions are reinforced by molding for the purpose of eliminating
such inconvenience. The reinforcement of the bonding portions are in
general performed with the aid of a resin such as epoxy resin and the
thickness of the resin must be more than the thickness of the lead, and
more specifically, it must be 200 .mu.m or thicker.
This sensor is arranged facing the FG magnet 10, which produces the
magnetic field signals, as shown in FIG. 3A. Then, the minimum gap between
the magnetic field detecting portion 15S and the surface of the FG magnet
10 becomes greater than 200 .mu.m even if the molded portion with a resin
approaches the magnet to such an extent that the portion almost comes in
contact with the latter. Recently, motors have been miniaturized and made
highly precise, and correspondingly, the pitch of magnetization of the FG
magnet has become smaller, hence, the intensity of the magnetic field
produced by such a magnet has a very small value. Therefore, the desired
output signal from the sensor cannot be obtained, as has been described
above, if the gap between the magnetic field detecting portion 15S and the
FG magnet 10 is as much as 200 .mu.m. As has been discussed above, a
desired value of output signal from the sensor cannot be obtained unless
the gap is in the order of 100 .mu.m or smaller.
For this reason, in the conventional technology as shown in FIG. 3B, an
element is arranged so that a molded portion 15'M is kept away from the FG
magnet 10. However, if the element is arranged in such a manner, a larger
space is required below the rotor for avoiding the contact of the molded
portion with the rotor. Therefore, this makes it difficult to reduce the
thickness of the motor. In order to obtain the maximum output signal of
the magnetoresistive sensor, it is necessary to face the entire region of
the magnetic field detecting portion 15'S to the magnetized surface of the
rotor. In general, it is sometimes observed that the rotor is shifted up
and down during rotation in the order of about several hundreds of
micrometers. Accordingly, to prevent the reduction in the output of the
sensor, it is inevitable to keep a large distance between the lower end of
the magnetic field detecting portion 15'S and the upper end of molded
portion 15'M reinforced with a resin because the magnetic field detecting
portion and the magnetized surface always face each other even if the
rotor position shifts up and down. This would be a major obstacle in the
miniaturization of the sensor element.
Another conventional magnetoresistive sensor is disclosed in Japanese
Utility Model Application Laying-open No. 158966/1986. FIG. 4A is a plan
view thereof and FIG. 4B is a sectional view taken along the line A--A in
FIG. 4A. As shown in FIG. 4B, this sensor is designed such that a terminal
electrode portion 21T is formed on a lower portion of a linear step formed
on a silicon substrate 21. Reference numerals 21S, 21M and 6 represent,
respectively, a magnetic field detecting portion, a molded portion and a
wiring portion for electrically connecting the terminal electrode portion
21T and a lead 7. By making the step larger, this sensor can be designed
such that the resin molded surface is not projected over the level of the
surface on which the magnetic field detecting portion is formed, unlike
the foregoing conventional sensor, even when the terminal portion is
reinforced through molding with a resin. If the sensor is designed so as
to have such a construction, the distance between the magnetic signal
source such as an FG magnet and the surface of the sensor, or the position
at which the sensor is to be arranged can arbitrarily be established
without the restrictions observed in the conventional ones explained with
reference to FIGS. 3A and 3B.
First, the production of an element having such a structure requires extra
steps to make the linear or band-like portion before processing a
substrate and subsequently, the element is prepared. In addition, it is
very difficult to practically produce an element having such a structure
because of the following problems. A first problem relates to the
structure of the substrate. The band-like stepped portion must have a
difference of level in the order of at least 200 .mu.m for limiting the
surface of the molded portion to a level lower than that of the surface on
which the magnetic field detecting portion is formed. As a specific
example, Japanese Utility Model Application Laying-open No. 158966/1986
discloses that the stepped portion may be formed by etching an Si
substrate. However, the formation thereof is very difficult. Such a
stepped portion cannot be obtained through only one run of etching, and
thus, it is necessary to repeat such an etching process over several tens
of times. In other words, the etching process must be repeated over many
times, and accordingly, the resulting substrate would be very expensive
when taking the cost for the production thereof into consideration.
Another problem is the difficulty in processing a substrate. In particular,
it is very difficult to carry out the phololithographic process and it is
impossible to obtain a pattern with high accuracy. When it is intended to
prepare the sensor element having a band-like stepped portion as shown in
FIG. 4B, a terminal electrode portion must be formed on the lower portion
of the stepped portion. However, with a large difference of level, it is
impossible to form a pattern on the band-like portion of the lower step
through the photolithographic process. Therefore, a sufficient
mass-production and productivity cannot be ensured. Moreover, as the
terminal electrode portion cannot be formed through the phololithograph
process, a fine terminal pattern cannot be formed with high accuracy.
