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United States Patent |
5,146,101
|
Linker, Sr.
,   et al.
|
September 8, 1992
|
Lead inspection and straightener apparatus and method with scanning
Abstract
A lead scanning apparatus for scanning the lead to lead integrity of
electronic devices having an axial length and leads extending from the
sides thereof. The apparatus includes track means for moving individual
devices axially along a path to a scanning station on the path. Stop pins
stop each of said devices at predetermined locations on the path where a
clamp rail assists in positioning the device in a scanning orientation.
The scanning unit is movably positioned at the station for movement
axially along the length of the device to generate signals upon
intersection of leads extending from both sides of the device. Actual
signals from the scanner are compared with predetermined signals to
determine the existence and spacing of each lead with respect to a
predetermined pattern. A signal based on the comparison for each device is
generated. The scanner is useful in apparatus for inspecting and
straightening the lead integrity and coplanarity of electronic devices
having an axially length and leads extending therefrom. The track includes
an inlet, and sequentially, a first station for lead to lead scanning, a
second station for coplanarity scanning, a third station for lead to lead
straightening, and a forth station for coplanarity adjustment. The
apparatus has an output station for sorting and dispensing inspected and
repaired or rejected devices into designated magazines.
Inventors:
|
Linker, Sr.; Frank V. (Springfield, PA);
Linker, Jr.; Frank V. (Broomall, PA);
Claffey; Edward T. (Aston, PA)
|
Assignee:
|
American Tech Manufacturing Corp. (Glenolden, PA)
|
Appl. No.:
|
609370 |
Filed:
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November 5, 1990 |
Current U.S. Class: |
250/559.34; 209/556; 250/223R |
Intern'l Class: |
G01N 021/86; B07C 005/00 |
Field of Search: |
250/561,223 R,562,563,234-235
209/556,555
356/392
|
References Cited
U.S. Patent Documents
3039604 | Jun., 1962 | Bicket et al. | 209/556.
|
4166540 | Sep., 1979 | Marshall | 209/555.
|
4553843 | Nov., 1985 | Langley et al. | 250/223.
|
4739175 | Apr., 1988 | Tamura | 250/561.
|
4812666 | Mar., 1989 | Wistrand | 250/561.
|
4914290 | Apr., 1990 | Hilgart et al. | 250/561.
|
5043589 | Aug., 1991 | Smedt et al. | 250/561.
|
Primary Examiner: Nelms; David C.
Assistant Examiner: Messinger; Michael
Attorney, Agent or Firm: Renz, Jr.; Eugene E.
Claims
What is claimed is:
1. Lead scanning apparatus for scanning the lead to lead integrity of
electronic devices having a body portion and a plurality of leads
extending from opposite sides thereof, comprising:
track means for moving individual electronic devices axially along a path;
a scanning station on said path, including stop means for stopping each of
said devices to align each device at a predetermined fixed location on
said path and also including holding means for positioning and maintaining
said device in a scanning orientation at said predetermined location to
prevent lateral shift errors;
scanning means movably positioned at said station for scanning axially
along the length without a velocity variation between individual
electronic devices and providing a signal relative to a fixed point with
respect to said stop means upon intersection with each lead extending from
said device; and
comparator means for comparing actual signals from said scanning means with
predetermined signals based on said fixed point to determine the existence
and spacing of each lead with respect to a predetermined pattern, said
comparator means providing a signal based on said comparison for each
device.
2. The apparatus of claim 1 wherein said comparator means provides an
acceptance, repair or reject signal based upon comparison of said actual
signals with said predetermined pattern.
3. The apparatus of claim 1 wherein said scanning means and comparator
means include an encoder means for precisely locating said scanning means
with respect to a known location as said scanning means moves axially
along the length of said device.
4. The device of claim 3 wherein said scanning means includes optical means
for providing an optical light path, including means for aligning said
light path to intersect said leads as said scanning means moves along the
length of said device and generate said signal upon intersection of said
optical light path with said lead.
5. The apparatus of claim 4 wherein said optical scanning means includes a
light source, a prism for directing a light path closely adjacent said
device and aligned to intersect leads extending from said device, and
light receiving means responsive to the intensity of light directed from
said prism.
6. The apparatus of claim 3 wherein said scanning means includes slidable
carriage means including a drive means for moving said carriage axially
along the length of said device.
7. The apparatus of claim 6 wherein said carriage means and said encoder
means include rack and gear means for locating said carriage with respect
to a fixed reference.
8. A method for scanning the lead to lead integrity of electronic devices
having an axial length and lead extending from the side thereof,
comprising the steps of:
moving individual devices axially along a path;
stopping each of said devices at a predetermined location on said path and
positioning said device in a scanning orientation;
scanning axially along the length of said device and providing a signal
upon intersection of leads extending from said device; and
comparing actual signals from said scanning means with predetermined
signals to determine the existence and spacing of each lead with respect
to a predetermined pattern, and providing a signal based on said
comparison for each device.
