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United States Patent |
5,057,991
|
Sheen
|
October 15, 1991
|
Structure of bridge rectifier
Abstract
A bridge rectifier, comprising a first pair of silicon chips connected
between a first outer lead and two inner leads, a second pair of silicon
chips connected between said two inner leads and a second outer lead, and
a pair of conductive blocks connected between said two inner leads and
said second pair of silicon chips. The positive (negative) pole of the
silicon chips is disposed at the same direction with one another so that
the silicon chips can be mounted in a mold through an automatic silicon
mounting device.
Inventors:
|
Sheen; C. G. (Taipei, TW)
|
Assignee:
|
Silitek Corporation (Taipei, TW)
|
Appl. No.:
|
645444 |
Filed:
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January 24, 1991 |
Current U.S. Class: |
363/144; 29/854; 257/909; 257/E25.025; 363/126; 438/107 |
Intern'l Class: |
H02M 007/06 |
Field of Search: |
363/126,144,146
357/76,77
437/906,209
29/854
|
References Cited
U.S. Patent Documents
3476985 | Nov., 1969 | Magner et al. | 357/76.
|
4367523 | Jan., 1983 | Urba | 363/144.
|
4724474 | Feb., 1988 | Duchek et al. | 357/76.
|
Foreign Patent Documents |
1246888 | Aug., 1967 | DE | 357/76.
|
Primary Examiner: Beha, Jr.; William H.
Attorney, Agent or Firm: Lowe, Price, LeBlanc & Becker
Claims
What is claimed is:
1. A bridge rectifier, comprising two outer leads, two inner leads, two
pairs of silicon chips and two conductive blocks respectively connected
into a rectifier circuit, wherein:
said outer leads have each a curved silicon chip contact portion at the
front end, and a lead wire vertically connected to said curved silicon
chip contact portion at one end;
said inner leads have each a silicon chip contact portion, and a lead wire
connected to said silicon chip contact portion at the bottom end thereof
and arranged into a L-shaped configuration;
said two pairs of silicon chips have each a positive pole at one end and a
negative pole at an opposite end;
said conductive blocks are each made of an electric conductor in
cylindrical shape; and characterized in that the assembly of the bridge
rectifier is made by inserting a first outer lead in a mold and fastening
a first pair of silicon chips to said first outer lead with the negative
pole thereof respectively soldered to the top edge of the curved silicon
contact portion of said first outer lead, then, inserting said two inner
leads in said mold with the silicon chip contact portion thereof disposed
above said first pair of silicon chips and respectively connected to the
positive pole of said first pair of silicon chips through tin soldering
connection, and then, connecting said two conductive blocks to the top
edge of the silicon chip contact portion of said first pair of silicon
chips through tin soldering process, and then, fastening a second pair of
silicon chips to said two conductive blocks with the positive pole thereof
respectively connected to the top edge of said two conductive blocks
through tin soldering process permitting the negative pole thereof to be
disposed upward, and at last, inserting a second outer lead in said mold
with the bottom edge of the curved silicon chip contact portion thereof
respectively connected to the negative pole of said second pair of silicon
chips through tin soldering process permitting the lead wire thereof to be
guided out through an opposite side.
Description
BACKGROUND OF THE INVENTION
The present invention relates to bridge rectifiers, and more particularly
relates to a bridge rectifier which can be conveniently assembled through
an automatic machine.
FIG. 1 illustrates a structure of bridge rectifier according to the prior
art which is assembled by placing two outer leads transversely at the same
level, then, connecting the positive end of a first pair of silicon chips
to the top edge of the first outer lead and the negative end of a second
pair of silicon chips to the top edge of the second outer lead, and then
connecting two inner leads longitudinally to the silicon chips at the top
permitting each inner lead to connect with the positive pole of one
silicon chip and the negative pole of another silicon chip. Disadvantage
of this structure is that the positive and negative poles of one silicon
chips are disposed at different directions from another. Therefore, this
arrangement is not suitable for automatic production through an automatic
silicon chip mounting device, i.e. the silicon chips are respectively
mounted in place inside the mold by labor.
SUMMARY OF THE INVENTION
The present invention has been accomplished to eliminate the aforesaid
problem. It is therefore an object of the present invention to provide a
bridge rectifier which can be assembled through automatic manufacturing
process. This object is achieved by mounting a first pair of silicon chips
between a first outer lead and two inner leads, a second pair of silicon
chips between said two inner leads and a second outer lead, and a pair of
conductive blocks between said two inner leads and said second pair of
silicon chips. Therefore, the silicon chips are all disposed in a vertical
position with the positive pole commonly facing downward and the negative
pole commonly disposed upward.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 illustrates a structure of bridge rectifier according to the prior
art, showing that the silicon chips and the leads thereof are arranged
into a bridge circuit;
FIG. 2 is a perspective dismantled view of the preferred embodiment of the
bridge rectifier of the present invention; and
FIG. 3 is a perspective assembly view of the preferred embodiment of the
bridge rectifier of the present invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
Referring to FIGS. 2 and 3, therein illustrated is the preferred embodiment
of the bridge rectifier of the present invention generally comprised of
two outer leads 1, two inner leads 2, four silicon chips 3 and two
conductive blocks 4. The outer leads 1 have each a curved silicon chip
contact portion 11 at the front end, and a lead wire 12 vertically
connected to said curved silicon chip contact portion 11. The inner leads
2 have each a silicon chip contact portion 21, and a lead wire 22
connected to said silicon chip contact portion 21 at the bottom, terminal
end and arranged into a L-shaped configuration. The silicon chips 3 have
each a positive pole 31 at one end and a negative pole at an opposite end
32. The conductive blocks 4 are each made of an electric conductor in
cylindrical shape.
During assembly process, a first outer lead 1 is firstly set in the mold at
a lower position and then fasten a first pair of silicon chips 3 thereto
with the negative pole 32 of said first pair of silicon chips respectively
soldered to the curved silicon contact portion 11 of said first outer lead
1 at the top. Then, insert two inner leads 2 in the mold with the silicon
chip contact portion 21 thereof disposed above said first pair of silicon
chips 3 and respectively connected to the positive pole 31 of said first
pair of silicon chips 3 through soldering connection. Two conductive
blocks 4 are then respectively soldered to the top edge of the silicon
chip contact portion 21 of the first pair of silicon chips 3. Then, fasten
a second pair of silicon chips 3 to said two conductive blocks 4 with the
positive pole 32 thereof respectively soldered to the top edge of said two
conductive blocks 4, i.e. the negative pole 31 of the second pair of
silicon chips 3 is disposed at the top. At last, a second outer lead 1 is
inserted in the mold with the bottom edge of the curved silicon chip
contact portion 11 thereof soldered to the negative pole 31 of said second
pair of silicon chips 3, permitting the lead wire 12 thereof to be guided
out through an opposite side.
In the aforesaid process, all silicon chips 3 are inserted in the mold in
the same direction, i.e. silicon chips 3 can be automatically continuously
mounted in a plurality of molds through an automatic silicon chip mounting
device to improve the productivity.
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