Hence, the distance between the terminals and the size thereof are
increased. Correspondingly the size of the sensor element is also
increased. On the other hand, if the width of the sensor element is
reduced, this conventional sensor element having the foregoing structure
suffers from the problems of electrical short arising between the
terminals and of the contact with the bonded wires since terminal
electrode portions are present on the same line (or band).
As has been explained above, there has not been a proposal of an element
having a structure in which the surface of the molded portion is not
projected over the level of the surface on which the magnetic field
detecting portion is formed, which can effectively be mass-produced,
connected through the wire bonding technique, and has high reliability.
DISCLOSURE OF THE INVENTION
An object of the present invention is to solve the problems explained above
and to provide a magnetoresistive sensor which is not adversely affected
due to the projection of the mold on terminal portions, in which the
distance between the surface of a magnetic signal source as an FG magnet
and the magnetic field detecting portion of a sensor as well as the
position at which the sensor is arranged, can be freely established. In
other words, a magnetoresistive sensor is provided in which the
lead-taking out portion is not an obstacle in the detection of magnetic
signals.
Another object of the present invention is to provide a magnetoresistive
sensor which has a structure whose electrical connection between terminal
electrode portion of an element pellet and a lead can be performed through
the wire-bonding method capable of ensuring high heat resistance and high
reliability, and which can be produced according to a wafer process
capable of achieving mass-production.
According to one aspect of the present invention, the magnetoresistive
sensor, including a magnetic field detecting portion having a
ferromagnetic thin film substrate, at least two terminal electrode
portions and wiring portion respectively formed on one rectangular
surface, includes:
on the one surface of the substrate, the surface level of at least two
corner portions is lower than that of the portion at the substrate other
than the at least two corner portions,
the at least two terminal electrode portions are formed one by one at the
corner portions having the lower surface level, respectively, and
the magnetic field detecting portion including the ferromagnetic thin film
is formed of a portion on the surface of the substrate other than the at
least two corner portions.
The foregoing at least two corner portions on the surface of the substrate
may have stepped portions so that the surface level thereof is lower than
the level of the other surface portion, or alternatively, the surface of
the at least two corner portions may be inclined with respect to the other
surface portion so that the surface level thereof is lower than the level
of the other surface portion.
The external shape of the substrate may be a regular square.
The longitudinal direction of the sensor pattern of the magnetic field
detecting portion may be formed parallel to a diagonal line of the
regularly square substrate.
The terminal electrode portions for input and output may be formed on
symmetrical positions with one another with respect to the center of the
surface of the substrate.
On the surface of the substrate, the level of the corner portions on which
the terminal electrode portions are formed may be at least 50 .mu.m lower
than that of the portion on the substrate on which the magnetic field
detecting portion is formed.
On one side of the substrate, the level of a part of the peripheral portion
other than the corner portions may be lower than that of the surface on
which the magnetic field detecting portion is formed.
An electrical resistance element may be formed, and further, other
functional elements may also be formed on the surface of the substrate.
According to another aspect of the present invention, a magnetoresistive
sensor includes:
a magnetoresistive sensor substrate in which, on one surface of the
substrate, the surface level of at least two corner portions is lower than
that of a portion of the surface of the substrate other than the at least
two corner portions,
at least two terminal electrode portions separately formed at the corner
portions having the lower level respectively,
a magnetic field detecting portion includes a ferromagnetic thin film is
formed on the portion of the surface of the substrate other than the at
least two corner portions, and
a magnetic signal processing part includes an integrated circuit element
disposed on a semiconductor substrate.
In the magnetoresistive sensor according to the present invention, the
terminal electrode portions are formed at the corner portions on the
substrate whose level is lower than that for the surface on which the
magnetic field detecting portion is formed. Accordingly, it is easy to
miniaturize the element and when a resin mold is applied for the purpose
of reinforcing the bonded portions, the resin mold can be formed so that
the surface of the molded portion is almost equal to that of the surface
on which the magnetic field detecting portion is formed.
