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United States Patent | 5,124,884 |
Yazu ,   et al. | June 23, 1992 |
An electronic component mounting board includes a substrate having an electronic component mounting opening formed in an upper surface thereof and a recess provided on a rear surface thereof larger in size than the electronic component mounting opening; a heat radiating plate fixed to the recess by bonding material with a position of an upper surface of that heat radiating plate exposed to the electronic component mounting opening; an exposed depression extending over the substrate and the heat radiating plate at a position where a side wall of the recess and a side wall of the heat radiating plate confront each other and having a part of the bonding material exposed flush with a bottom surface thereof; and a metal plating layer continuously covering in sequence a lower surface of the heat radiating plate, a surface of the exposed depression and a rear surface of the substrate. A method of manufacturing the aforesaid electronic component mounting board is also set forth.
Inventors: | Yazu; Hajime (Gifu, JP); Iriyama; Takao (Gifu, JP) |
Assignee: | Ibiden Co., Ltd. (Ogaki, JP) |
Appl. No.: | 611084 |
Filed: | November 9, 1990 |
Nov 09, 1989[JP] | 1-291756 |
Current U.S. Class: | 361/705; 165/185; 174/16.3; 257/720; 257/E23.004; 257/E23.067; 257/E23.101; 361/704; 361/707 |
Intern'l Class: | H05K 007/20 |
Field of Search: | 361/386,387,388,389,401,412,414 428/209 174/16.3 165/185 357/81 |
4322778 | Mar., 1982 | Barbour et al. | 361/414. |
4561011 | Dec., 1985 | Kohara et al. | 356/81. |
4737395 | Apr., 1988 | Mabuchi et al. | 428/138. |
4739448 | Apr., 1988 | Rowe et al. | 361/386. |
4773955 | Sep., 1988 | Mabuchi et al. | 156/257. |
4835598 | May., 1989 | Higuchi et al. | 357/72. |
Foreign Patent Documents | |||
0197148 | Oct., 1986 | EP. | |
59-32191 | Feb., 1984 | JP. |