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United States Patent |
5,048,548
|
Ramsey, Jr.
|
September 17, 1991
|
Vapor control system for vapor degreasing/defluxing equipment
Abstract
An improved vapor degrease characterized by a deep freeboard zone (i.e.,
freeboard to width ratio of 1.0 to 2.3) containing a three-stage
condenser/heat exchanger configuration comprising: a water-cooled lower
primary exchanger operating above 32.degree. F. to effect condensation of
the bulk of the vapor generated by the boiling sump and a combination of
an intermediate exchanger above, but preferably overlapping, the primary
exchanger and a dehumidifying third exchanger position just below the top
lip of the degreaser, both operating at a temperature below 32.degree.F.
(preferably +10.degree. to -30.degree.F.) to effect a reduction in the
vapor concentration gradient that controls the rate of vapor diffusion
through the freeboard zone. The improved vapor degreaser is particularly
useful in reducing vapor losses when using low boiling solvents.
Inventors:
|
Ramsey, Jr.; Robert B. (Wilmington, DE)
|
Assignee:
|
E. I. Du Pont de Nemours and Company (Wilmington, DE)
|
Appl. No.:
|
480606 |
Filed:
|
February 15, 1990 |
Current U.S. Class: |
134/108; 134/105; 202/170 |
Intern'l Class: |
B01D 005/00 |
Field of Search: |
134/108,105,11,12,31,40
202/170
34/73,75,78
|
References Cited
U.S. Patent Documents
2020335 | Nov., 1935 | Savage | 87/6.
|
2090192 | Aug., 1937 | Edhofer et al. | 87/6.
|
2650085 | Aug., 1953 | Burnett | 266/19.
|
2816065 | Dec., 1957 | Legler | 202/170.
|
2823174 | Feb., 1958 | Pickett | 202/170.
|
2867225 | Jan., 1959 | Zademach et al. | 134/108.
|
3106928 | Oct., 1963 | Rand | 134/79.
|
3242057 | Mar., 1966 | Talian et al. | 202/170.
|
3242933 | Mar., 1966 | Huff | 134/68.
|
3375177 | Mar., 1968 | Rand | 203/39.
|
3606896 | Sep., 1971 | Holm | 174/79.
|
4029517 | Jun., 1977 | Rand | 134/11.
|
4210461 | Jul., 1980 | Moree et al. | 134/11.
|
4246116 | Jan., 1981 | Cormack | 210/170.
|
4486239 | Dec., 1984 | du Fresne | 134/11.
|
4973387 | Nov., 1990 | Osterman et al. | 134/11.
|
Foreign Patent Documents |
112484 | Jul., 1984 | EP.
| |
140090 | May., 1985 | EP.
| |
2083504 | Mar., 1982 | GB.
| |
Other References
"FREON.RTM. Cleaning Agents: Cleaning System Design," Du Pont Brochure,
FS-30A, 1969.
"FREON.RTM. Solvent Production Cleaning Equipment", Du Pont Brochure,
FS-27, 1986.
"The `Cold Trap`", AutoSonics Inc. Brochure, PRE-1969.
"TRAP Solvent Vapors Cold . . . ", Dow Chemical Co. Brochure, 1969.
|
Primary Examiner: Cuchlinski, Jr.; William A.
Assistant Examiner: Dowling; William C.
Attorney, Agent or Firm: Stevenson; Robert B.
Claims
I claim:
1. In a vapor degreasing apparatus, wherein a cleaning solvent is
maintained at reflux conditions for degreasing/defluxing an object,
comprising a boiling sump for immersing the object to be cleaned, a vapor
zone and a freeboard zone above the boiling sump with an associated first
heat exchanger to condense the vapors generated by the boiling sump, and a
clean solvent sump for collecting the condensed vapors, rinsing the
cleaned object and replenishing the solvent in the boiling sump, the
specific improvement comprising:
(a) a first condenser/heat exchanger means adapted to operate at a
temperature below the dew point of the solvent vapor but above about
32.degree. F. (0.degree. C.) for condensing the vapors produced by the
boiling sump;
(b) a second condenser/heat exchanger means adapted to operate at a
temperature below 32.degree. F. (0.degree. C.) and located above the
lowest portion of the first condenser/heat exchanger for further
condensing vapors produced by the boiling sump;
(c) a third condenser/heat exchanger means adapted to operate at a
temperature within about 5.degree. C. of the temperatures of the second
condenser/heat exchanger means and located above the first and second
condenser/heat exchanger means near the top of the freeboard zone for
condensing water vapor; and
(d) a means associated with the third condenser/heat exchanger means for
isolating any condensed water or frost.