Moreover, the wire bonding technique can be adopted in the sensor of the
present invention and, therefore, the sensor element having high
reliability can be produced at low cost.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a schematic sectional view of a motor for VCR in which a
conventional magnetoresistive sensor is incorporated;
FIGS. 2A and 2B are a plan view and a sectional view of a conventional
magnetoresistive sensor, respectively;
FIGS. 3A and 3B are, respectively, sectional views, each illustrating a
condition in which a conventional magnetoresistive sensor and the surface
of a rotor face one another;
FIG. 4A is a plan view of another conventional magnetoresistive sensor;
FIG. 4B is a sectional view taken along the line A--A in FIG. 4A;
FIGS. 5A, 5B and 5C are, respectively, a plan view, a side view and a
sectional view taken along the line A--A in FIG. 5A for illustrating a
first embodiment of the magnetoresistive sensor pellet according to the
present invention;
FIG. 6A is a plan view of the structure of a substrate prior to the
production of the first embodiment of the magnetoresistive sensor
according to the present invention;
FIG. 6B is a cross sectional view taken along the line A--A in FIG. 6A;
FIG. 7A is a plan view showing the first embodiment of the magnetoresistive
sensor according to the present invention which is subjected to the wire
bonding and the transfer molding thus forming a final element;
FIG. 7B is a sectional view taken along the line A--A in FIG. 7A;
FIG. 8 is a sectional view for showing the first embodiment of the
magnetoresistive sensor pellet according to the present invention which is
subjected to the wire bonding and the injection molding thus forming a
final element;
FIG. 9 is a sectional view for illustrating a condition in which the
surface of a rotor and the element shown in FIG. 7B or FIG. 8 face each
other;
FIGS. 10A and 10B are a plan view and a sectional view showing a ceramic
green sheet through which holes are made, respectively;
FIGS. 11A and 11B are a plan view and a sectional view showing a plate-like
ceramic green sheet, respectively;
FIGS. 12A to 12E are sectional views for illustrating the structure of a
substrate (corresponding to one chip) which can be used for fabricating
the magnetoresistive sensor according to the present invention;
FIG. 13A is a plan view showing a second embodiment of the magnetoresistive
sensor according to the present invention;
FIG. 13B is a cross sectional view taken along the line A--A in FIG. 13A;
FIG. 14 is a plan view showing a third embodiment of the magnetoresistive
sensor according to the present invention;
FIG. 15 is a plan view showing a fourth embodiment of the magnetoresistive
sensor according to the present invention;
FIG. 16 is a plan view showing a fifth embodiment of the magnetoresistive
sensor according to the present invention;
FIG. 17 is a plan view showing a sixth embodiment of the magnetoresistive
sensor according to the present invention;
FIG. 18A is a plan view showing a seventh embodiment of the
magnetoresistive sensor according to the present invention;
FIG. 18B is a sectional view taken along the line A--A in FIG. 18A;
FIG. 19A is a plan view of an element which is obtained to electrically
connect on the terminal electrode portions of the magnetoresistive sensor
pellet shown in FIGS. 18A and 18B by the lead-bonding with a solder;
FIG. 19B is a sectional view taken along the line A--A in FIG. 19A;
FIG. 20A is a plan view showing an eighth embodiment of the
magnetoresistive sensor according to the present invention;
FIG. 20B is a sectional view taken along the line A--A in FIG. 20A;
FIG. 21 is a sectional view showing a ninth embodiment of the
magnetoresistive sensor according to the present invention;
FIGS. 22 and 23 are plan views showing tenth and eleventh embodiments of
the magnetoresistive sensor according to the present invention,
respectively; and
FIGS. 24A and 24B are, respectively, a plan view and a sectional view of a
twelfth embodiment of the magnetoresistive sensor according to the present
invention.
BEST MODE FOR CARRYING OUT THE INVENTION
The present invention will be explained with reference to the attached
drawings.
In the following description, the term "magnetoresistive sensor" means one
in which terminals are electrically connected to lead portions and desired
portions are molded, and the term "magnetoresistive sensor pellet" means a
principal component which functions as a magnetoresistive sensor.
Accordingly, the magnetoresistive sensor and the magnetoresistive sensor
pellet are considered as being identical with one another in the
embodiments according to the present invention.
EMBODIMENT 1
FIG. 5A is a plan view of a magnetoresistive sensor pellet which is a
principal component of the magnetoresistive sensor according to the first
embodiment of the present invention, FIG. 5B is a side view thereof, and
FIG. 5C is a sectional view taken along the line A--A in FIG. 5A. This
embodiment relates to a magnetoresistive sensor pellet with four terminals
which comprises an insulating rectangular substrate 1 made of ceramic such
as alumina having rectangular recesses 1A at the four corners.
Reference numeral 2 represents a ferromagnetic thin film of, for instance,
an iron-nickel alloy (Fe-Ni), 2S a magnetic field detecting portion, 2W
wiring portions, 3 terminal electrode portions formed in the recesses 1A
and 4 a passivation film. The sensor pattern of the magnetic field
detecting portion in this sensor pellet is formed such that the
longitudinal direction of the pattern is parallel to the side of the
pellet. Further, in this embodiment, patterns of the wiring portions 2W
are formed symmetrically. In other words, they are designed to have a
structure such that any offset voltage is hardly generated. As shown in
FIG. 5A, the width of the wiring portions 2W is larger than that of the
magnetic field detecting portions 2S.
