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United States Patent | 5,151,388 |
Bakhit ,   et al. | September 29, 1992 |
Interconnection of densely populated multiple chip integrated hybrid circuits (12) in a manner such that heat can be efficiently extracted therefrom. An integrated circuit die (31) is attached to a flip chip interconnect layer by soldering the connection pads thereto. The interconnect layer is slid off its substrate (11) in the manner of a decal. After the circuit has been tested and found acceptable, the other side of the die (31) is permanently bonded to a thermal conduction plate or heat sink (32). The decal interconnect (33) is made of alternating layers of an insulator (41) and a conductor (42) built on top of an erodible sacrifical layer (48) applied to a substrate. The sacrificial layer (48) is dissolved by a suitable solvent to float the multilayer interconnect off the substrate (11).
Inventors: | Bakhit; Gabriel G. (Huntington Beach, CA); Shambrook; Kevin P. (Laguna Beach, CA) |
Assignee: | Hughes Aircraft Company (Los Angeles, CA) |
Appl. No.: | 697350 |
Filed: | May 7, 1991 |
Current U.S. Class: | 29/593; 29/831; 257/E21.511; 438/15; 438/107; 438/122 |
Intern'l Class: | H01L 021/60 |
Field of Search: | 437/209,211,214,216,220 357/72,75,80 |
4709468 | Dec., 1987 | Wilson | 357/75. |
4784972 | Nov., 1988 | Hatada | 437/209. |
4795512 | Jan., 1989 | Nattatani et al. | 427/96. |
4926241 | May., 1990 | Carey | 357/71. |
Foreign Patent Documents | |||
8907834 | Aug., 1989 | WO | 437/209. |