2. An improved degreasing apparatus of claim 1 wherein said second
condenser/heat exchanger means is positioned at a level that at least
partially overlaps with the level of said first condenser/heat exchanger
means.
3. An improved degreasing apparatus of claims 1 or 2 wherein the depth of
freeboard to width ratio is from about 1.0 to about 2.3.
4. An improved degreasing apparatus of claim 3 wherein said third
condenser/heat exchanger means is from about 1.0 to about 12 inches below
the top lip of the vapor degreasing apparatus.
Description
BACKGROUND OF THE INVENTION
1. Field of the Invention
This invention relates to an improved solvent vapor control system for the
minimization of emissions from vapor degreasing and defluxing equipment.
More specifically, the invention relates to the use of multiple-stage
condensing/heat exchanging within the freeboard region of a vapor
degreaser to reduce vapor diffusional losses.
2. Description of the Prior Art Including Information Disclosed Under
.sctn..sctn.1.97-1.99
It is generally known and a common commercial practice to employ an organic
solvent/cleaning agent in various types of vapor degreasing/defluxing
equipment to clean articles of manufacture, deflux electronic circuit
boards and the like. It is also generally known and a common commercial
practice to employ various volatile organic solvents and, in particular,
chlorofluorocarbons, CFCs, as the solvent of choice. However, it is now
recognized that the escape of organic solvents and, in particular, the
escape of certain CFCs to the atmosphere will potentially contribute to
the depletion of the stratospheric ozone layer and contribute to the
global warming phenomenon. In view of the above, certain
hydrochlorofluorocarbons, HCFCs, and hydrofluorocarbons, HFCs, are now
being considered as alternatives to the ozone-depleting CFC solvents.
These alternatives are generally more expensive and more physiologically
active than commonly used compounds and, in some instances, the proposed
alternative compound is also highly volatile with a boiling point at or
near room temperature. Consequently, the traditional incentives to reduce
vapor losses because of cost and safety considerations are enhanced and of
greater criticality when using a low boiling HFC or HCFC as the solvent.
Historically several methods of reducing vapor losses to the atmosphere
when using a vapor degreaser have been proposed with varying degrees of
success; however, no prior art reference appears to deal specifically with
the diffusional losses associated with and caused by the vapor
concentration gradient inherently present in the freeboard region of the
vapor degreaser. For example, U.S. Pat. No. 2,090,192 uses a single
cooling coil to condense vapors within an essentially totally enclosed
unit, thus reducing vapor loss to the atmosphere by isolating the vapors
from the air. In U.S. Pat. No. 2,816,065 a two-sump, open-top degreaser is
disclosed wherein a single refrigerated condenser coil is used at
effectively a lower temperature than normal to minimize vapor losses, but
again not control of the vapor concentration gradient over the length of
the freeboard zone is suggested to reduce diffusional losses.
Also several prior art disclosures have suggested the use of more than one
cooling coil or heat exchanger for various reasons, but again, not
specifically to reduce the vapor concentration gradient found in the
freeboard region of the degreaser. For example, U.S. Pat. No. 2,000,335
suggests the use of two heat exchangers in series within the vapor
degreaser. The first heat exchanger is immersed in the hot liquid solvent
and is used to heat the water coolant such that the second condensation
heat exchanger operates above the dew point preventing water condensation
simultaneously with solvent recovery. U.S. Pat. No. 2,650,085 suggests the
use of two different temperature cooling coils in a distillation process;
however, the process is not a vapor degreaser but rather the distillation
and recovery of calcium metal and an alkali metal. In U.S. Pat. No.
3,106,928, the problem of diffusional losses is recognized and the use of
a small fan to recycle the vapor/air mixture above the condensing coil to
a secondary, external condenser for further vapor condensation is
disclosed. In U.S. Pat. Nos. 3,242,057 and 3,242,933 a pair of
condenser/heat exchangers each operated at essentially the same
temperature are used in a rotating drum and in a conveyer belt automated
vapor degreaser system, respectively, wherein the second water-cooled
condenser is located at the exit of the automated system.