The method for manufacturing this embodiment will now be described below.
FIGS. 6A and 6B show the structure of a substrate prior to the production
of the element according to this embodiment. FIG. 6A is a plan view of the
substrate. In FIG. 6A, the shadowed region 1B enclosed with broken lines
corresponds to the region of one unitary sensor pellet. FIG. 6B is a
sectional view taken along the line A--A in FIG. 6A. The recessed
structure on the substrate is formed by depressing a metal mold against a
green sheet with a flat surface prior to firing thereof during the
processes for producing the ceramic substrate so that each step has a
difference in level in the order of 200 .mu.m. The ferromagnetic material
such as an Fe-Ni alloy which shows a magnetoresistive effect was deposited
on the whole surface of the substrate to thus obtain a ferromagnetic thin
film (FIG. 5A). Subsequently, a photoresist pattern was formed onto the
substrate according to the photolithography technique so that the surface
of the substrate other than the recessed portions shown in FIG. 6A was
covered and terminal electrode portions 3 (FIG. 5A) were formed on the
recessed portions according to plating means or vapor deposition technique
for example. In this respect, the most upper layer was formed from a
material which makes it possible to perform wire bonding with, for
instance, gold (Au). Thereafter, photoresist patterns for the magnetic
field detecting portions 2S and the wiring portions 2W were again formed
according to the photolithography technique and then the unnecessary
portions thereof were removed by etching to thus form a sensor pattern.
The desired portion was covered with a passivation film 4. Then, the
resulting product was cut into unitary sensor pellets (chips), i.e.,
sensor pellets, each corresponding to the shadowed region 1B as shown in
FIG. 6A with a cutting means such as dicing. As has been described above,
the magnetoresistive sensor according to the present invention can be
produced while applying the usual semiconductor processes.
FIGS. 7A and 7B show an element obtained by fixing the magnetoresistive
sensor pellet shown in FIG. 5A to a lead frame through die bonding,
electrically connecting terminals of the sensor pellet with a lead by
bonding with an Au wire 6, and subjecting the connected element to
transfer molding with a thermoset epoxy resin 5. FIG. 7A is a plan view
thereof and FIG. 7B is a sectional view taken along the line A--A in FIG.
7A. In this case, the structure of the pellet was formed in such a manner
that terminal electrode portions for input and output and the sensor
patterns are formed in a 180.degree. point symmetrical relation as shown
in FIGS. 5A and 5B. For this reason, the fixing of the pellet through the
die bonding can be performed according to two ways. In other words, a
pattern having a certain orientation is geometrically identical with a
pattern which is obtained by rotating the former at an angle of
180.degree.. Thus, if the fixing through the die bonding is performed in
either of the orientations to prepare a sensor element, the resulting
element makes it possible to detect the same magnetic signal source and to
give the same output signal. Moreover, in the element having such a
structure, the sensor pellet and the lead 7 are electrically connected
through a wire 6 and, therefore, the element has very high reliability in
"test for heat resistance during soldering". The following table 1 shows
the results (variation in properties) obtained by examining the embodiment
of the element according to the present invention and the comparative
embodiment which was obtained by bonding with a solder as shown in FIG. 2B
through the "test for heat resistance during soldering" which was
performed at 260.degree. C. for 30 seconds. The element according to the
present invention never caused any change in its properties even after the
test.
TABLE 1
______________________________________
Change in Change in
Resistance (%)
Sensitivity (%)
______________________________________
Embodiment of .+-.0.2 .+-.0.6
the Invention
Comparative .+-.2.5 -9.3
Embodiment
______________________________________
In addition, the element as shown in FIGS. 7A and 7B in which the
electrical connection is performed by the wire bonding has a structure
suitable for automatic production inclusive of the molding process to thus
simplify the manufacturing processes. Thus, such a structure makes it
possible to reduce the production cost thereof since the element has very
high reliability and can be assembled with high efficiency as compared
with those obtained by assembling through bonding with a solder.
In order to make the surfaces divel of the magnetic field detecting portion
identical with that for the molded resin surface as shown in FIG. 7B, the
difference in level between the terminal electrode portions and the other
portion on a substrate must be at least 50 .mu.m while taking the height
of the wire and the accuracy of the metal mold for molding into
consideration. The practical difference in level is preferably not less
than 100 .mu.m and more preferably, not less than 200 .mu.m.