9. The method of claim 8 wherein said comparing step provides an
acceptance, repair or reject signal based upon comparison of said actual
signals with said predetermined pattern.
10. The method of claim 8 wherein said scanning precisely locates said
scanning means with respect to a known location as said scanning moves
axially along the length of said device.
11. The method of claim 10 including the step of providing an optical light
path to intersect said leads while scanning moves along the length of said
device to generate said signal upon intersection of said optical path with
said lead.
12. The method of claim 11 wherein said optical path 15 scan, directed by a
prism to a position closely adjacent said device and aligned to intersect
leads extending from said device, and light receiving means is responsive
to the intensity of light from said prism.
13. A system for inspecting and straightening the lead integrity and
coplanarity of electronic devices having an axial length and leads
extending therefrom, comprising:
track means for defining a path for said devices along said axial length
from an inlet, sequentially to a first station for lead to lead scanning,
a second station for coplanarity scanning, a third station for lead to
lead straightening, and a fourth station for coplanarity adjustment and to
an output station;
clamping rail means aligned with said track for cooperatively holding said
devices at any location on said track;
stop means for stopping said devices along said track at each of said
stations and activating said clamping rail means; and
controller means for sequentially activating said first and second station
to provide first and second signals indicating acceptance, repair or
rejection of individual devices, said controller means activating both of
said third and fourth station upon generation of a repair signal from
either or both of said first and second stations, said outlet station
adapted to separate devices upon receipt of a signal indicating acceptance
or repair from devices upon receipt of a reject signal.
14. The system of claim 13, wherein said first station for scanning the
lead to lead integrity of electronic devices having an axial length and
lead extending from the side thereof comprises:
track means for moving individual devices axially along a path;
a scanning station on said path, including stop means for stopping each of
said devices at a predetermined location on said path and also including
holding means for positioning said device in a scanning orientation;
scanning means movably positioned at said station for scanning axially
along the length of said device and providing a signal upon intersection
with each lead extending from said device; and
comparator means for comparing actual signals from said scanning means with
predetermined signals to determine the existence and spacing of each lead
with respect to a predetermined pattern, said comparator means providing a
signal based on said comparison for each device.
15. The system of claim 14 wherein said comparator means provides an
acceptance, repair or reject signal based upon comparison of said actual
signals with said predetermined pattern.
16. The system of claim 14 wherein said scanning means and comparator means
includes an encoder means for locating said scanning means with respect to
a known location as said scanning means moves axially along the length of
said device.
17. The system of claim 13 wherein said second station includes a plurality
of individual tines aligned to intersect leads on said device upon
movement thereof in a plane toward said leads, each of said tines being
adapted to provide a signal indicative of the position of said leads with
respect to a predetermined pattern, said second station including coplanar
comparator means for generating a signal responsive to a comparison
between signals generated by said tine and said predetermined pattern.
18. Lead scanning apparatus for scanning the lead to lead integrity of
electronic devices having a body portion and a plurality of lead extending
from opposite sides thereof, comprising:
track means for moving individual electronic devices axially along a path;
a scanning station on said path, including stop means for stopping and
positioning each of said devices to align each device at a predetermined
fixed location on said path and also including holding means for
positioning and maintaining said device in a scanning orientation and
prevent axial and lateral movement at said predetermined location to
prevent lateral and axial shift errors;
scanning means movably positioned at said station for scanning axially
close to said body portion and on both sides along the length of said
device with an encoded digital output not dependent on velocity to
eliminate a velocity variation between individual electronic devices to
provide a signal relative to a fixed point in space with respect to said
stop means upon intersection with each lead extending from said device;
and
comparator means for comparing actual signals form said scanning means with
predetermined signals based on said fixed point to determine the existence
and spacing of each lead with respect to a predetermined pattern, said
comparator means providing a signal based on said comparison for each
device.
19. A system for inspecting and straightening the lead integrity of
electronic devices having an axial length and leads extending therefrom,
comprising:
track means for defining a path for said devices along said axial length
from a inlet, sequentially to a first station for lead to lead scanning
and a second station for lead to lead straightening, and to an output
station;
clamping rail means aligned with said track for cooperatively holding said
devices at any location on said track;
stop means for stopping said devices along said track at each of said
stations and activating said clamping rail means; and
controller means for sequentially activating said first station to provide
first signals indicating acceptance, repair or rejection of individual
devices, said controller means activating said second station upon
generation of a repair signal from said first station, said outlet station
adapted to separate devices upon receipt of a signal indicating acceptance
or repair from devices upon receipt of a reject signal.
Description
FIELD OF THE INVENTION
The present invention relates generally to improvements in apparatus and
method for straightening electronic components of the type commonly
referred to as DIP devices. These devices are used as semiconductors or
resistors in integrated circuit boards or the like. More specifically, the
apparatus and method of the present invention are designed for scanning
the lead integrity of DIP devices along the axial length, to determine the
existence and spacing of each lead with respect to a predetermined
pattern. In addition, the present invention relates to apparatus for fully
inspecting and aligning leads on DIP devices in a single apparatus.