In U.S. Pat. No. 3,375,177 an open-top vapor degreaser unit that employs a
water-cooled primary condenser/heat exchanger to condense the vapors above
the boiling sump and an additional refrigerated condenser/heat exchanger
above the primary condenser to dehumidify and further reduce vapor loss is
disclosed. Again, this reference is void of any suggestion or attempt to
control the temperature profile throughout the freeboard zone, such as to
reduce the vapor concentration gradient. As such, even this prior art
vapor degreaser will exhibit significant vapor losses associated with
vapor diffusion.
SUMMARY OF THE INVENTION
The present invention provides an improved multi-stage condenser/heat
exchanger configuration within a conventional vapor degreaser and a novel
method of operating such a configuration such as to simultaneously
minimize cooling costs and minimize vapor loss. According to the present
invention, at least three specific heat exchangers critically positioned
at various depths in a vapor degreasing unit characterized by a deep
freeboard (i.e., freeboard to width ratio of 1.0 to 2.3) are maintained at
two different temperatures to optimize the vapor condensation and cooling
process. A water-cooled lower primary exchanger operating at a temperature
greater than 32.degree. F. (0.degree. C.) is used to effect the
condensation of the bulk of the vapors generated by the boiling sump at
minimal costs for coolant. A second intermediate exchanger located above
the primary exchanger (but, preferably with some overlap with the primary
exchanger) is operated at a temperature below 32.degree. F. (typically
+10.degree. to -30.degree. F.) to desolvantize the vapor/air atmosphere in
the portion of the freeboard zone that exists at an elevation between the
midpoint of the primary exchanger and the top of the secondary,
intermediate exchanger. A third, upper exchanger, located above the other
two exchangers and near the top of the degreaser freeboard zone below the
top lip of the degreaser is operated at a temperature that is preferably
within .+-.5.degree. C. of the temperature of the intermediate exchanger
to provide a dehumidified atmosphere of low water vapor content at the top
of the degreaser's freeboard zone. The combination of the intermediate,
relatively cold, exchanger and the upper dehumidifying exchanger produces
a significant and unexpected reduction in the vapor concentration gradient
that controls the rate of vapor diffusion through the freeboard zone. As
such, the use of the improved multi-stage condenser/heat exchanger system
of the present invention is particularly useful to reduce diffusional
losses when using low temperature solvents.
Thus, the present invention provides in a vapor degreasing apparatus,
wherein a cleaning solvent is maintained at reflux conditions for
degreasing/defluxing an object, comprising a boiling sump for immersing
the object to be cleaned, a vapor zone and a freeboard zone above the
boiling sump with an associated first heat exchanger to condense the
vapors generated by the boiling sump, and a clean solvent sump for
collecting the condensed vapors, rinsing the cleaned object and
replenishing the solvent in the boiling sump, the specific improvement
comprising:
(a) a first condenser/heat exchanger means adapted to operate at a
temperature below the dew point of the solvent vapor but above about
32.degree. F. (0.degree. C.) for condensing the vapors produced by the
boiling sump;
(b) a second condenser/heat exchanger means adapted to operate at a
temperature below 32.degree. F. (0.degree. C.) and located above the
lowest portion of the first condenser/heat exchanger for further
condensing vapors produced by the boiling sump;
(c) a third condenser/heat exchanger means adapted to operate at a
temperature within about 5.degree. C. of the temperature of the second
condenser/heat exchanger means and located above the first and second
condenser/heat exchanger means near the top of the freeboard zone for
condensing water vapor; and
(d) a means associated with the third condenser/heat exchanger means for
isolating any condensed water or frost.
The novel process for recovering solvent vapors in a vapor degreasing
apparatus, according to the present invention, comprises the steps of:
(a) subjecting vapors above a boiling solvent to a first heat exchanger
cooling step at a temperature below the dew point of the solvent vapors
but above 32.degree. F. (0.degree. C.);
(b) subjecting vapors above the location of the first heat exchanger step
to a second heat exchanger step at a temperature below 32.degree. F.
(0.degree. C.);
(c) subjecting vapors above the location of the second heat exchanger step
to a third heat exchanger step at a temperature within about 5.degree. C.
of the temperature of the second heat exchanger step; and
(d) isolating any recovered condensate produced from the third heat
exchanger step such that it can be subjected to a drying step prior to
being combined with condensate produced in the first and second heat
exchanger steps.