When the transfer molding is performed, the surface of the magnetic field
detecting portion may be pressed against the surface of the metal mold for
the purpose of exposing the surface of the sensor. In such a case, a resin
such as a polyimide, a photosolder resist, or a solder mask resist may
further be coated on the passivation film 4 for preventing surface
breakage of the magnetic field detecting portion.
FIG. 8 shows a section of an element which is molded with a thermoplastic
resin 8 through the injection molding. In rationalizing the assembly or
the like, the foregoings may apply to this case. As to the heat resistance
during soldering, this element is unfavorable as compared with the
thermosetting resin used in the transfer molding, but this problem can be
solved by the use of a resin having high heat resistance such as
polyphenylene sulfide or polybutylene terephthalate.
FIG. 9 shows a condition in which the magnetoresistive element 10 having a
structure as shown in FIG. 7B or FIG. 8, and an FG magnet 9 facing each
other. Since the surface of the resin mold and the magnetic field
detecting portion 10S can be formed such that the level of the former is
approximately equal to that for the latter, the miniaturization of the
element can be ensured. Moreover, it is not necessary to secure any space
below the rotor for avoiding the contact with the projected portion of the
molded resin. This serves to reduce the thickness of the motor.
The following Table 2 shows the ratio of the smallest required area for the
sensor pellet according to the embodiment of the present invention to that
for the comparative element as shown in FIG. 2B when these elements are
designed to have the same electrical properties. As seen from the results
listed in Table 2, the present invention can reduce the size of the sensor
pellet to not more than 1/3 time that for the conventional one.
TABLE 2
______________________________________
Size of Sensor Pellet
Area Ratio
______________________________________
Embodiment of
2 mm .times. 2 mm
1
the Invention
Comparative 3 mm .times. 4 mm
3
Embodiment
______________________________________
Although it is practically difficult to obtain an element as shown in FIGS.
4A and 4B, the ratio of the size of the sensor pellets becomes greater
than that obtained with respect to the foregoing comparative element while
taking into consideration large pitches between wiring portions to avoid
the electrical short even if the elements are designed to have the same
electrical properties.
In this embodiment, the formation of the terminal electrode portions are
performed after depositing the ferromagnetic thin film, but it is also
possible to form the terminal electrode portions in advance before the
deposition of the ferromagnetic material to obtain a ferromagnetic thin
film. In other words, there is no restriction in the order of the
formation thereof.
In this embodiment, the recessed portions on the substrate are formed by
depressing a metal mold against a green sheet of ceramic prior to firing,
but there is also no restriction in the method for manufacturing these
recessed portions. For instance, a substrate having the same structure can
also be obtained by pasting a green sheet 11 of ceramic having holes made
at desired pitches, whose plan view and sectional view are shown in FIGS.
10A and 10B, respectively, to a normal plate-like green sheet 11' of
ceramic having no hole, whose plan view and sectional view are shown in
FIGS. 11A and 11B, respectively, and then firing the resulting assembly.
The holes as shown in FIGS. 10A and 10B can be formed easily by pressing a
ceramic while it is still in the green sheet state in a metal mold or the
like. A ceramic substrate having a structure similar to that shown in
FIGS. 6A and 6B can be prepared by pasting this green sheet in which holes
are made in the manner explained above to a green sheet with no holes as
shown in FIGS. 11A and 11B and then firing the assembly. The recessed
portions can also be formed after the firing of the substrate through a
means such as a laser processing technique.
FIGS. 12A to 12E show sectional views of substrates which are cut into
chips and which can be used in the present invention. FIG. 12A is a
sectional view of a ceramic substrate 1 in which a part of a ceramic
substrate, i.e., regions 1A, for forming the terminal electrode portions
are recessed as exemplified in this embodiment, and FIG. 12B is a
sectional view of a ceramic substrate having recessed portions 1A and a
glazed layer 12 applied on the surface other than the recessed portions.
FIG. 12C is a sectional view of a substrate 1 which is prepared by
applying a glazed layer 12' onto the flat surface of a ceramic substrate
1' except for the surface regions 1A for forming the terminal electrode
portions to thus project the surface area. FIG. 12D is a sectional view of
the structure of a substrate whose regions 1A for forming the terminal
electrode portions are tapered. FIG. 12E is a sectional view of the
structure of a substrate whose stepped portions are almost vertically
formed and in which a glazed layer 12 is applied to the region for forming
the magnetic field detecting portion. In order to make the most use of the
magnetic properties of the magnetoresistive sensor, the surface roughness
of the region for forming the magnetic field detecting portion is
desirably as small as possible. Therefore, a glazed layer is preferably
applied onto the surface of the region for forming the magnetic field
detecting portion as shown in FIGS. 12B, 12C and 12E because of the small
surface roughness thereof. However, if the glazed layer is too thick, the
surface of the glazed layer is greatly curved. As a result, if such a
substrate is processed to form a sensor element, the magnetic field
detecting portion is thus formed on a curved surface. In such a sensor
element, the gap between a magnetic signal source and the magnetic field
detecting portion is not uniform and accordingly, the output signal from
the sensor element is also unstable. The glazed surface may be polished in
order to eliminate such a disadvantage. Thus, the magnetic field detecting
portion can be formed on a flat surface by polishing the glazed surface.