BACKGROUND OF THE INVENTION
DIP devices and particularly the new "gull-winged" DIP devices form an
important part of the electronics industry. These DIP devices are placed
on a printed circuit board which has been silk screened and treated to
define precise locations for the pads of the DIP device leads. Precise
location of the DIP device is needed for successful manufacturing.
DIP devices are required to meet certain standards of uniformity, both in
the distance between individual pins or leads and in the coplanarity of
the leads which extend down from the body for attachment to the printed
circuit board. For example, manufacturing standards for a particular
device may call for the pads of the DIP device all to be within a range of
ten thousandths to twenty thousandths of an inch. Various manufacturers
and various products may have different body stand-off ranges, such as ten
to twenty thousandths, or seven to twelve thousandths and the like.
Additionally, all of the leads must be within four thousandths of an inch
in coplanarity of each other in order to ensure proper mounting on the PC
board. The four thousandths coplanarity range is becoming an industry
standard. Coplanarity inspection and adjustment is a significant need in
the electronic industry.
As was mentioned above, the specifications for the distances between pins
or leads is also of major concern. It has become desirable to ensure that
the distance between leads is within a certain range, for example a
distance of ten thousandths of an inch. Each of the many leads on the DIP
device will then contact the appropriate pad on the printed circuit board.
Scanning is extremely important to verify that none of the pins or leads
are missing. Those DIP devices which have a missing, or widely skewed
lead, need to be taken out of the automatic assembly process.
The manufacturing processes by which DIP devices are made are themselves
highly automated and efficient. In some instances, less than two percent
of the devices made will be out of tolerance by an amount sufficient to
need straightening, either in the pin to pin direction or with respect to
coplanarity of all of the leads. In other manufacturing processes,
depending upon the quality and the complexity, the number of DIP devices
from a given production run which needs straightening will range from as
low as one percent to as high as ten percent. In most cases, the DIP
devices which do not meet the initial specifications are still within a
range which would permit them to be straightened or realigned. Actual
rejection due to a missing lead or a badly skewed lead is extremely low.
Nevertheless, it is becoming an industry standard to inspect every DIP
device as part of the assembly process.
One such device which is admirably suited for lead straightening, both in
the pin to pin alignment and in the common plane is disclosed in a
commonly owned Linker U.S. patent application Ser. No. 565,438 filed Aug.
10, 1990, entitled LEAD STRAIGHTENING METHOD AND APPARATUS. The disclosure
of this pending application is incorporated herein by reference in its
entirety. In this pending patent application, apparatus is described and
claimed which positions DIP devices of the type described herein at a lead
straightening station, straightens the leads, moves the device to a
coplanarity station and adjusts the positioning of the pads of the leads
so that they are aligned in a common plane.
While the above described apparatus is efficient and effective, it is a
waste of time to straighten or align the leads of a device which has one
or more leads missing or when the leads are too far from acceptable
standards. Such devices should be discarded. It is also unnecessary to
subject already straightened DIP devices to additional straightening.
Accordingly, it is a principal object of this invention to provide an
inspection apparatus for use with the above described straightening
apparatus which will reject defective DIP devices and pass acceptable DIP
devices without requiring additional operation of the straightening or
aligning apparatus.
Inspection devices per se are not new, of course. For example, coplanarity
inspection of DIP devices has been described in a commonly owned copending
Linker U.S. patent application Ser. No. 427,797, filed on Oct. 27, 1989.
Another device is described in a continuation in part Linker et al. U.S.
patent application Ser. No. 526,162, filed May 21, 1990, entitled
COPLANARITY INSPECTION MACHINE. Both of these applications describing
coplanarity inspection devices are incorporated herein by reference.
There are also various methods which are proposed for determining the
relative alignment of the individual pins or leads of DIP devices. As can
be determined from the very name of DIP devices, Dual In-Line Packages,
the body portion of a DIP device has a plurality of leads extending from
two sides generally perpendicular to the longitudinal axis of the device.
Various devices have been proposed which scan the pin to pin relationship
of the leads on DIP devices. Devices which pass the scanning test can then
continue on in the manufacturing process while those which fail the test
must be removed, either at the time of inspection or after the entire
batch of devices has been scanned.
As one can imagine, there are alternative processes in the electronics
industry. One such alternative is to straighten and position all of the
leads on all of the devices prior to use. This is time consuming,
expensive and potentially hazardous, particularly for fragile leads. The
other alternative is to scan each individual lead and transfer those leads
which need adjustment to the appropriate adjustment station. As a
sufficient quantity of out of specification DIP devices accumulate, they
can then be placed in a straightening device of the type described above.
This may be suitable for small operations or operations which do not have
an extremely high production rate. As more and more assembly facilities
are being automated and the efficiencies of the automated plants are being
upgraded, separation of the devices in this manner becomes non-productive
or uneconomic.