It is an object of the present invention to provide an improved vapor
degreaser that when used with a low boiling organic solvent and, in
particular, low boiling halocarbons, the solvent losses associated with
diffusion are significantly reduced. It is a further object of the present
invention to accomplish the above by using a plurality of critically
positioned condenser/heat exchangers in the freeboard zone of the
degreaser such as to simultaneously condense the bulk of the vapors
generated by the boiling sump economically by use of a water chilled
primary exchanger and reduce the vapor concentration gradient associated
with diffusion through the freeboard zone by use of a pair of refrigerant
cooled exchangers. It is still further object of the present invention to
reduce the water vapor concentration entering the freeboard zone such as
to further reduce vapor diffusional losses by having one of the
refrigerant cooled exchangers be located below the lip of the degreaser at
the top of the freeboard zone. Fulfillment of these objects and the
presence and fulfillment of additional objects will be apparent upon
complete reading of the specification and claims taken in combination with
the attached drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a schematic cross-section view of a typical two-sump, open-top
degreaser as known and commercially practiced in the prior art.
FIG. 2 is a schematic cross-sectional view of an improved two-sump,
open-top degreaser with hooded work transporter according to the present
invention.
FIG. 3 is a plot of volume percent of CCl.sub.3 F, CFC-11, in the freeboard
atmosphere as a function of depth in inches down from the top lip of the
degreaser for three different condenser/heat exchanger configurations
involving a different number of condensers being present in each curve
being plotted.
FIG. 4 is a plot of volume percent of CCl.sub.3 F, CFC-11, in the freeboard
atmosphere as a function of depth in inches down from the top lip of the
degreaser for three different condenser/heat exchanger configurations
involving a primary condenser and a secondary condenser with the location
of the secondary condenser differing in each curve being plotted.
FIG. 5 is a plot of volume percent of CCl.sub.3 F, CFC-11, in the freeboard
atmosphere as a function of depth in inches down from the top lip of the
degreaser for three different condenser/heat exchanger configurations
involving a different location for the third stage, dehumidifying heat
exchanger in each curve being plotted.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
The improved equipment and method of minimizing diffusional losses from a
vapor degreasing/defluxing unit according to the present invention, how
the modifications are incorporated into a conventional prior art degreaser
and how the present invention differs from the prior art as well as the
advantages associated with its use can perhaps be best explained and
understood by reference to the drawings. Generally, halogenated organic
solvents/cleaning agents are used in degreasing/defluxing equipment that
can be configured in a variety of ways. To a great extent, all such
equipment configurations are based on fundamental concepts employed in a
prior art device commonly referred to as a conventional two-sump, open-top
degreaser. FIG. 1 of the drawings illustrates such a prior art degreaser.
Typically, the degreaser will involve an open-top tank 10 covered by an
optional lid 12 wherein at least one heated sump 14 generates solvent
vapors (thus the term "vapor generator" or "boiling sump") and one or more
rinse sumps 16 arranged in an overflowing cascaded relationship (see
arrow) to the heated sump 14. In the broadest sense of the present
invention, the presence of the rinse sump 16 is optional as previously
shown when describing prior art references. However, contemporary vapor
degreaser/defluxing equipment usually employs at least one rinse sump or
the equivalent for reasons that will be apparent upon explaining how such
a device is to be used. The tank 12 of the prior art device will have a
condensing coil (heat exchanger) 18 appropriately located above the
boiling solvent in the sump 14, to cool and condense solvent vapors back
into liquid form. A trough 20 under the condenser/heat exchanger 18
collects the condensate. A water separator or desiccant dryer 22 is used
to remove water from the condensate being delivered from trough 20 via
line 24 before the dry condensate is returned to the rinse (or cleaning)
sump 16.
During use, heater 26 supplies energy to the liquid solvent/cleaning agent
28 in the boiling sump 14 such that a vapor zone 30, rich in solvent
vapors, is maintained between the surface of the liquid in the various
sumps and approximately at the vertical midpoint of the condensing coil
18. In other words, such equipment is typically designed and operated such
that the vapor/air interface is about half way up the vapor condensing
coils. The region or space directly above the vapor/air interface is
referred to as the freeboard zone 32 and traditionally has been
quantitatively characterized as the vertical distance from the midpoint of
the condenser 18 (i.e., top of the vapor zone) to the top edge of the tank
12. It is also generally accepted and known in the art that the ratio of
this freeboard dimension (i.e., the height over the refluxing vapor phase)
to the smallest horizontal tank dimension (the so-called "freeboard/width
ratio") affects diffusional losses and in prior art devices should be at
least 0.75 up to about 1.0.
