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United States Patent | 5,002,122 |
Sarraf ,   et al. | March 26, 1991 |
A heat transfer surface structure for cooling high power density surfaces and the method of constructing it. The surface includes a sintered capillary layer with a complex configuration of tunnels within it constructed adjacent to the heated surface which is subject to very high power densities. The tunnel arteries serve to supply evaporable liquid and remove vapor to provide the cooling. A unique method of constructing the tunneled sintered layer is also described.
Inventors: | Sarraf; David B. (Elizabethtown, PA); Shaubach; Robert M. (Lititz, PA); Eastman; George Y. (Lancaster, PA) |
Assignee: | Thermacore, Inc. (Lancaster, PA) |
Appl. No.: | 653886 |
Filed: | September 25, 1984 |
Current U.S. Class: | 165/104.26; 165/104.19 |
Intern'l Class: | F28D 015/00 |
Field of Search: | 165/104.26,46,905,10,104.19 501/11 264/56,59,63,332 |
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