Back to EveryPatent.com
United States Patent |
5,109,149
|
Leung
|
April 28, 1992
|
Laser, direct-write integrated circuit production system
Abstract
A laser, direct-write system for making personalized custom or semi-custom
integrated circuits with a very fast turnaround time. The system includes
a method and apparatus for high percision scanning of a submicron laser
spot. The laser beam is scanned at the entrance of a beam expander. The
beam expander reduces the scan angle and error produced by a mechanical
scanning device such as a rotating polygonal mirror. The smaller scan
angle at the output of the beam expander matches well with the projection
optics of a laser, direct-write semi-custom integrated circuit production
system. The scan error reduction permits more accurate positioning of the
focussed laser spot on the surface of the semi-custom integrated circuit.
Inventors:
|
Leung; Albert (1337 Wynbrook Pl., Burnaby, CA)
|
Appl. No.:
|
493938 |
Filed:
|
March 15, 1990 |
Current U.S. Class: |
219/121.69; 219/121.73; 219/121.74; 219/121.75; 219/121.8 |
Intern'l Class: |
B23K 009/00 |
Field of Search: |
219/121.74,121.75,121.68,121.69,121.78,121.82,121.8
|
References Cited
U.S. Patent Documents
4456812 | Jun., 1984 | Neiheisel et al. | 219/121.
|
Foreign Patent Documents |
1-306088 | Dec., 1989 | JP | 219/121.
|
Other References
"Two Interconnection Techniques for Large-Scale Circuit Integration", IBM
Journal, Sep. 1967, pp. 520-526.
"Laser Speeds Gate-Array Hookup", Electronics Week/Feb. 4, 1985, pp. 21 and
24.
|
Primary Examiner: Albritton; C. L.
Attorney, Agent or Firm: Chernoff, Vilhauer, McClung & Stenzel
Claims
I claim:
1. A method for high precision laser scanning and focussing which comprises
scanning a laser beam, passing thereafter the beam through a beam
expander, and then focussing the beam onto a surface.
2. A method as claimed in claim 1 wherein the beam expander gives a large
diameter laser beam which is focussed by a lens to a small spot on the
surface.
3. A method for high precision laser scanning and focussing which comprises
scanning a laser beam, passing the beam through a beam expander, and then
focussing the beam onto a surface by projecting the expanded laser beam
through a microscope objective to focus the beam on the surface.
4. A method as claimed in claim 3 wherein the surface is a photoresist
coated integrated circuit wafer.
5. A method as claimed in claim 4 wherein the position of the integrated
circuit wafer in relation to the focussed laser beam is controlled by a
movable surface on which the wafer is positioned.
6. A method as claimed in claim 5 wherein the laser beam is generated from
a helium cadmium laser source, and the beam is switched on or off by an
acousto-optic modulator.
7. A method as claimed in claim 6 wherein the switched on laser beam is
scanned by a resonant scanner.
8. A method as claimed in claim 6 wherein the switched on laser beam is
scanned by a rotating polygonal mirror located at the entrance of the beam
expander.
9. A method for high precision laser scanning and focussing which comprises
scanning a laser beam emitted from a laser source and having a first
diametrical width to produce a first scan angle, and thereafter passing
the scanned beam through a beam expander which expands the beam to form an
expanded beam having a second diametrical width, said beam expander
reducing the first scan angle to a second scan angle inversely
proportional to a beam expansion ratio of the first diametrical width
relative to the second diametrical width, and then focussing the expanded
beam onto a surface.
10. A method as claimed in claim 9 wherein the beam expander produces a
large diameter laser beam which is focussed by a lens to a small spot on
the surface.
Description
TECHNICAL FIELD OF THE INVENTION
This invention is directed to a laser, direct-write apparatus and process
for producing a personalized custom or semi-custom integrated circuit
wafer. In one aspect, the invention relates to an optical system which
provides high precision scanning of a focussed laser spot.
BACKGROUND OF THE INVENTION
Laser scanning has been used in many fields. Laser printers, bar code
readers and optical tape data recorders are examples of laser scanning
applications. Laser scanning is also important in the semiconductor
industry. It has been used in scanning laser microscopes, semiconductor
processing, and in laser pattern generators which produce reticles for
wafer steppers.