Typically the prior art device will be further equipped with one or more
ultrasonic transducers 34 to facilitate the cleaning of an object immersed
in the liquid phase of a sump (in this illustrated embodiment the cleaning
agent rinse sump 16). The rinse sump 16 is also equipped with an external
recycle liquid cleaning loop involving a strainer 36, pump 38 and filter
40 for removing particulate material freed during ultrasonic liquid
immersion of the cleaned/defluxed article. A low liquid level and high
solvent temperature safety controller 42 is present in the boiling sump 14
while a high vapor level and safety thermostat 44 is provided at the top
of the condensing coil 18 in the freeboard zone 32. The liquid sump 16 is
further equipped with a cooling coil 46 that can be used to lower the
temperature of the liquid and thus reduce evaporation losses particularly
during periods of not using the equipment.
In contrast to the prior art device depicted in FIG. 1, FIG. 2 illustrates
a two-sump degreaser equipped with additional condenser/heat exchangers
according to the present invention. In describing this particular
embodiment, wherever possible the same number as used in FIG. 1 is
employed in FIG. 2 to identify the identical or equivalent element or
component. Thus, the illustrated embodiment of FIG. 2 includes a tank 10
with a boiling sump 14 and cascaded rinse sump 16 with a primary
condensing coil 18 used to condense vapors 30, thus defining a vapor to
air interface about half way up the cooling coil 18 which in turn defines
the freeboard zone 32. Instead of providing a lid on the otherwise
open-top degreaser, a hood 48 and programmable work transporter 50, as
generally known in the art, is present. The use of such a work transporter
will minimize dragout/workload movement losses by eliminating the human
factor and thus more accurately control the rate needed to minimize
vapor/air disturbances, also as generally known. In a manner analogous to
FIG. 1, the embodiment of FIG. 2 also contains a heater 26 in the boiling
sump 14, an ultrasonic transducer 34 on the rinse sump 16, cooling coils
46 within the rinse sump 16, and a condensate recycle loop involving a
strainer 36, pump 38 and filter 40 external to the rinse sump 16. Also,
the safety controls 42 for monitoring low liquid level and high solvent
temperature in the boiling sump 14 and safety thermostat 44 for monitoring
high vapor level in the freeboard zone 32 are provided.
In addition to the water-chilled primary condensing coil 18, an
intermediate refrigerated cooling coil 52 is located just above the
primary cooling coil 18 with some overlap vertically with the top few
coils of the primary condenser 18. Near the top of the freeboard zone 32
is a third condenser/heat exchanger 54 which is also refrigerant operated
(refrigeration unit not shown). In other words, in addition to the primary
condenser 18 which is typically operated at about 40.degree. to 50.degree.
F. (4.4.degree. to 10.degree. C.), a second heat exchanger 52, to be
operated below 32.degree. F. (0.degree. C.), is present in the lower
region of the freeboard zone 32. It is the temperature of this particular
heat exchanger that will establish the equilibrium vapor pressure of the
volatile solvent in the lower regions of the freeboard zone 32. This is
true independent of the fact that the water-chilled primary coil 18 and
its associated relatively higher temperature essentially determines the
vapor/air interface and furthermore will be the heat exchanger that is
responsible for the bulk of the condensing of the volatile solvent.
Associated with the third condenser/heat exchanger 54 is a condensate
trough 56. Since heat exchanger 54 refrigerated (operates below 32.degree.
F.), any moisture or water vapor associated with the intrusion of air will
tend to preferentially condense on this cooling coil 54 as opposed to
condensing on condensers 52 or 18. Consequently, any frosting and liquid
water condensate from trough 56 will be directed to the water separator or
desiccant dryer 22 via line 58 before being returned to the clean rinse
sump 16. Also, the condensate formed in trough 20 below primary condenser
18 should be relatively free of water and can be returned directly to sump
16 via line 24. Optionally, the condensate from trough 20 could also be
processed through a drying stage if necessary (not shown).