EMBODIMENT 2
FIG. 13A is a plan view of a second embodiment of the magnetoresistive
sensor pellet according to the present invention and FIG. 13B is a
sectional view taken along the line A--A in FIG. 13A. This embodiment
relates to a magnetoresistive sensor with four terminals which comprises
fan-shaped recesses 101A at the four corners on a regular square substrate
101. In this case, a glazed layer 12 is applied below the magnetic field
detecting portion and a substrate having a sectional structure as shown in
FIG. 12B is employed. The recesses may have a fan-shaped form as in this
embodiment or may have any other shape. Reference numeral 101 represents a
ceramic substrate, 201 a ferromagnetic thin film, 201S a magnetic field
detecting portion, 201W wiring portions, and 301 terminal electrode
portions, respectively. The magnetoresistive sensor pellet of this
embodiment can be produced in the same manner used in Embodiment 1 except
for the formation of the glazed layer, the shape of the recesses, and the
pitches thereof. The glazed layer 12 was formed by coating a glass paste
on a ceramic substrate after preparing the same and then firing the coated
layer. Moreover, in this case, the sensor pattern of the magnetic field
detecting portion is formed such that the longitudinal direction of the
pattern is parallel to the diagonal of the regular square substrate. This
structure is favorable for elongating the length of the sensor in
comparison with that of Embodiment 1. In addition, each of the input
terminals, the output terminals or the like are formed symmetrically as in
Embodiment 1, and correspondingly, the element can be fixed through the
die bonding technique according to two ways as in Embodiment 1. Further,
the layout of the wiring portions are also symmetrical as in the case
shown in FIG. 5A. This structure is likewise designed so that the offset
voltage is not generated.
EMBODIMENT 3
FIG. 14 is a plan view of a third embodiment which is a magnetoresistive
sensor pellet with three terminals which comprises fan-shaped recesses
102A at three corners of the the four corner substrate. This sensor pellet
can be produced according to the same manner as used in Embodiment 1
except for the shape of the recess and the pitches formed thereof.
In FIG. 14, reference numeral 102 represents a ceramic substrate, 202 a
ferromagnetic thin film, 202S a magnetic field detecting portion, 202W
wiring portions and 302 terminal electrode portions. For elements with
three terminals, at least three recesses must be formed on the substrate,
but the number of recesses may be more than 3.
EMBODIMENT 4
FIG. 15 is a plan view of a fourth embodiment of the magnetoresistive
sensor pellet according to the present invention. This embodiment is a
magnetoresistive sensor with three terminals in which the sensor pattern
is formed such that the longitudinal direction thereof is parallel to the
diagonal of a regular square substrate as in Embodiment 2. The element can
be produced according to the same method used in Embodiment 1 except for
the shape of the recess and the pitches formed thereof.
In FIG. 15, reference numeral 103 represents a ceramic substrate, 103A
recessed portions, 203 a ferromagnetic thin film, 203S a magnetic field
detecting portion, and 203W wiring portions. Reference numeral 303 stands
for terminal electrode portions. When this embodiment is compared with the
embodiment shown in FIG. 14, the element has a structure which hardly
causes the offset voltage from the viewpoint of its design since the
layout of the wiring portions are symmetrical.
The offset voltage is preferably as low as possible from the practical
point of view. Therefore, the shape shown in FIG. 15 is more preferred
than that shown in FIG. 14 so far as the element with three terminals is
concerned.
EMBODIMENT 5
FIG. 16 is a plan view of a fifth embodiment of the magnetoresistive sensor
pellet according to the present invention. This embodiment relates to a
magnetoresistive sensor with four terminals having single-phase output
signal which comprises terminal electrode portions formed at the four
corners of a substrate and has a point symmetrical pattern. In FIG. 16,
reference numeral 104 represents a ceramic substrate, 104A recessed
portions, 204 a ferromagnetic thin film, 204S a magnetic field detecting
portion, and 204W wiring portions. Reference numerals 304a to 304d each
represents a terminal electrode portion.