By far the most widely used laser scanning device is the rotating polygonal
mirror which is found in almost every laser printer. The optical system in
a typical laser printer involves a laser source, an acousto-optic
modulator, a beam expander, a rotating polygonal mirror and a cylindrical
focussing lens. The laser beam is switched at very high speed by the
acousto optics modulator and then expanded to a desirable diameter. The
expanded laser beam is then scanned and focussed, producing a scan line of
tens of centimetres in length with up to thousands of resolvable spots.
The spot size for a typical laser printer is in the order of tens of
microns (1 micron =0.001 mm).
Two articles disclose integrated circuit processes which have relevance to
this field of technology.
IBM Journal--September, 1967, Pages 520-526
The IBM Journal article indicates that the system disclosed therein uses
either ultraviolet light or an electron beam light to expose photoresists
on a mechanically translated wafer. The process involves converting
computer-generated wiring instructions into metallic conductors on a
semiconductor wafer. In both the ultraviolet light and electron beam
embodiments, wafers are translated under the energy source while attached
to a table which is driven by stepping motors so as to carry out
programmed X-Y movement. The exposed portions of the photoresist are
subsequently washed away. The ultraviolet light or the electron beam are
controlled in an on-off manner by electromechanical shutters, which in
turn are controlled by a computer program.
Electronics Week--Feb. 4, 1985, Pages 21 to 24
The Lasarray ray process as described in the Electronics Week article
discloses an apparatus and a process whereby a precisely guided laser beam
and conventional etching methods are used to produce custom integrated
circuits in small lots in short turn around time. The process uses
prestructured wafers and does not include customer-specific masks. The
wafer is moved in line-by-line fashion in 1 micron steps under a laser gun
that produces a stationary beam of blue light focussed to a spot diameter
of 2 microns. The beam is turned on and off under computer control.
Exposed areas of the wafer are subsequently etched.
SUMMARY OF THE INVENTION
The apparatus and process of the invention are used in a laser,
direct-write process to provide personalized custom or semi-custom
integrated circuits with a very short turnaround time. I have invented a
high production rate laser, direct-write system for exposing the
photoresist layer on a semi-custom integrated circuit wafer without a
mask. This maskless process eliminates tooling (mask making) and makes it
possible to personalize small quantities (less than 500) of semi-custom
integrated circuits at low cost and with a fast turnaround time.
The invention pertains to a high precision laser scanning and focussing
system which comprises scanning a laser beam, passing the beam through a
beam expander, and then focussing the beam onto a surface. The beam
expander gives a large diameter laser beam which can be focussed by a lens
to a small spot on the surface. The expanded laser beam can be projected
through a microscope objective to focus the beam on the surface.
In the system as defined, the surface can be a photoresist coated
integrated circuit wafer. The position of the integrated circuit wafer in
relation to the focussed laser spot can be controlled by a movable surface
on which the wafer is positioned. In the system, the laser beam can be
generated from a helium cadmium laser source, and the beam can be switched
on or off by an acousto-optic modulator. The switched on laser beam can be
scanned by a resonant scanner or can be scanned by a rotating polygonal
mirror located at the entrance of the beam expander.
The invention is also directed to a laser, direct-write custom or
semi-custom integrated circuit production apparatus which comprises:
(a) a laser generator which emits a laser beam;
(b) a laser beam modulator which modulates the emitted laser beam;
(c) a laser beam scanner which scans the modulated laser beam in a first
direction;
(d) a beam expander which expands the diameter of the scanned laser beam;
(e) a focussing means which focusses the expanded laser beam onto a
surface, the surface being movable in a direction perpendicular to the
first direction; and
(f) a programmed computer means which controls the laser beam modulator and
the movement of the surface.
In the apparatus, the laser generator can be a helium cadmium laser source.
The modulator can be an acousto-optic modulator. The scanner can be an
multi-facet rotating polygonal mirror. The focussing means can be a
microscope objective. The surface can be a motorized table which is
controlled by the computer and carries a photoresist coated integrated
circuit wafer.