As can be further seen in comparing FIGS. 1 and 2, the freeboard region or
zone for the improved vapor degreaser according to the present invention
is deeper than the conventional freeboard zone. More specifically, the
freeboard/width ratio appropriate for the present invention is preferably
greater than 1.0 and can be as high as about 2.3. Also, the relative
placement of the respective three heat exchangers is viewed as being
critical for vapor condensation and cooling purposes to control and
minimize vapor emissions. The three heat exchangers according to the
present invention are to be operated at, at least, two different
temperatures.
The lower primary heat exchanger is operated at above water freezing
temperature (i.e., greater than 32.degree. F.) to effect the condensation
of the bulk of the vapors generated in the apparatus. Since the
temperature is above 32.degree. F. (preferably 40.degree.-50.degree. F.),
chilled water is the preferred coolant. Consequently, the operating cost
for coolant as well as a capital costs for condensing the bulk of the
vapor is (or can be) minimized, particularly relative to the alternative
of allowing the refrigerated heat exchanger to perform a greater portion
of the required cooling.
The second intermediate condenser/heat exchanger located above the primary
exchanger, but, with preferably some overlap of its bottom cooling
surfaces with the upper cooling surfaces of the primary exchanger, is to
be operated at a temperature below the freezing point of water.
Preferably, the intermediate heat exchanger is operated at about
+10.degree. to -30.degree. F. (-23.degree. to -34.degree. C.). Because of
this lower than normal temperature, a refrigerant must be employed to
desolventize the vapor/air atmosphere. This lower than normal temperature
near the vapor to air interface associated with the lower portion of the
freeboard zone is viewed as being essential in that it is this temperature
that dictates the vapor pressure of the solvent and, hence, the ultimate
lowering of the vapor concentration gradient in the freeboard zone. The
use of primary water chilled exchanger to effect the bulk of the
condensing further conserves the operating and capital costs associated
with the intermediate heat exchanger operation.
The third, upper heat exchanger, located above the other two aforementioned
exchangers, near the top of the degreaser's freeboard zone, with its upper
cooling surfaces located at 1 to 12 inches below the top lip of the
degreaser, is also to be refrigerated and operated at a temperature
preferably within about 5.degree. C. of the temperature of the
intermediate exchanger. As such, the third heat exchanger will
preferentially function as the dehumidifying surface selectively removing
water at the top of the freeboard zone. Of course, the presence of the
cold condensing surface at the top of the freeboard zone as well as at the
bottom (i.e., the intermediate exchanger) also ensures a consistently low
temperature profile throughout the entire freeboard zone. This, in turn,
results in a significant and unexpected reduction in the vapor
concentration gradient that controls the rate of vapor diffusion through
the freeboard zone. The fact that the moisture intrusion into the
freeboard zone is controlled by the upper heat exchanger, enhances the
efficiency of the intermediate exchanger in that frost will not form at
the intermediate exchanger. Also, the frost and water condensate formed at
the upper exchanger means that only the upper exchanger has to be
periodically defrosted and all water entrainment will inherently occur at
a location separate from where the bulk of the refluxing and condensation
of organic vapors is occurring. Thus, the condensate generated by the
lower two cooling coils will be collected in a trough or drip pan located
at an elevation below the bottom surface of the primary heat exchanger.
This condensate, relatively free of moisture can be returned directly to
the degreaser's clean solvent sump.
The following examples are presented to further illustrate specific
embodiments of the present invention. In performing these examples, the
experimental observations and associated data resulted from the use of a
two-sump, open-top vapor degreaser, as generally shown in FIG. 2, with a
top opening 36 inches long and 12 inches wide. The particular degreaser
employed in the examples was equipped with a liquid-cooled tubular
condenser normally cooled with chilled water (i.e., 45.degree. to
50.degree. F.) supplied by a central chilled water circulation system.
Provisions were incorporated into the degreaser for the addition of
stainless steel sheet metal collars at the top of the degreaser to vary
the depth of the freeboard zone and to facilitate the installation of
additional heat exchangers in the freeboard zone. A self-contained
portable chiller was installed to permit coolant to be supplied to the
additional heat exchangers at a temperature ranging from -20.degree. F. to
20.degree. F.