In the pellet shown in FIG. 16, input terminals and output terminals each
are disposed on the diagonal of the rectangular substrate. Reference
numerals 304a and 304c represent the input terminals. The output terminals
represented by 304b and 304d are electrically connected through the common
wiring portion so that the same output signal can be obtained through
either of the terminals. As has been explained above, the input terminals
and the output terminals are formed in a 180.degree. point symmetrical
relation, respectively, in this element. Accordingly, the degree of
freedom for fixing the pellet through the die bonding technique is 2 as in
Embodiments 1 and 2.
EMBODIMENT 6
FIG. 17 is a plan view of a sixth embodiment of the magnetoresistive sensor
pellet according to the present invention. As in Embodiment 2 or 4, this
embodiment comprises a substrate having a regular square appearance and is
a magnetoresistive sensor with four terminals having single-phase output
signal in which a sensor pattern is formed such that the longitudinal
direction thereof is parallel to the diagonal of the regular square
substrate.
In FIG. 17, reference numeral 105 represents a ceramic substrate, 105A
recessed portions, 205 a ferromagnetic thin film, 205S a magnetic field
detecting portion, and 205W wiring portions. Reference numerals 305a to
305d each represents a terminal electrode portion. Reference numerals 305a
and 305c represent the input terminals. In this case, the output terminals
represented by 305b and 305d are likewise electrically connected through
common wiring portion as in Embodiment 5 so that the same output signal
can be obtained through either of the terminals. In this case, the input
terminals and the output terminals are likewise formed in a 180.degree.
point symmetrical relation, respectively. Accordingly, the degree of
freedom for fixing the pellet through the die bonding technique is 2 as in
Embodiment 5.
EMBODIMENT 7
FIG. 18A is a plan view of the magnetoresistive sensor pellet according to
the seventh embodiment of the present invention and FIG. 18B is a
sectional view taken along the line A--A in FIG. 18A. This embodiment
relates to a magnetoresistive sensor with two terminals which comprises
rectangular recesses 106A on two positions among the four corners on the
rectangular substrate.
In FIGS. 18A and 18B, reference numeral 106 represents a ceramic substrate,
206 a ferromagnetic thin film, 206S a magnetic field detecting portion,
206W wiring portion, 306 terminal electrode portions disposed on recessed
portions, and 4 a passivation film. In this sensor pellet, the sensor
pattern is formed such that the longitudinal direction thereof is parallel
to one side of the pellet.
FIG. 19A is a plan view of a magnetoresistive sensor with two terminals
obtained by electrically connecting the terminal portions of the foregoing
sensor pellet to a lead 7 through bonding with a solder 21. FIG. 19B is a
sectional view taken along the line A--A in FIG. 19A. Reference numeral 5'
stands for a portion reinforced by molding with resin on a connected
portion. In this case, the mold is formed such that the level of the mold
surface is approximately equal to that of the magnetic field detecting
portion. In this embodiment, even if the connection is performed through
the bonding with a solder, the molded surface can be formed so as not to
project over the level of the surface on which the magnetic field
detecting portion is formed.
In the element with two terminals shown in FIG. 19A, two recessed portions
are formed on the two corners of the rectangular substrate, however the
recessed portions may be formed on three or four corners on the substrate.
Moreover, the recessed portions may also be formed on a peripheral portion
in addition to the corners. If a part of the corners of the rectangular
substrate is missing, the foregoings may apply in this case, so far as
desired recessed portions are formed and the desired terminal electrode
portions are formed on the recesses.
EMBODIMENT 8
FIG. 20A is a plan view of an eighth embodiment of the magnetoresistive
sensor pellet according to the present invention and FIG. 20B is a
sectional view taken along the line A--A in FIG. 20A. This embodiment is a
magnetoresistive sensor pellet with two terminals in which the difference
of level is almost vertically formed on a substrate as shown in FIG. 12E.
In FIGS. 20A and 20B, reference numeral 107 represents a ceramic
substrate, 107A recessed portions, 207 a ferromagnetic thin film, 207S a
magnetic field detecting portion, and 207W wiring portions. Reference
numeral 307 represents terminal electrode portions composed of Au.
In this embodiment, the substrate can be manufactured according to the
method used in Embodiment 2 with a minor modification except that for
shape of the recessed portions and the pitches formed thereof. Reference
numeral 12 stands for a glazed layer. Since the stepped portions are
approximately vertically formed on the substrate, it is very difficult to
apply a material for electrodes on the side wall of the stepped portions
through a means such as vapor deposition. For this reason, a conductive
paste 3' is coated on the side wall thereof, then fired. Thereafter a
layer of material for electrodes is formed on the side wall by plating and
thus, simultaneously forming the terminal electrode portions. The
electrodes may be formed by coating a conductive paste and then firing, or
by plating alone. Moreover, the materials for electrodes are not
restricted to specific ones so far as they are electrically conductive.