The alternative to independently testing all of the leads and separating
those which need straightening is the aforementioned process of
straightening and aligning all of the leads. Even with virtually one
hundred percent acceptance after straightening, these systems operate too
slowly to be competitive in high volume assembly environments.
Accordingly, another object of the present invention is to provide a device
which is capable of inspecting DIP device leads both from lead to lead
distance, and for coplanarity, followed by selectively straightening those
DIP devices which need adjustment to meet specification, even though that
may be two percent or less of the total quantity processed. At the same
time, it is an object of this invention to provide a machine which is
capable of inspecting DIP devices for location and coplanarity alignment
without subjecting those within specification to additional stress.
Yet another object of this invention is to provide a device which optimizes
the inspection and adjustment of leads on DIP devices at a maximum rate
with minimum stress on the device.
Other objects will appear hereinafter.
SUMMARY OF THE INVENTION
It has now been discovered that the above and other objects of the present
invention may be accomplished in the following manner. Specifically, a
lead scanning apparatus has been discovered which permits scanning lead to
lead integrity of electronic devices such as DIP devices. It has also been
discovered that apparatus can be provided for inspecting and straightening
DIP device lead integrity and coplanarity in one assembly or system.
The lead scanning station of the present invention includes a track means
for moving individual DIP devices axially along a path. A scanning station
means is provided on the path, including stop means for stopping each of
the devices at a predetermined location on the path. Holding means are
included for positioning the device in a scanning orientation.
Also included in the present invention is a scanning means which is movably
positioned at the scanning station to move axially along the length of the
device to provide a signal upon intersection of leads extending from the
device. Finally, comparator means are provided for comparing actual
signals from the scanning means with a predetermined set of signals in
order to determine the existence and spacing of each lead with respect to
a predetermined pattern. A signal based upon the comparison for each
device is generated, typically indicating whether the device passes
predetermined specifications, or is within a range where the device may be
fixed, or is in a condition where it must be rejected. Rejected devices,
would, for example, have one or more leads missing.
The invention also contemplates the apparatus for both inspecting and
straightening lead integrity and coplanarity for devices such as DIP
devices. This apparatus includes a track for defining a path of travel for
DIP devices along their axial length. The path moves from an inlet which
is adapted to release individual leads upon command to a series of
stations. These stations are arranged sequentially on the path so that the
first station provides lead to lead scanning, such as described above. The
second station tests the DIP device for lead coplanarity. The third
station operates to straighten the lead to lead relationship, while the
fourth station adjust coplanarity of the device, if necessary. Finally,
the path reaches an outlet station.
On the tracking means and aligned therewith is a clamping rail which is
operatively designed to clamp the devices at any location on the track.
Stop means are provided to stop the device along the track at each of the
stations. Upon arrival of a device at a stopping means, the clamping rail
means is activated.
The apparatus of this invention is controlled by controller means which
sequentially activate the first and second stations, whereby first and
second signals are generated. These signals indicate whether or not the
particular device passes specifications, or falls within the predetermined
guideline for straightening or adjusting coplanarity, or are so far out of
line or otherwise unacceptable as to be rejected. The controller means
activates both the third and fourth stations upon generation of a fixed
signal from either or both of the first and second stations. In this
manner, a device which is slightly off specification, needing its leads to
be straightened or adjusted in coplanarity, will stop at the third and
fourth stations. Stations there and four would then be activated to
perform the straightening and adjusting functions. If both the first and
second stations generate a pass signal, indicating that the device is
within specification, this acceptable DIP device will travel the remaining
path of the track means without activation of either the third or fourth
stations. Similarly, if the signal generated by the first and second
stations indicate that the DIP device should be rejected, it too will pass
the third and fourth stations without those stations being activated.
All of the DIP devices inspected by the apparatus of this invention are
received at the outlet station. The outlet station is adapted to separate
DIP devices based upon the signal it receives from the controller means.
Specifically, if a DIP device generates a pass signal or a fix signal it
will arrive at the outlet station in an acceptable or usable condition.
These signals will instruct the outlet station to separate them from those
DIP devices which have generated a reject signal. Rejected devices will be
separated and removed from the manufacturing process.
It is contemplated that various coplanarity inspection and adjusting
stations will be used in combination with the present invention, along
with various scanning and straightening means for adjusting the lead to
lead integrity and spacing for electronic packages such as DIP devices.
BRIEF DESCRIPTION OF THE DRAWINGS
These and other objects of the present invention and the various features
and details of the operation and construction thereof are hereinafter more
fully set forth with reference to the accompanying drawings, where:
FIG. 1 is an isometric view, greatly enlarged, of a typical gull-wing DIP
device.
FIG. 2 is a side elevational view of a preferred apparatus of the present
invention, in which lead inspection and straightening is accomplished.
FIG. 3 is an auxiliary plan view taken along the line 3--3 of FIG. 2,
further illustrating the details of the preferred embodiment.