Trichlorofluoromethane, CCl.sub.3 F (CFC-11), was employed as the degreaser
operating fluid (i.e., the volatile solvent/cleaning agent). Since
trichlorofluoromethane is a low boiling point, 74.9.degree. F.
(23.8.degree. C.), chlorofluorocarbon, the results are felt to be
characteristic of similar relatively volatile alternative halocarbon
solvents such as HCFC-123 (boiling point 82.2.degree. F.) and HCFC-141b
(boiling point 89.6.degree. F.). Because of its lower boiling point,
CFC-11 is a more difficult fluid to contain in a vapor degreaser and from
that standpoint is a good test fluid for employment in containment tests.
Conformation of the experimental results associated with CFC-11 has been
carried out with solvent mixtures of HCFC-123 and HCFC-141b containing up
to 2.5 volume percent methanol (proposed solvent candidates for defluxing
and metal cleaning applications).
EXAMPLE 1
Using a two-sump, open-top vapor degreaser as described above and as
essentially illustrated in FIG. 2, a series of three comparative runs were
performed. One run involved the use of the primary condenser only operated
at an average temperature of 47.5.degree. F. The second run involved the
primary condenser operated at an average temperature of 47.6.degree. F.
with the intermediate condenser operating at an average temperature of
1.0.degree. F. In the third run the primary condenser was maintained at
46.3.degree. F., the intermediate condenser was at -0.5.degree. F. and the
third dehumidification coil was operated at -0.1.degree. F. In each run
equilibrium refluxing conditions were established and then samples of the
gaseous atmosphere at various depths of the freeboard zone were collected
in evacuated metal cylinders via a capillary sampling tube. The samples
were then analyzed for their air and solvent vapor content by gas
chromatography. The resulting data are plotted in FIG. 3 of the drawings;
wherein A represents a primary condenser only @ 47.5'F, B represents a
primary condenser @ 47.6'F with secondary condenser overlap @ 1'F, and C
represents a primary condenser @ 46.3'F with secondary condenser overlap @
-0.5'F and dehumidifying coil @ -0.1'F.
From Fick's law of molecular diffusion, it is known that the rate of
degreaser fluid vapor diffusion from the degreaser will be proportional to
the compositional gradient that exists along the diffusional path (the
freeboard depth). Therefore, the areas under the curves labeled A, B and C
are measures of the relative loss rates encountered under the three
conditions of operation. Operation at the conditions of Curve C, which has
the smallest area under it, yields the lowest loss rate. The improvement
in employing the secondary overlapping condenser in conjunction with a
primary condenser operating at a temperature of 45.degree.-55.degree. F.
is represented by the area existing between Curves A and B, and the
further improvement brought about by the addition of the third exchanger
near the top lip of the degreaser is represented by the area existing
between Curves B and C.
From the above data it can be concluded that there is a beneficial
reduction in vapor diffusion associated with the employment of first, a
low temperature overlapping exchanger in combination with a conventional
primary condenser operating at 45.degree.-50.degree. F., and then
subsequently providing a third, low temperature, dehumidifying heat
exchanger near the top lip of the degreaser produced an additional
beneficial reduction in vapor diffusion.
EXAMPLE 2
In a manner analogous to Example 1, a series of two additional runs were
performed and the resulting data are plotted along with one of the
previous runs of Example 1 as FIG. 4 of the drawings. Curve A involves the
primary condenser operating at a temperature of 47.6.degree. F. with the
intermediate condenser overlapping with the primary condenser and being
operated at 1.0.degree. F. Curve A of FIG. 4 is the same as Curve B of
FIG. 3. Curve B of FIG. 4 involves the primary condenser operating at a
temperature of 45.5.degree. F. and the intermediate condenser operating at
-0.8.degree. F. without any overlap of the heat exchangers (i.e., the
intermediate heat exchanger was located immediately above the primary).
Curve C of FIG. 4 involves the primary condenser operating at a
temperature of 46.3.degree. F. and the second (intermediate) heat
exchanger being repositioned only 2.5 to 3 inches below the top lip of the
degreaser and being operated at 1.5.degree. F.
From the above data it can be seen that the physical placement of the
secondary intermediate heat exchanger in reference to the primary
condenser is significant in controlling diffusional losses with some
overlap being particularly preferred.