BRIEF DESCRIPTION OF THE DRAWINGS
In drawings which illustrate a specific embodiment of the invention, but
which drawings should not be construed as restricting the spirit or scope
of the invention in any way:
FIG. 1 illustrates a schematic diagram of the basic components of the
laser, direct-write, custom or semi-custom integrated circuit production
system;
FIG. 2 illustrates a schematic diagram of the beam scanning components of
the laser, direct-write system;
FIG. 3 illustrates a detail view of the optics of the beam expander
component of the laser, direct-write system;
FIG. 4 illustrates an example of a high resolution photoresist pattern
produced by the laser, direct-write system; and
FIG. 5 illustrates an example of an interconnect photoresist pattern
produced on a semi-custom integrated circuit, in this case a complementary
metal-oxide semi-conductor (CMOS) gate array.
DETAILED DESCRIPTION OF SPECIFIC EMBODIMENTS OF THE INVENTION
The laser, direct-write custom or semi-custom integrated circuit (IC)
production system involves a laser generator, a microscope, a programmed
control computer and a motorized X-Y axis table on which the photoresist
coated IC wafer is placed. The laser beam is scanned and then passed
through a beam expander before it is projected onto the surface of the
semi-custom IC wafer. This technique permits two very desirable goals to
be simultaneously achieved: (1) a larger diameter laser beam which can be
focussed to a smaller spot on the semi-custom integrated circuit wafer;
and (2) the angular distance of the scanned laser beam is compressed,
thereby resulting in a reduction of the scanning error.
The basic operation of the laser, direct-write system is illustrated in
FIG. 1. A laser beam 11 is generated by a helium cadmium laser generator
10. The laser beam 11 is passed through an acousto-optic modulator 12,
which is controlled by a radio frequency (RF) driver 8, controlled in turn
by a control computer 6. The modulated beam 13 is directed to a scanning
mirror 14, which in turn deflects and directs the beam 16 through a
microscope objective 25, which focusses the beam into a spot 26 on a
photoresist coated IC wafer 4 which is mounted on a motorized X-Y axis
movable table 2, controlled by the control computer 6. The focussed laser
spot 26 is in the order of 0.7 micron after it is projected through the
microscope objective 25 onto the photoresist coated integrated circuit
wafer 4. Both the motorized X-Y table 2, which changes the relative
position of the integrated circuit wafer 4 to the focussed laser spot 26,
and the laser beam 16 are under computer control to expose the
photo-resist selectively according to information stored in control
computer 6. Through this technique, an interconnect pattern of an
integrated circuit can be transferred from computer stored data to the
photoresist layer of the integrated circuit wafer 4 directly. The laser
scanning mirror 14 improves the throughput of the system by enabling the
beam 16 and the focussed spot 26 to be moved along the Y-axis. The table 2
has a certain amount of inertia and this restricts the ability of the
table 2 to be moved rapidly along both the X and Y axis. Moving the laser
beam 16 along the Y-axis coupled with movement of the table along only the
X-axis, increases the overall speed of production by orders of magnitude.
The scanning mirror 14 is used to deflect the laser beam 16 in order to
produce a 256-micron Y-axis scan line. There are two major problems that
arise by employing a mechanical scanning device 14, such as a rotating
polygonal mirror, in this procedure. For an average grade, motor-driven,
rotating polygonal mirror 14, the accuracy of scanning is in the order of
.+-.30 arc seconds. When a 50.times. microscope objective with a focal
length of 5 mm is used to focus the laser spot 26 onto the integrated
circuit wafer surface 4, the angular distance of two points one micron
apart is 41 arc seconds. It therefore follows that the use of an average
grade rotating polygonal mirror 14 limits the accuracy of the direct-write
system to about 0.8 micron, which is unsatisfactory.
The other disadvantage of using the rotating polygonal mirror 14 is that
while the polygonal mirror provides a very wide scan angle (an 8-facet
unit provides a scan angle of up to 90 degrees by each facet), the
projection optics (the microscope objective 25) of the laser, direct-write
system accepts only .+-.1.5 degree deflection of the incoming laser beam
16. As a result, the laser power can only be utilized at a very low duty
cycle, leading to a significant decrease in throughput.