FIG. 4A is an enlarged plan view of a seven lead gull-wing DIP device, such
as shown in FIG. 1, illustrating such a device which lacks lead integrity.
FIG. 4B is an enlarged side elevational view of a seven lead gull-wing DIP
device, such as shown in FIG. 1, showing improper spacing of some of the
leads.
FIG. 4C is an enlarged end elevational view of a seven lead DIP device
illustrating leads which are not all within an acceptable range of
coplanarity.
FIG. 5 is an flow diagram illustrating the sequential operations performed
by the apparatus of the present invention on individual DIP devices.
FIG. 6 is an enlarged, fragmentary, sectional elevational view taken along
line 6--6 of FIG. 3, illustrating details of the track.
FIG. 7 is an enlarged, fragmentary, transverse sectional elevational view
taken along the line 7--7 of FIG. 2, showing certain details of the lead
to lead scanning device of this invention.
FIG. 8 is a bottom plan view taken along the line 8--8 of FIG. 7.
FIG. 9 is a sectional, elevational view taken along the lines 9--9 of FIG.
7.
FIG. 10 is greatly enlarged, fragmentary view of the detail contained
within the dot and dash rectangle shown in FIG. 7 and designated FIG. 10.
FIG. 11 is an semi schematic, fragmentary plan view of the lower trackway
with a seven lead gull-wing DIP device held by a stop pin, shown in dot
and dash line.
FIG. 12 is an enlarged, transverse, fragmentary sectional elevational view
taken along the line 12--12 of FIG. 2.
FIG. 13 is a sectional, elevational view taken along the line 13--13 of
FIG. 12.
FIG. 14 is an enlarged, fragmentary plan view taken along the line 14--14
of FIG. 12.
FIG. 15 is a fragmentary, elevational view taken along line 15--15 of FIG.
14.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
FIG. 1 is an isometric view of a greatly enlarged typical DIP device. The
device D includes a body B and a plurality of leads L. The particular
design shown in FIG. 1 is known as a gull-wing DIP device, so named
because of the shape of the leads extending therefrom.
These devices are provided from the manufacture to the user in elongated
plastic tubes. The leads of the DIP devices are extremely fragile and
easily bent or broken. When the DIP devices are fed into the automated
machinery for placement on PC boards, misaligned and broken leads will
fail to make proper circuit contact. For that reason, automated machinery
is provided during the production of electronic equipment which examines
each lead and verifies that the particular DIP device has straight,
correctly spaced, coplanar leads.
In accordance with the invention, DIP devices such as shown in FIG. 1 are
inspected and straightened using the apparatus of the present invention.
Included within the apparatus of the present invention is a lead scanning
station, which, for the first time, permits high speed inspection of one
hundred percent of the DIP devices without requiring physical operation on
more than those leads which require straightening or coplanarity
adjustment. This device, shown in FIG. 2 in a side elevational view,
includes a housing or frame 10 which is mounted on pedestal 11 at a fixed
60.degree. angle with respect to the base 12. DIP devices are supplied in
tube 13 which can be automatically or manually inserted into a tube
receiver 14. Similarly, DIP devices which have been processed by the
apparatus of the present invention may be collected by one or more tubes
such as tube 16, located at the bottom of the apparatus.
The device includes an upper section 17 which houses a first station for
lead to lead scanning and a second station for coplanarity scanning. A
lower section 18 includes a third station for lead to lead straightening
and a fourth station for coplanarity adjustment.
The frame 10 is mounted on pedestal 11 at an angle so that DIP devices will
pass through the various stations by gravity feed. Track 19, shown in FIG.
3, includes clamping rail assembly 21 which is aligned t be moved toward
track 19 to cooperatively clamp various DIP devices at any location on the
track 19.
Lower section 18 includes a pin straightening station 22 of the type
described in the previously incorporated commonly assigned copending
Linker U.S. patent application Ser. No. 565,438, for LEAD STRAIGHTENING
METHOD AND APPARATUS, filed on Aug. 10, 1990. Also included is a
coplanarity adjusting station 23 which is also described in detail in this
above referred copending patent application Ser. No. 565,438. In the
preferred embodiment, both the lead straightening station 22 and the
coplanarity adjusting station 23 function as described in this copending
patent application.
An output station 24 is located at the downstream end of track 19 to place
each DIP device in its appropriate exit tube 16a, 16b, or 16c. In a
typical operation, tube 16c may be used for rejected tubes, while tubes
16a and 16b would sequentially be filled by acceptable DIP devices.
It is contemplated that a variety of DIP devices can be processed by the
apparatus of the present invention. The invention is designed to locate
those DIP devices which do not meet quality control criteria and to either
reject or repair those defective DIP devices. Examples of defective
devices are shown in FIGS. 4A, 4B and 4C. DIP device D1 shown in FIG. 4A,
is shown having straight and equally spaced leads but is lacking integrity
by having one broken lead L1. Otherwise, the spacing between leads is
within specification. Nevertheless, this DIP device cannot be repaired and
must be rejected by the apparatus.