As shown in FIG. 20B, if the stepped portions are approximately vertically
formed on the substrate, the wiring portions 207W can be shortened, and
accordingly, the size of the sensor element can be further miniaturized.
EMBODIMENT 9
FIG. 21 is a sectional view of a ninth embodiment of the magnetoresistive
sensor according to the present invention. This embodiment relates to a
magnetoresistive sensor in which the corners 108A of a substrate are
tapered as shown in FIG. 12D. Further, FIG. 21 shows a condition in which
the magnetoresistive sensor pellet is electrically connected to a lead 7
by a conductive resin 21'.
The region surrounded by the broken line in FIG. 21 corresponds to the
region to be molded with resin when the pellet is formed into a final
element. Reference numeral 108 represents a ceramic substrate, 208 a
ferromagnetic thin film, 208S a magnetic field detecting portion, and 308
terminal electrode portions.
As has been described above, the corners of the substrate on which the
terminal electrode portions are to be formed are tapered. Therefore, the
electrical connection between the terminal electrode portion 308 and the
lead 7 can be achieved using the conductive resin 21' without using any
wires. The materials for the conductive resin 21' is not restricted to
specific ones so far as they are electrically conductive.
EMBODIMENT 10
FIG. 22 is a plan view of a tenth embodiment of the magnetoresistive sensor
pellet according to the present invention. This embodiment is a
magnetoresistive sensor with six terminals in which two semicircular
recesses 109A are formed on two peripheral portions of a substrate in
addition to four recesses formed at the four corners of the substrate. In
this figure, reference numeral 109 represents a ceramic substrate, 209 a
ferromagnetic thin film, 209S a magnetic field detecting portion, 209W
wiring portions and 309 terminal electrode portions, respectively.
As in Embodiment 10, elements provided with more than 4 terminals can be
obtained by forming recesses on peripheral portions on the substrate in
addition to the four corners thereof.
EMBODIMENT 11
FIG. 23 is a plan view of an eleventh embodiment of the magnetoresistive
sensor pellet according to the present invention. This embodiment relates
to a sensor in which a pattern for magnetoresistive sensor is formed on
the same substrate used in Embodiment 10 and further, a pattern for
resistive element comprising, for instance, an NiCr alloy is also formed
on the surface of the same substrate.
In FIG. 23, reference numeral 110 represents a ceramic substrate, 110A
recessed portions, 210S a magnetic field detecting portion of the
magnetoresistive sensor composed of a ferromagnetic thin film, and 210W
wiring portions.
Reference numeral 13 represents a resistance portion which is formed by,
for instance, depositing an NiCr thin film on the surface of the substrate
and then forming the film into a desired pattern. Reference numeral 310
stands for terminal electrode portions.
As has been explained above, if a pattern for magnetoresistive sensor and a
pattern for resistance element are formed on the same surface of a
substrate, a proper electrical voltage can be applied to the
magnetoresistive sensor through the resistance element when a high
electrical voltage must be inputted to the magnetoresistive sensor.
Likewise, other functional elements other than resistance elements may be
formed on the same surface of a substrate.
EMBODIMENT 12
A twelfth embodiment of the present invention is shown in FIGS. 24A and
24B. This embodiment relates to a magnetoresistive sensor pellet 1 and an
integrated circuit element 14 which are electrically connected to one
another through wires 6 and which are molded in a package. FIG. 24A is a
plan view of these elements prior to the molding and FIG. 24B is a
sectional view of these elements after the molding taken along the line
A--A in FIG. 24A.
As shown in FIG. 24B, a magnetoresistive sensor can be obtained having a
function for processing output signals of sensor pellet in which the level
of the mold is not projected over the surface of the sensor if the
thickness of the substrate for an integrated circuit element is thinner
than that of the magnetoresistive sensor pellet.
INDUSTRIAL APPLICABILITY
As has been described above, in the magnetoresistive sensor pellet of the
present invention, a difference in level is established between the
surface on which the magnetic field detecting portion is formed and the
surface of the terminal electrode portions at the corners or further at
the periphery of the substrate. Therefore, when a resin mold is applied to
the sensor for the purpose of reinforcing the bonding portions, the mold
can be formed such that the surface of the mold is equal to that of the
magnetic field detecting portion.
Moreover, the sensor of the present invention can be electrically connected
through the wire bonding technique, dence element having high heat
resistance can be obtained. In addition, the process for assembling
elements can be rationalized and the cost for the assembling can be
reduced accordingly.
Furthermore, the production cost can be reduced by miniaturizing the sensor
pellet and the thickness of motors can be reduced simultaneously.
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