To solve the two foregoing problems, I have invented a scanning system
which is described below in association with FIG. 2. FIG. 2 illustrates
the details of the optical path of the scanned laser beam. The laser light
source 10 is a helium cadmium, 442 nanometer wavelength laser with an
output power of 10 milliwatts. The output beam 11 has a 0.3 millimeter
diameter. This laser beam 11 is switched on and off by an acousto-optic
modulator 12. The modulator switched laser beam 13 is then deflected by a
rotational 8-facet polygonal mirror 14 which produces a scan angle 15,
which is typically 30 degrees peak-to-peak. It will be understood by those
skilled in the art that the same scanning function can be provided by
other types of mechanical scanners such as a resonant scanner (for
example, a resonant scanner made by General Scanning of Watertown, Mass.,
USA). The deflected laser beam 16 then enters a beam expander 17.
The beam expander 17, shown in detail in FIG. 3, consists of at least two
lenses. The entrance lens 18 has a focal length f.sub.i 20 and the exit
lens 19 has a focal length f.sub.e 21. The expansion ratio, defined as the
ratio of the output beam diameter D.sub.e 23 and the input beam diameter
D.sub.i 22, is given by f.sub.e /f.sub.i.
Referring again to FIG. 2, the scanned expanded laser beam 24 at the exit
of the beam expander 17 has a diameter of about 3 millimeters. At the same
time, the scan angle at the exit of the beam expander 17 is reduced by a
factor of f.sub.e /f.sub.i, that is, the beam expansion ratio. It follows
that the error of the mechanical scanner system is reduced by this same
ratio, which is typically 10.
The scanned laser beam 24 at the exit of the beam expander 17 is then
focused through a 50.times. microscope objective 25 which has a focal
length of 5 millimeters. This produces a 256-micron scanned line on the
surface of the integrated circuit wafer 4 with a positioning accuracy of
0.1 micron.
Scanning the laser beam in this direct-write system provides a very high
resolution and accuracy. The system can provide a submicron laser spot
with a placement accuracy of 0.1 micron on the semicustom integrated
circuit. This accuracy is orders of magnitude higher than those required
in a typical laser printer application.
A photoresist test pattern produced by the laser, direct-write system is
shown in FIG. 4. This test pattern, consisting of 1-micron wide lines and
spaces on a 1-micron thick photoresist, illustrates how fine a photoresist
pattern can be produced by the laser, direct-write system of the
invention.
An interconnect photoresist pattern produced by the laser, direct-write
system on a complementary metal oxide semi-conductor (CMOS) gate array is
shown in FIG. 5. In a subsequent metalization etching process, the
interconnect metal underneath the patterned photoresist will be left
behind.
A key advantage of the disclosed technique is that it can use an
inexpensive mechanical scanning device, such as a rotating polygonal
mirror, to position a focussed laser spot with an accuracy of 0.1 micron.
In distinction to all other laser scanning systems, the system scans the
laser beam at the entrance of a beam expander. This arrangement allows the
beam expander to reduce the scan angle and error produced by a mechanical
scanning device such as a rotating polygonal mirror. The smaller scan
angle at the output of the beam expander matches well with the projection
optics of the laser, direct-write system, and the scan error reduction
permits more accurate positioning of the focussed laser spot on the
surface of the semi-custom integrated circuit.
The subject laser scanning system has a helium cadmium laser source, the
output of which is turned on and off at high speed by an acousto-optic
modulator. The switched laser beam is scanned by either a resonant scanner
or a rotating polygonal mirror at the entrance of a 10.times. beam
expander. At the exit of the beam expander, the laser beam diameter is
increased by the expansion ratio (10.times.), while the scan angle is
reduced by the same amount. Since only a small scan angle, typically 3
degrees peak-to-peak, is required in the direct-write projection optics,
this arrangement allows the beam expander to serve two very important
objectives: (1) by expanding the laser beam before focussing it through
the objective, a smaller laser spot can be produced; (2) by reducing the
exit laser beam scan angle, the beam expander decreases the angular error
produced by the mechanical scanner, thereby resulting in a shorter but
more accurate scan line when the exit laser beam is projected through a
microscope objective.
As will be apparent to those skilled in the art in the light of the
foregoing disclosure, many alterations and modifications are possible in
the practice of this invention without departing from the spirit or scope
thereof. Accordingly, the scope of the invention is to be construed in
accordance with the substance defined by the following claims.
Top