DIP device D2, shown in FIG. 4B, includes leads L2, L3, and L4, at either
terminal end of device D2 which are bent or at an angle to a vertical
horizontal reference plane V,V of DIP device D2. These leads are not so
far out of specification that they cannot be straightened in lead
straightening station 22. Similarly, leads L5, L6, and L7 shown in FIG. 4C
are out of coplanarity with respect to the horizontal reference plane H,H.
These out of plane leads can be adjusted in coplanarity adjustment station
23.
Turning now to FIG. 5, the sequential operations performed on discrete DIP
devices as they flow by gravity from the supply tube 13 to the reject or
accept collection tubes 16a, 16b, 16c are illustrated. Shown also is the
coupling to the associated computer and output stations.
FIG. 5 describes the operation of the apparatus of the present invention
schematically. DIP devices are received and form a train of DIP devices on
the track, stopping at the first pin stop. Single DIP devices are released
from the DIP train pin stop. The DIP device then travels to the second pin
stop, in which a lead to lead scan is performed to determine the existence
and spacing of each lead. This data is then sent to a first comparator
which compares the data for the specific lead with predetermined values
which have been derived from a predetermined pattern.
It is noted that a variety of information can be obtained in this manner. A
central processing unit can be programed by a keyboard to store a variety
of information. In addition to lot numbers and other information, one
could determine that a particularly lead location was experiencing greater
failure than others, which information could be used to improve the
manufacturing process.
After the comparison has been made between the actual data on the lead to
lead scan with a predetermined pattern, an accept or reject decision is
made. DIP devices would be rejected if a lead were missing or so badly
skewed that it could not be straightened. Information that this
particularly DIP device has been rejected is sent to the sixth and final
stop pin on the track, so that the shuttle will deposit the rejected DIP
in the appropriate collector tube.
The DIP device then slides down to the second station, a coplanarity test
station where the DIP device is stopped by the third stop pin. Again,
coplanarity of the various leads is evaluated and compared in a second
comparator to determine coplanarity. This information is again provided to
a central processing unit and a decision is made to accept or reject the
individual DIP device by comparing the actual values with predetermined
standards or pattern. Again, a rejected DIP is identified to the shuttle
so that it can be placed in the rejected DIP device collector tube.
Upon completion of the testing and designation of a accept or reject
position, the DIP device then proceeds by gravity to a fourth stop pin at
the lead straightener station. If the DIP device has been rejected, the
lead straightening unit is not engaged. Similarly, if the first and second
comparators have judged the particular DIP device to be within acceptable
specifications, the lead straightening apparatus is not engaged. If,
however, the first comparator indicates that the leads are not within the
predetermined acceptability pattern but are within a range which permits
straightening, the lead straightening station combs through the lead to
produce an acceptable product.
The DIP device then leaves the lead straightening station and proceeds to a
fifth stop pin at the coplanarity adjustment station. Here, again,
rejected DIP devices and DIP devices which have acceptable values for a
lead scan and coplanarity scan are not subjected to a coplanarity
adjustment but merely pause at this station during the sequential travel
of the DIP device through the apparatus. If, however, the second
comparator determines that coplanarity is out of specification but can be
adjusted, the coplanarity station functions to adjust the coplanarity of
this particular DIP device. Also, if the particular DIP device has been
subjected to lead straightening in the lead straightening station, it also
will be subjected to coplanarity adjustment to ensure that alignment of
the leads spacing has not had a detrimental effect on coplanarity. Thus,
in the preferred embodiment, the coplanarity adjustment station will
operate on the DIP device if either or both scanning stations indicate the
need for adjustment. The DIP device then leaves the coplanarity adjustment
station and arrives at the sixth stop pin, at the output station. Here,
the DIP device is placed in the appropriate tube collector, depending upon
whether it is to be rejected or accepted.
Turning now to the detailed operation of the apparatus of the present
invention, a fragmentary side elevational view is shown in FIG. 6 in which
the various stations in the upper section 17 and lower section 18 are
shown. DIP devices are carried on track 19 to the inlet station 26. The
inlet station 26 is arranged to permit single DIP devices to be discharged
from the inlet station 26, whereby the DIP devices move by gravity to each
succeeding station downstream. An inlet station sensor directs light from
a photodiode 31 through a prism 32 to a photodetector 33. Interruption of
the flow of light through the prism 32 will indicate the presence of a DIP
device. Stop pins 34a through 34d are programmed so that one or another of
the various stop pins will be used to release the DIP device depending
upon the length of the specific DIP device. Stop pin assembly 34 is
programmed to sequentially release DIP devices upon command from the
central processing unit, for example.