EXAMPLE 3
In a manner analogous to the previous two examples and using the same
equipment, an additional run was performed with the dehumidifying heat
exchanger positioned 81/4 inches from the top lip of the degreaser. In
this run the primary condenser was operated at 49.2.degree. F. and the
overlapping intermediate condenser was operated at 0.8.degree. F. The
third dehumidifying condenser was maintained at 1.2.degree. F. The results
of this run are plotted as Curve B in FIG. 5. Curve A of FIG. 5 is the
Curve A of FIG. 4 (i.e., Curve B of FIG. 1) representing overlapping
primary and intermediate condensers with no dehumidifying condenser. Curve
C of FIG. 5 is Curve C of FIG. 3 and represents all three condensers in
their optimum relative positioning. As seen from FIG. 5, the proper
physical placement of the upper dehumidifying exchanger in respect to the
overlapping primary and secondary heat exchangers plays a role in
controlling diffusional losses.
The advantages of the present invention are considered numerous and
significant. First and foremost, the equipment necessary to implement the
improved process according to the present invention can be readily
incorporated into virtually any type of conventional vapor degreaser as
generally known in the art and, once incorporated, can be used to minimize
emissions associated with the use of low boiling solvents. As such, the
present invention is particularly useful when employing ozone-depleting
CFC solvents as vapor degreasing solvents as well as the proposed HCFC and
HFC alternative solvent systems. The improved method of the present
invention is viewed as being economical in that by properly selecting the
relative size and position of the respective condenser/heat exchangers
such that most of the organic vapor produced in the boiling sump is cooled
by the first cold water condenser, the overall capital costs and power
cost associated with the low temperature condensers is minimized. The
improved method is viewed as being relatively safe in that it can be
incorporated into existing systems and methods without substantially
changing the equipment or manipulative steps of the conventional process.
And finally, by properly selecting the respective relative positions and
temperatures of the three heat exchangers and in particular the proper use
of the dehumidifying condenser, the loss of organic solvent attributed to
diffusion can be substantially reduced.
It should be appreciated that the multiple-stage heat exchanger concept for
vapor condensation according to the present invention can be readily
incorporated into other vapor degreaser equipment than that illustrated as
generally known in the art without departing from the scope and essence of
the present invention. Furthermore, it is contemplated that various other
elements and stages can be readily included in the embodiments illustrated
again without department from the scope and essence of the present
invention. For example, but not by way of limitation, the simple two-sump,
open-top degreaser illustrated in FIG. 2 can equally be a three-sump or
multiple-sump degreaser as generally known in the art wherein one or more
of a series of cascaded intermediate rinse sumps are positioned between
the primary cleaning agent boiling sump (i.e., the vapor generator) and
the cleaning agent rinse sump (i.e., the condensate reservoir), thus
effecting multiple-stages of cleaning/rinsing with sequentially higher
purity liquid solvent. Also, it is contemplated that a super heated drying
stage/chamber can be incorporated as a final stage again as generally
known in the art, thus facilitating part drying and further eliminating
vapor losses.
The multiple-stage heat exchanger concept of the present invention can also
be incorporated into continuous vapor degreaser equipment and as such the
invention is not limited to batch-wise equipment as illustrated in the
drawing. Thus, the improved three condenser/heat exchangers according to
the present invention can be readily incorporated into the monorail
conveyor system, the meshed belt conveyor system or the cross rod conveyor
system as commercially used in vapor cleaning equipment and processes. In
the case of a belt defluxer with the inlet and exit tunnels at an angle,
so that the diffusion occurs along an inclined path instead of strictly
vertical, preferably the dehumidifying condenser is located up to about 12
inches from the top of the freeboard zone. In such an embodiment the
temperature of the dehumidifying condenser is preferably operated at about
2.degree. to 5.degree. C. higher than the temperature of the intermediated
condenser. As previously mentioned and illustrated, the improvement
according to the present invention can also be used advantageously in
programmed vertical lift systems, in-line lift and indexing systems, as
well as manual open-top batch systems. And, again as previously mentioned,
the improved process of the present invention can be advantageously
employed with other ancillary steps including, but not limited to, the use
of ultrasonics, ancillary solvent drying and/or distillation recovery as
well as solvent extraction or the like.
Having thus described and exemplified the invention with a certain degree
of specificity, it should be appreciated that the following claims are not
to be so limited but are to be afforded a scope commensurate with the
wording of each element of the claims and equivalents thereof.
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