The DIP device then proceeds to the first station, which is lead to lead
scan station 27. The sensor again comprises a photodiode 36, prism 37, and
photodetector 38 which activates the first station pin 39. At station 27,
as will be described hereinafter, a scanning means is moved axially along
the length of the device to provide a signal upon intersection of each of
the leads extending from the device. Comparison of the signal with a
predetermined signal determines the existence and spacing of each lead so
that an accept, repair or reject signal can be generated, as determined.
Next, the DIP device proceeds by gravity down the track 19 to the second
station 28 where coplanarity is evaluated. Again, a photodiode 41, prism
42 and photodetector 43 form a sensor which operates stop pin 44. In this
station, the coplanarity of the DIP device is measured and compared to a
predetermined standard to again generate a pass, fix or reject signal,
depending upon the comparison. Next, the DIP device continues on track 19
to the straightening station 22. Arrival of the DIP at the third station
22 for straightening, if necessary, is again signalled by interruption of
light flowing from the diode 46 through prism 47 to photodetector 48,
thereby actuating stop pin 49.
Similarly, the DIP device proceeds to the fourth station 23 for coplanarity
adjustment, if necessary. Photodiode 51, prism 52 and photoreceptor 53
form a sensor for the fourth station 23, activating stop pin 54 upon
arrival of a DIP device at that station.
In order to ensure the accuracy of any measurements and adjustments being
made by the apparatus of the present invention, it is necessary to ensure
that the DIP devices are firmly placed and held on the track 19 as they
progress from the first through the fourth stations. As can be seen in
FIG. 6 there is a small clearance between track 19 and clamping rail 21.
The DIP device straddles the track 19 with its leads extending out from
the body and perpendicular to the direction of travel. At each point when
the individual DIP device reaches a sensor, such as would be indicated by
photodetector 38 no longer receiving light from photodiode 36 through
prism 37, pin 39 extends to stop the particular DIP device. At the same
time, clamping rail 21 extends down from the input end to the output end
and across both the upper section 17 and lower section 18 to clamp any DIP
devices contained on track 19. It can be seen that a DIP device will pause
sequentially at each station 27, 28, 22 and 23 as it progresses through
the apparatus, even if no activity such as a straightening or adjustment
of coplanarity is desired. Normal throughput time for a DIP device through
the apparatus will be determined by the time necessary for scanning in the
first station 27, where the integrity and spacing of the leads is
determined. The second station 28 which measures coplanarity operates at
substantially the same or faster speed than first station 27. The
remaining portion of the apparatus does not add to the time of a complete
cycle for an individual DIP device if the DIP device passes the
specifications assigned to first and second stations 27 and 28. However,
when either straightening or straightening and coplanarity is necessary,
additional time may be taken during the straightening or adjustment steps.
Even during this time, however, DIP devices at the first and second
stations 27 and 28 are being performed.
As has been noted above, the third station 22, which straightens leads
which are out of alignment, and the fourth station 23, which adjusts the
coplanarity of the leads, are both described in the previously referred to
copending U.S. patent application Ser. No. 565,438, filed Aug. 10, 1990.
A particular DIP device arrives at station 27, as signalled by interruption
of light passing from photodiode 36 through prism 37 to photoreceptor 38.
Stop pin 39 operates to stop the DIP device, as shown in FIG. 6, the DIP
device then becomes firmly clamped in place between track 19 and clamp
rail 21 clamp rail 21 is lowered in the direction of the arrow as shown in
FIG. 10, to firmly locate and aligned DIP device D10.
Stop pin 39 will always stop the DIP device at the extreme downstream lead,
which, of course, is the first lead to intercept the light beam passing
through prism 37. In this manner, a variety of different DIP devices
having different lengths and different numbers of leads can be processed
with the same equipment. Since the DIP device itself is not centered along
the axial direction but rather is stopped at the first lead location,
scanning and operations can take place starting at that first lead,
regardless of the number of leads which extend from the DIP device.
FIGS. 7 through 11 describe various details of the first station 27 which
functions to scan the leads of the DIP device for existence and spacing
between leads.
As soon as the DIP device arrives at the first station 27, motor 56 begins
to drive spur gear 57. Motor 56 and spur gear 57 are mounted on a fixed
plate 58. Spur gear 57 turns larger gear 59, causing the jackscrew 61 to
transmit motion to a linear direction. Limit switch 62 and sensor 63 limit
the maximum amount of scan head travel.
Jackscrew 61 drives a slidable carriage 64 which is carried on fixed plate
58 by linear bearings 66. As the slidable carriage 64 moves linearly, the
rack 67 engages shaft 68 of encoder 69, and signals the location of
slidable carriage 64. This location is identified with respect to time as
the motor 56 drives the carriage 64 over a preset length. The length may
be set by limit switches 62, 63 or may be programmed into the central
processing unit. Encoder 69 is mounted on mounting block 71, which in turn
is biased against the rack 67 by leaf springs 72. Leaf springs 72 serve to
protect transmission of vibration to the encoder 69 which would affect the
accuracy of the measurements as motor 56 moves the slidable carriage 64
back and forth from start to stop positions.
Turning now to FIG. 9, it can be seen that the jackscrew 61 is driven by
large spur gear 59 to move the slidable carriage 64. Block 73 and bearings
74 support jackscrew 61 and translate motion to the slidable carriage 64.
Jackscrew 61 is supported at its other end by fixedly mounted nut 76
attached to bracket 77.
As the slidable carriage 64 moves along the axial length of a DIP device, a
scanner transmits signals to the encoder 69. The scanner, shown best in
FIG. 10, comprises a light source 78, such as a diode, which transmits
light to prism 79. Light then exits prism 79 at a point near track 19 and
clamp rail 21. The light is received by detector 81 after passing through
a very tiny hole 82. Hole 82 and detector 81 are aligned at the very end
of prism 79 closest to the track 19. In fact, track 19 includes a cut out
portion 83 to permit the edge of the prism 79 to get as close as possible
to the leads on the DIP device D10.
As the scanning station 27 begins to move as motor 56 drives jackscrew 61
as previously described, photodetector 81 detects the leading edge of each
lead. An immediate voltage drop occurs as soon as the leading edge of the
lead intersects the light path through hole 82. When this voltage drop is
detected by detector 81, a signal is sent to the central processing unit
which also receives the location as identified by the encoder 69. After
the scanning station 27 passes the first lead, the intensity of the light
on detector 81 is increased again until the second lead causes a voltage
drop as light is restricted by the leading edge of the lead. This process
continues until all of the leads have been scanned on the DIP device.
As shown in FIG. 11, DIP device D10 is held by pin 39. The DIP device
scanning station moves pass the various leads on D10 until a distance T
has been traveled. Distance T can be programmed into the device or be
determined by limits switches, such as limit switch 62, 63 in FIG. 8. Any
leads which are absent, will, of course, cause an exceptionally long
movement of the scanner station 27 without reporting a lead location to
the central processing unit or CPU. The CPU can be programmed to
automatically reject any DIP device which fails to report a signal over a
period of time which would indicate that a lead is either missing or
extremely far out of alignment. This sort of programming can decrease the
throughput time, to thereby increase the efficiency of the apparatus.
After the DIP device leaves the first scanning station 27, it proceeds to a
coplanarity test station 28 as shown in FIGS. 12 and 13. A DIP device
carried by track 19 is positioned at coplanarity test station 28. The
operation of coplanarity inspection machines are fully disclosed in a
commonly owned copending Linker application Ser. No. 427,797, filed Oct.
27, 1989, entitled COPLANARITY INSPECTION MACHINE. This device operates on
a optical system without touching the leads, providing a signal when each
lead reaches a point in space. These points are compared to reference
points derived from a standard pattern such as a flat block.
In another commonly owned copending Linker et al. application Ser. No.
526,162, and filed on May 21, 1990, also entitled COPLANARITY INSPECTION
MACHINE, a coplanarity inspection machine is described wherein the
individual leads break a circuit as they arrive at and intersect with
tines. Shown in FIG. 12 is a similar device in which tines 84 are in
circuit making contact with conductive leads on the upper portion 86 of
block 87. When the individual leads of DIP device contact the tines 84, as
block 87 is moved up to cause such interaction, a signal is sent
indicating the arrival of that particular lead at the particular point in
space. Once again, an encoder is employed to locate a particular point in
space at which the signal is sent indicating arrival of the lead in
contact with the tine to break the electrical circuit.
Block 87 is itself attached to a slide block 88 which is in contact with
sensor button 89 of encoder 91. Motor 92 drives jackscrew 93 and bracket
97, to uniformly move slide block 88 in an upward direction until the
tines 84 have intersected all of the leads on the DIP device or until a
limit switch has been reached. Jackscrew 93 is in engagement with a fixed
nut 94 which in turn is fitted in bracket 97. Suitable bearings are
provided to ensure movement of the slide block 88, to prevent transmission
of vibrations or "noise" to the encoder 91.
The details of the coplanarity inspection heads are shown in FIGS. 14 and
15 in relation to a gull-wing device D14 having leads L14. DIP device D14
has been stopped by pin 44 as leads L14 extend over a plurality of tines
84, with one tine aligned over each lead. Clamp rail 21 firmly positions
the DIP device D14 as the tines are raised by movement of slide block 88
as previously described, so that block 87 moves the tines to position
shown by tine 84a, intersecting a lead L14. The circuit between tine 84
and block 86a, shown in dot and dash line, is broken, sending a signal to
indicate the location of the individual lead L14.
Thus it can be seen that the inspection stations 27 and 28 of the present
invention provide one hundred percent inspection of DIP devices. The
apparatus of this invention accepts, repairs or rejects DIP devices. Time
is spent straightening or aligning only those DIP devices which need
repair. An operations system has been provided which is suitable for all
manufacturing and assembly operations.
While particular embodiments of the present invention have been illustrated
and described herein, it is not intended to limit the invention. Changes
and modifications may be made therein within the scope of the following
claims.
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